Patents by Inventor Xiangrong JIANG

Xiangrong JIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200335246
    Abstract: The invention relates to the technical field of amorphous soft magnetic material, specifically relating to the field of Fe—Co based amorphous soft magnetic alloy and preparation method thereof. The Fe—Co based amorphous soft magnetic alloy provided in the invention has chemical composition of FeaCobSicBdCue, which possesses merits of highly-saturated magnetic induction, outstanding soft magnetic property and great amorphous forming ability at the same time; the embodiment of Fe—Co based amorphous soft magnetic alloy disclosed in the invention has indicated that its saturation magnetic induction is 1.79˜1.86 T, coercivity 1.4˜4.3 A/m, and permeability 8000˜14000; the invention has advantages of easy treatment process, low annealing temperature, which reduces process cost remarkably and economizes energy, thus having great application prospect.
    Type: Application
    Filed: April 17, 2020
    Publication date: October 22, 2020
    Inventors: Baolong Shen, Donghui Li, Xingdu Fan, Qianqian Wang, Mufeng Jiang, Xiangrong Jiang, Xiangyue Wang
  • Publication number: 20190322077
    Abstract: The present disclosure relates to the field of electronic communications, and discloses a housing, a preparation method therefor, and use thereof. The housing includes a metal anodic oxide layer (5) and a resin film layer (3) adhering to a first surface of the metal anodic oxide layer (5). The metal anodic oxide layer (5) and the resin film layer (3) form an integrated structure. The preparation method includes: performing anode oxidization treatment on a metal substrate (1), and then successively performing injection molding and etching.
    Type: Application
    Filed: June 19, 2017
    Publication date: October 24, 2019
    Inventors: Jian SUN, Liang CHEN, Guiwang ZHAO, Shuai ZHU, Xiangrong JIANG
  • Publication number: 20190159352
    Abstract: The present disclosure relates to the field of electronic communications, and discloses a housing, a preparation method therefor, and use thereof. The housing includes a metal hard anodic oxide layer (5) and a resin film layer (3) adhering to a first surface of the metal hard anodic oxide layer (5). The metal hard anodic oxide layer (5) and the resin film layer (3) form an integrated structure. The preparation method includes: performing hard anode oxidization treatment on a metal substrate (1), and then successively performing injection molding and etching.
    Type: Application
    Filed: June 19, 2017
    Publication date: May 23, 2019
    Inventors: Jian SUN, Liang CHEN, Guiwang ZHAO, Yingyuan WU, Xiangrong JIANG, Yunfei ZOU