Patents by Inventor Xianglin LV

Xianglin LV has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12198946
    Abstract: Embodiments of wet processing systems and methods for uniform wet processing are disclosed. A method described in the present disclosure includes measuring one or more wafer characteristics of a wafer using a plurality of detectors and determining a wafer profile of the wafer based on the measured one or more wafer characteristics. The method also includes setting first and second sets of wet processing parameters of a wet processing system for respective first and second wafer regions based on the wafer profile, where a value of at least one wet processing parameter is different between the first and second sets of wet processing parameters. The method further includes performing wet processing on the wafer by dispensing one or more chemicals onto the first and second wafer regions according to the respective first and second sets of wet processing parameters.
    Type: Grant
    Filed: January 12, 2022
    Date of Patent: January 14, 2025
    Assignee: Yangtze Memory Technologies Co., Ltd.
    Inventors: Gonglian Wu, Yonggang Yang, Xianglin Lv, Rong Xu, Yuping Xia, Kaiyuan Liu, Jun Li, Zhenzhen Zhang, Jingyu Bai
  • Publication number: 20220139732
    Abstract: Embodiments of wet processing systems and methods for uniform wet processing are disclosed. A method described in the present disclosure includes measuring one or more wafer characteristics of a wafer using a plurality of detectors and determining a wafer profile of the wafer based on the measured one or more wafer characteristics. The method also includes setting first and second sets of wet processing parameters of a wet processing system for respective first and second wafer regions based on the wafer profile, where a value of at least one wet processing parameter is different between the first and second sets of wet processing parameters. The method further includes performing wet processing on the wafer by dispensing one or more chemicals onto the first and second wafer regions according to the respective first and second sets of wet processing parameters.
    Type: Application
    Filed: January 12, 2022
    Publication date: May 5, 2022
    Applicant: Yangtze Memory Technologies Co., Ltd.
    Inventors: Gonglian WU, Yonggang YANG, Xianglin LV, Rong XU, Yuping XIA, Kaiyuan LIU, Jun Li, Zhenzhen ZHANG, Jingyu BAI
  • Publication number: 20200243352
    Abstract: Embodiments of wet processing systems and methods for uniform wet processing are disclosed. A method described in the present disclosure includes measuring one or more wafer characteristics of a wafer using a plurality of detectors and determining a wafer profile of the wafer based on the measured one or more wafer characteristics. The method also includes setting first and second sets of wet processing parameters of a wet processing system for respective first and second wafer regions based on the wafer profile, where a value of at least one wet processing parameter is different between the first and second sets of wet processing parameters. The method further includes performing wet processing on the wafer by dispensing one or more chemicals onto the first and second wafer regions according to the respective first and second sets of wet processing parameters.
    Type: Application
    Filed: May 13, 2019
    Publication date: July 30, 2020
    Applicant: Yangtze Memory Technologies Co., Ltd.
    Inventors: Gonglian WU, Yonggang YANG, Xianglin LV, Rong XU, Yuping XIA, Kaiyuan LIU, Jun LI, Zhenzhen ZHANG, Jingyu BAI