Patents by Inventor Xiangjun Wu

Xiangjun Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260346246
    Abstract: Provided are a microfluidic chip and a usage method therefor, a microfluidic system, and a manufacturing method for a conductive cover plate. The chip includes an extraction assembly and an amplification assembly. The extraction assembly includes a lysis chamber, a first valve chamber, washing chambers, and a second valve chamber that sequentially connect with each other. The amplification assembly includes a chip substrate, a barrier layer, and a conductive cover plate. The barrier layer, the chip substrate, and the conductive cover plate form an elution chamber, a liquid path chamber, and an amplification chamber. A side of the conductive cover plate adjacent to the chip substrate is provided with a cavity having an opening at a bottom, and the elution chamber contains the cavity. The cavity has a thickness of 0.6 mm to 2 mm in a thickness direction of the microfluidic chip.
    Type: Application
    Filed: October 11, 2023
    Publication date: November 5, 2026
    Applicant: DIGIFLUIDIC BIOTECH LTD.
    Inventors: Tianlan CHEN, Chenghai LIU, Zheng WU, Xiangjun WU, Meixian LIANG, Kexuan CHENG
  • Patent number: D955154
    Type: Grant
    Filed: September 27, 2020
    Date of Patent: June 21, 2022
    Assignee: HONOR DEVICE CO., LTD.
    Inventors: Xiangjun Wu, Yusheng Liao, Xijie Shen