Abstract: A die-cutting device includes a conveying mechanism configured to convey an electrode plate including uncoated and coated regions connected to each other, a cutting mechanism located on one side of the electrode plate in a thickness direction and configured to cut the uncoated region to form a scrap portion and a tab connected to the coated region, a first limiting member located between the electrode plate and the cutting mechanism in the thickness direction and provided with a cutting hole that allows laser light from the cutting mechanism to pass through and matches a cutting trajectory of the laser light, and a second limiting member located on a side of the electrode plate facing away from the first limiting member in the thickness direction and configured to cooperate with the first limiting member to limit the electrode plate in the thickness direction.

Abstract: The present application provides a measurement device and an electrode plate production system. The measurement device includes an unwinding mechanism, an adjustment mechanism, a measurement mechanism and a winding mechanism. The unwinding mechanism is configured to unwind a material tape. The adjustment mechanism is arranged downstream of the unwinding mechanism and configured to adjust a tensioning force of the material tape so that the material tape forms a tensioned area. The measurement mechanism is configured to measure the size of the tensioned area. The winding mechanism is arranged downstream of the adjustment mechanism and configured to wind up the material tape. The adjustment mechanism of the measurement device can adjust the tensioning force of the material tape and keep the material tape under a preset tensioning force. Measuring results of the measurement device can provide an accurate feedback on the size of the material tape.

Abstract: A die-cutting device includes a conveying mechanism configured to convey an electrode plate including uncoated and coated regions connected to each other, a cutting mechanism located on one side of the electrode plate in a thickness direction and configured to cut the uncoated region to form a scrap portion and a tab connected to the coated region, a first limiting member located between the electrode plate and the cutting mechanism in the thickness direction and provided with a cutting hole that allows laser light from the cutting mechanism to pass through and matches a cutting trajectory of the laser light, and a second limiting member located on a side of the electrode plate facing away from the first limiting member in the thickness direction and configured to cooperate with the first limiting member to limit the electrode plate in the thickness direction.

Abstract: An electrode plate processing device is provided. The electrode plate processing device includes: an electrode plate conveying mechanism configured to convey an electrode plate; a cutting mechanism disposed opposite to the electrode plate and configured to cut the electrode plate to form a tab; and a waste adsorption mechanism disposed downstream of the cutting mechanism along a conveying direction of the electrode plate. The waste adsorption mechanism includes an active driving roller, a driven support roller, and a conveyer belt that is coupled to the active driving roller and the driven support roller in a transmission way. The conveyer belt is driven by the active driving roller to rotate and configured to provide an adsorption force to a waste edge produced during the cutting of the electrode plate so as to adsorb the waste edge.

Abstract: The present disclosure relates to an electrode plate processing device. The electrode plate processing device includes: an electrode plate cutting mechanism having a cutting position; and an electrode plate rolling mechanism, through which an electrode plate passes. The electrode plate rolling mechanism includes a first roller and a second roller. The first roller has a vacuum adsorption zone for adsorbing a waste edge of the electrode plate. The cutting position is provided in upstream of the vacuum adsorption zone along a conveying direction of the electrode plate processing device.

Abstract: The present disclosure relates to an electrode plate processing device. The electrode plate processing device includes: an electrode plate conveying mechanism configured to convey an electrode plate; a cutting mechanism disposed opposite to the electrode plate and configured to cut the electrode plate to form a tab; and a waste adsorption mechanism disposed downstream of the cutting mechanism along a conveying direction of the electrode plate. The waste adsorption mechanism includes an active driving roller, a driven support roller, and a conveyer belt that is coupled to the active driving roller and the driven support roller in a transmission way. The conveyer belt is driven by the active driving roller to rotate and configured to provide an adsorption force to a waste edge produced during the cutting of the electrode plate so as to adsorb the waste edge.

Abstract: The present disclosure relates to an electrode plate processing device. The electrode plate processing device includes: an electrode plate cutting mechanism having a cutting position; and an electrode plate rolling mechanism, through which an electrode plate passes. The electrode plate rolling mechanism includes a first roller and a second roller. The first roller has a vacuum adsorption zone for adsorbing a waste edge of the electrode plate. The cutting position is provided in upstream of the vacuum adsorption zone along a conveying direction of the electrode plate processing device.