Abstract: A click-to-script service enables developers of big-data job scripts to quickly see the underlying script operations from optimized execution plans. Once a big-data job is received, the disclosed examples compile it and generate tokens that are associated with each operation of the big-data job. These tokens include may include the file name of the job, the line number of the operation, and/or an Abstract Syntax Tree (AST) node for the given operations. An original execution plan is optimized into an optimized execution plan, and the tokens for the original operations of the job script are assigned to the optimized operations of the optimized execution plan. The optimized execution plan is graphically displayed in an interactive manner such that users may view the optimized execution plan and click on its optimized operations to find the original operations of the job script.

Abstract: The present invention relates to a microplastic detection device and method based on a pyrolysis-mass spectrometry technology. The microplastic detection device based on a pyrolysis-mass spectrometry technology provided by the present invention is substantially a sealed gas path device system formed connected via pipelines. The device includes a working gas source, a pyrolysis device, a filter and a mass spectrometer which are connected in sequence. After a microplastic sample is placed into the pyrolysis device, the microplastic sample is decomposed in the pyrolysis device, and pyrolysis products from the microplastic sample driven by a carrier gas of the working gas source enter the mass spectrometer for detection and analysis after being filtered by the filter. Furthermore, the present invention provides a microplastic detection method based on a pyrolysis-mass spectrometry. The present invention is widely applied to the field of a microplastic detection technology.

Abstract: A phenylvinylsilane-divinylbenzene-styrene terpolymer is prepared by copolymerizing 50 parts by weight to 70 parts by weight of phenylvinylsilane, 10 parts by weight to 20 parts by weight of divinylbenzene and 20 parts by weight to 30 parts by weight of styrene, the total amount of phenylvinylsilane, divinylbenzene and styrene being 100 parts by weight, wherein the phenylvinylsilane has a structure of Formula (I) or Formula (II). Moreover, a resin composition includes a phenylvinylsilane-divinylbenzene-styrene terpolymer and a vinyl group-containing polyphenylene ether resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board.

Abstract: A resin composition includes 100 parts by weight of a prepolymer and 100 parts by weight to 250 parts by weight of a spherical silica prepared by vaporized metal combustion, wherein: the prepolymer is prepared by subjecting a reaction mixture to a prepolymerization reaction; the reaction mixture includes a maleimide resin, an amino-modified silicone and cyclohexanone, and relative to a total of 100 parts by weight of the maleimide resin, the amino-modified silicone and the cyclohexanone, the reaction mixture includes 60 parts by weight to 80 parts by weight of the maleimide resin, 15 parts by weight to 30 parts by weight of the amino-modified silicone and 2 parts by weight to 15 parts by weight of the cyclohexanone; the reaction mixture does not include m-aminophenol or p-aminophenol; and the amino-modified silicone has an amino equivalent of 750 g/mol to 2500 g/mol.

Abstract: A resin composition includes 100 parts by weight of a prepolymer and 100 parts by weight to 250 parts by weight of a spherical silica prepared by vaporized metal combustion, wherein: the prepolymer is prepared by subjecting a reaction mixture to a prepolymerization reaction; the reaction mixture includes a maleimide resin, an amino-modified silicone and cyclohexanone, and relative to a total of 100 parts by weight of the maleimide resin, the amino-modified silicone and the cyclohexanone, the reaction mixture includes 60 parts by weight to 80 parts by weight of the maleimide resin, 15 parts by weight to 30 parts by weight of the amino-modified silicone and 2 parts by weight to 15 parts by weight of the cyclohexanone; the reaction mixture does not include m-aminophenol or p-aminophenol; and the amino-modified silicone has an amino equivalent of 750 g/mol to 2500 g/mol.

Abstract: A method may include receiving, at a target, from a server, a command, information to identify data, and access information to perform a data transfer using a memory access protocol, and performing, based on the command, based on the access information, the data transfer between the target and a client using the memory access protocol. The information to identify the data may include an object key, and the object key and the access information may be encoded, at least partially, in an encoded object key. The method may further include sending, based on the data transfer, from the target to the server, a completion. The method may further include sending, based on the completion, from the server to the client, an indication of success. The method may further include reconstructing the data based on the parity data.

Abstract: A continuous production device and method for a silane-modified sealing material are provided. The device includes a twin screw extruder set, a cooling unit, and a static mixing unit; where the twin screw extruder set includes at least two twin screw extruders in series, each of which is provided with at least two inlets and at least one vacuum port, the cooling unit is disposed between last two stages of the twin screw extruders, and an outlet of a last-stage twin screw extruder is connected to the static mixing unit.

Abstract: The present invention belongs to the technical field of resin composite materials, in particular relates to a low dielectric composite material and a laminate and printed circuit board prepared therefrom. The composite material is obtained by adhering a low dielectric resin composition with phosphorus-containing flame retardant onto a substrate; the composition comprises the following components: (A) phosphorus-containing flame retardant; (B) vinyl compound. The phosphorus-containing flame retardant has a structure as shown in formula (I).

Abstract: The invention belongs to the technical field of low dielectric resin compositions, and discloses a low dielectric resin composition with phosphorus-containing flame retardant and a prepreg, resin film, laminate and printed circuit board prepared therefrom. The composition comprises the following components: (A) phosphorus-containing flame retardant; (B) vinyl compound. The phosphorus-containing flame retardant has a structure as shown in formula (I).

Abstract: A multi-layer printed circuit board comprises: a core comprising a core insulation layer and traces formed on two sides of the core insulation layer; a plurality of insulation layers sequentially formed at two sides of the core; and a plurality of trace layers respectively formed between two insulation layers and on the outmost insulation layers; wherein the core insulation layer contains a resin material different from that of the insulation layers, such that the core insulation layer has a warpage characteristic lower than that of the insulation layers.

Abstract: The present invention belongs to the technical field of resin composite materials, in particular relates to a low dielectric composite material and a laminate and printed circuit board prepared therefrom. The composite material is obtained by adhering a low dielectric resin composition with phosphorus-containing flame retardant onto a substrate; the composition comprises the following components: (A) phosphorus-containing flame retardant; (B) vinyl compound. The phosphorus-containing flame retardant has a structure as shown in formula (I).

Abstract: The invention belongs to the technical field of low dielectric resin compositions, and discloses a low dielectric resin composition with phosphorus-containing flame retardant and a prepreg, resin film, laminate and printed circuit board prepared therefrom. The composition comprises the following components: (A) phosphorus-containing flame retardant; (B) vinyl compound. The phosphorus-containing flame retardant has a structure as shown in formula (I).