Patents by Inventor Xiangling Luo

Xiangling Luo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LED bracket, LED bracket array, LED device and LED display screen
    Patent number: 10378736
    Abstract: An LED bracket, LED bracket array, LED device and LED display screen are disclosed. The LED bracket includes a PCB circuit substrate and an insulating material. The PCB circuit substrate includes at least two electrically insulated electrode regions. Each electrode region includes a top electrode region, a side electrode region and a bottom electrode region. The side electrode region connects the top electrode region and the bottom electrode region into an integrated structure. The side electrode region is a side surface sunk from outside to an inner part of the PCB circuit substrate. The insulating material is filled in the side electrode region. An upper end surface and a lower end surface of the insulating material do not exceed an upper surface and a lower surface of the PCB circuit substrate. A thickness of the insulating material is less than a thickness of the PCB circuit substrate.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: August 13, 2019
    Assignee: Foshan NationStar Optoelectronics Co., Ltd.
    Inventors: Chuanbiao Liu, Feng Gu, Yuanbin Lin, Xiangling Luo, Xiaofeng Liu, Xi Zheng, Yan Liu
  • LED BRACKET, LED BRACKET ARRAY, LED DEVICE AND LED DISPLAY SCREEN
    Publication number: 20180119928
    Abstract: An LED bracket, LED bracket array, LED device and LED display screen are disclosed. The LED bracket includes a PCB circuit substrate and an insulating material. The PCB circuit substrate includes at least two electrically insulated electrode regions. Each electrode region includes a top electrode region, a side electrode region and a bottom electrode region. The side electrode region connects the top electrode region and the bottom electrode region into an integrated structure. The side electrode region is a side surface sunk from outside to an inner part of the PCB circuit substrate. The insulating material is filled in the side electrode region. An upper end surface and a lower end surface of the insulating material do not exceed an upper surface and a lower surface of the PCB circuit substrate. A thickness of the insulating material is less than a thickness of the PCB circuit substrate.
    Type: Application
    Filed: October 31, 2017
    Publication date: May 3, 2018
    Inventors: Chuanbiao Liu, Feng Gu, Yuanbin Lin, Xiangling Luo, Xiaofeng Liu, Xi Zheng, Yan Liu