Patents by Inventor Xianglong Zhu
Xianglong Zhu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220324076Abstract: A combined grinding wheel for ultrasonic machining and the determine method thereof. The combined grinding wheel for ultrasonic machining comprises: an outer grinding ring, an upper end thereof having a center taper hole and a plurality of outer grinding ring water holes located in a circumferential outer side of the center taper hole; a connecting taper shank, the upper end thereof having a taper shank extending into an outer grinding ring cavity from the center taper hole and matching the tapered surface of the center taper hole; a connecting flange, located outside the shank portion and fixed on the inner wall of the upper end of the outer grinding ring cavity, and having a center tapered through hole; and an inner vibration unit, having a tapered surface matching the tapered surface of the center tapered through hole and a center hole connected with the connecting taper shank by means of a screw.Type: ApplicationFiled: August 29, 2019Publication date: October 13, 2022Inventors: Renke KANG, Zhigang DONG, Yidan WANG, Xianglong ZHU, Shang GAO, Yan BAO
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Publication number: 20220088740Abstract: A semiconductor wafer is adhered and fixed to a polishing head by means of a conductive adhesive, and the wafer is connected to a positive electrode of an external power supply through wires of the inner and outer rings of a conductive slip ring below the wafer. A polishing pad is adhered to the bottom of a counter electrode disc, the counter electrode disc is fixed at the bottom of a polishing disc and is processed with through holes at the position corresponding to the polishing disc, and the counter electrode disc is connected to a negative electrode of the external power supply through the wires of inner and outer rings of a conductive slip ring above the counter electrode disc. Ultraviolet light emitted by an ultraviolet light source can reach the surface of the wafer through the through holes, and a polishing solution can be sprayed through the through holes into a contact area between the wafer and the polishing pad.Type: ApplicationFiled: December 13, 2019Publication date: March 24, 2022Inventors: Zhigang DONG, Kang SHI, Renke KANG, Liwei OU, Xianglong ZHU, Shang GAO
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Patent number: 11220018Abstract: The present disclosure discloses an ultrasonic cutting holder for a honeycomb core, including a holder, a swing mechanism, a transducer, a first-stage amplitude transformer, a second-stage amplitude transformer, an ultrasonic cutting tool, and an ultrasonic power transmission mechanism. The present disclosure provides an ultrasonic cutting holder for a honeycomb core with large amplitude output capacity and considering the interchangeability requirements among different vibration systems, which solves the problem of the applicability of ultrasonic cutting holder on the universal machine tool and improves the automation level of ultrasonic cutting.Type: GrantFiled: February 2, 2019Date of Patent: January 11, 2022Assignee: DALIAN UNIVERSITY OF TECHNOLOGYInventors: Renke Kang, Zhigang Dong, Yidan Wang, Xianglong Zhu, Shang Gao, Yan Bao
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Publication number: 20210362248Abstract: Disclosed is a helical milling tool with forward-backward feeding, the tool including a cutting portion, a neck portion and a handle portion, which are successively connected to each other; wherein the cutting portion includes a front-end cutting section, a circumferential cutting section and a back-end cutting section, which are connected successively to each other; the front-end cutting section is of an end milling cutter structure or a drill bit structure; the circumferential cutting section is of a cylindrical shape and is of a circumferential milling cutter structure; and the back-end cutting section is of a frustum-shaped. The tool can avoid defects such as layering and tearing, which go beyond processing requirements in a composite material, improve the processing quality, save on costs, simplify the processing process, improve the production efficiency and prolong the service life of the tool.Type: ApplicationFiled: May 4, 2018Publication date: November 25, 2021Inventors: Zhigang DONG, Renke KANG, Guolin YANG, Xianglong ZHU, Shang GAO, Ping ZHOU, Dongming GUO
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Publication number: 20210354211Abstract: Disclosed is a method for helical milling with forward-backward feeding, including the following steps: determining the aperture D1 of a pre-processing hole; according to a final aperture D of a through-hole to-be-processed and the aperture D1 of the pre-processing hole, selecting a suitable tool; clamping the workpiece to-be-processed and the tool; the tool processes the pre-processing hole with forward feeding with aperture D1, D1<D, until the back-end cutting section of a cutting portion of the tool extends out of an outlet side; adjusting eccentricity of the tool one or more times, backward feeding from the outlet side, and using the back-end cutting section of the cutting portion of the tool to helical mill a through-hole with the aperture D.Type: ApplicationFiled: May 4, 2018Publication date: November 18, 2021Inventors: Renke KANG, Zhigang DONG, Guolin YANG, Xianglong ZHU, Ping ZHOU, Shang GAO, Dongming GUO
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Publication number: 20210268679Abstract: The present disclosure discloses an ultrasonic cutting holder for a honeycomb core, including a holder, a swing mechanism, a transducer, a first-stage amplitude transformer, a second-stage amplitude transformer, an ultrasonic cutting tool, and an ultrasonic power transmission mechanism. The present disclosure provides an ultrasonic cutting holder for a honeycomb core with large amplitude output capacity and considering the interchangeability requirements among different vibration systems, which solves the problem of the applicability of ultrasonic cutting holder on the universal machine tool and improves the automation level of ultrasonic cutting.Type: ApplicationFiled: February 2, 2019Publication date: September 2, 2021Inventors: Renke KANG, Zhigang DONG, Yidan WANG, Xianglong ZHU, Shang GAO, Yan BAO
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Publication number: 20210229188Abstract: Disclosed is an automatic hole-processing method with self-adapting adjustment of processing parameters, including the following steps: performing tool feeding, detecting whether the rotate speed changes or not, if changes, judging the type of the processing material according to the new rotate speed after stabilization (if not, the tool feeding is continued); feeding the tool according to the processing parameters suitable for the material, detecting whether the rotate speed changes or not, if changes, judging whether the hole processing has been completed or not according to the new rotate speed after stabilization (if not, the tool feeding is continued), if completed, retracting the tool with the set parameters (if not, judging the type of the processing material according to the new rotate speed after stabilization, and repeating the above steps), completing the hole processing.Type: ApplicationFiled: March 26, 2021Publication date: July 29, 2021Inventors: Renke KANG, Zhigang DONG, Guolin YANG, Xianglong ZHU, Chao YAN, Yu GAO
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Patent number: 11029286Abstract: An ultrasonic cutter detection method and device, the method comprises the following steps: preliminary detection: frequency amplitude detection and fall-of-potential detection, if the ultrasonic cutter fails the above two detection solutions in the preliminary detection, repeating the two detections; if the ultrasonic cutter still fails the above two detection solutions, the ultrasonic cutter is judged to be unqualified; and reinspection: free modal detection and pressure modal detection. Using differences of the ultrasonic cutters surface in micro-crack directions that result in different degrees of sensitivity of crack to different ultrasonic vibration modes, combined with the fall-of-potential method and frequency amplitude detection method, a detection rate and a detection velocity of an unqualified ultrasonic cutter can be improved.Type: GrantFiled: July 3, 2017Date of Patent: June 8, 2021Assignee: DALIAN UNIVERSITY OF TECHNOLOGYInventors: Renke Kang, Zhigang Dong, Xianglong Zhu, Yidan Wang, Xun Zhang, Ping Zhou, Zhenyuan Jia
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Publication number: 20210031393Abstract: Disclosed is an ultrasonic cutting method employing a straight-blade sharp knife. The ultrasonic cutting method employing the straight-blade sharp knife includes the following steps: S1, measuring parameters of the straight-blade sharp knife; S2, initially rotating, by the straight-blade sharp knife, around an axis thereof, such that a rear knife surface of the straight-blade sharp knife is attached to or is away from a machined surface, and performing ultrasonic vibration cutting on a material according to a machining track; S3, performing quality detection on the machined material surface obtained by the ultrasonic vibration cutting, completing the machining if the surface passes the detection, and performing step S4 if the surface does not pass the detection; S4, further increasing an amount of rotation of the straight-blade sharp knife during initial rotation around the axis thereof, performing the ultrasonic vibration cutting on the material according to the machining track, and performing step S3.Type: ApplicationFiled: February 2, 2019Publication date: February 4, 2021Inventors: Zhigang DONG, Renke KANG, Yidan WANG, Xianglong ZHU, Xuanping WANG, Shang GAO, Zhenyuan JIA
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Patent number: 10852129Abstract: A method for measuring a surface shape of a honeycomb core includes the following steps: coating a reflective film on the surface of the honeycomb core to be measured, using a vacuum adsorption method to adhere the reflective film closely to the surface of the honeycomb core to be measured, and recessing the reflective film at a honeycomb cell downwards; and performing scanning measurement on the reflective film on the surface of the honeycomb core to be measured to obtain the heights of a honeycomb wall of the honeycomb core at different spatial positions. A device carries out the measurement of the surface shape of a honeycomb core.Type: GrantFiled: July 3, 2017Date of Patent: December 1, 2020Assignee: DALIAN UNIVERSITY OF TECHNOLOGYInventors: Renke Kang, Zhigang Dong, Xianglong Zhu, Yan Qin, Yidan Wang
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Publication number: 20200072600Abstract: A method for measuring a surface shape of a honeycomb core includes the following steps: coating a reflective film on the surface of the honeycomb core to be measured, using a vacuum adsorption method to adhere the reflective film closely to the surface of the honeycomb core to be measured, and recessing the reflective film at a honeycomb cell downwards; and performing scanning measurement on the reflective film on the surface of the honeycomb core to be measured to obtain the heights of a honeycomb wall of the honeycomb core at different spatial positions. A device carries out the measurement of the surface shape of a honeycomb core.Type: ApplicationFiled: July 3, 2017Publication date: March 5, 2020Inventors: Renke KANG, Zhigang DONG, Xianglong ZHU, Yan QIN, Yidan WANG
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Publication number: 20190331645Abstract: An ultrasonic cutter detection method and device, the method comprises the following steps: preliminary detection: frequency amplitude detection and fall-of-potential detection, if the ultrasonic cutter fails the above two detection solutions in the preliminary detection, repeating the two detections; if the ultrasonic cutter still fails the above two detection solutions, the ultrasonic cutter is judged to be unqualified; and reinspection: free modal detection and pressure modal detection. Using differences of the ultrasonic cutters surface in micro-crack directions that result in different degrees of sensitivity of crack to different ultrasonic vibration modes, combined with the fall-of-potential method and frequency amplitude detection method, a detection rate and a detection velocity of an unqualified ultrasonic cutter can be improved.Type: ApplicationFiled: July 3, 2017Publication date: October 31, 2019Inventors: Renke KANG, Zhigang DONG, Xianglong ZHU, Yidan WANG, Xun ZHANG, Ping ZHOU, Zhenyuan JIA
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Patent number: 9138855Abstract: A substrate grinding and polishing device comprising separate grinding and polishing units for operating on a work-piece. The work piece is clamped to a rotating work table under the units and a track underneath the rotating work table allows for quick transfer from the grinding unit to the polishing unit or vice versa. This setup allows for easy transfer as well as quick adjustment between different modes of grinding and polishing.Type: GrantFiled: January 19, 2012Date of Patent: September 22, 2015Assignee: Dalian University of Technology School of Mechanical EngineeringInventors: Renke Kang, Xianglong Zhu, Zhigang Dong, Guang Feng, Dongming Guo
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Publication number: 20140106647Abstract: The invention, involving grinding and polishing flat processing and thinning processing of hard and brittle materials such as silicon wafer, sapphire substrate and the glass substrate, belongs to ultra-precision machining technical field and provides a multifunction substrate grinding and polishing device and method for the substrate grinding and polishing, which could be used in the grinding and polishing process of flat substrate such as ceramics, metal and composite materials. The grinding and polishing of substrate are processed in three ways: axial plunge grinding and polishing, radial plunge grinding and polishing and back grinding and polishing of wafer with outer rim. Double-spindle structure consisting of grinding spindle unit and polishing spindle unit is used in the substrate grinding and polishing device where both substrate grinding and polishing can be done. The grinding spindle unit and polishing spindle counterweigh mutually via a traction rope.Type: ApplicationFiled: January 19, 2012Publication date: April 17, 2014Inventors: Renke Kang, Xianglong Zhu, Zhigang Dong, Guang Feng, Dongming Guo