Patents by Inventor Xianglan Wang

Xianglan Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor
    Patent number: 11917768
    Abstract: A multi-layer circuit board, successively constituted by surface sticking layer, single-layer circuit board, middle sticking layer, single-layer circuit board, surface sticking layer, said multi-layer circuit board is provided with a hole, a hole wall of said hole is formed with conductive seed layer, and partial outer surface of said surface sticking layer is formed with a circuit pattern layer of conductive seed layer, wherein said conductive seed layer comprises a ion implantation layer implanting below the hole wall of said hole and below partial outer surface of said surface sticking layer.
    Type: Grant
    Filed: January 25, 2022
    Date of Patent: February 27, 2024
    Assignee: RICHVIEW ELECTRONICS CO., LTD.
    Inventors: Siping Bai, Xianglan Wu, Zhijian Wang, Zhigang Yang, Jinqiang Zhang
  • Transgenic maize
    Patent number: 9809827
    Abstract: The present invention provides a method of producing transgenic plants which are drought resistant, plants obtainable by the method and uses thereof.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: November 7, 2017
    Assignee: Institute of Botany, The Chinese Academy of Sciences
    Inventors: Feng Qin, Shengxue Liu, Xianglan Wang, Hongwei Wang
  • TRANSGENIC MAIZE
    Publication number: 20160160230
    Abstract: The present invention provides a method of producing transgenic plants which are drought resistant, plants obtainable by the method and uses thereof.
    Type: Application
    Filed: July 18, 2014
    Publication date: June 9, 2016
    Inventors: Feng Qin, Shengxue Liu, Xianglan Wang, Hongwei Wang