Patents by Inventor Xiangwu Wang

Xiangwu Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250079778
    Abstract: A male power connector includes a first terminal, a second terminal, a ground terminal and a housing. The housing has a first passage, a second passage and a ground passage. The first passage accommodates the first terminal and has a first opening on an endmost front surface of the housing. The second passage accommodates the second terminal and has a second opening on the endmost front surface. The ground passage accommodates the ground terminal and has a ground opening on the endmost front surface. The ground opening has a main portion accommodating the ground terminal, two lateral extending portions and two notch portions. The lateral extending portions extend outwardly from opposite sides of the main portion. The notch portions respectively extend from a corresponding one of the lateral extending portions in a direction away from the first opening and the second opening.
    Type: Application
    Filed: November 19, 2024
    Publication date: March 6, 2025
    Inventors: Xiangwu WANG, Chubei ZHANG
  • Patent number: 12224518
    Abstract: A female connector and a male connector are disclosed. The female connector includes a ring-shaped outer wall, a first terminal seat, a second terminal seat, and a third terminal seat. The male connector includes a front connecting block. A front end surface of the front connecting block includes a first terminal hole, a second terminal hole, and a third terminal hole. The first terminal hole has a first terminal supporting surface. The second terminal hole has a second terminal supporting surface. The third terminal hole has a third terminal supporting surface.
    Type: Grant
    Filed: July 5, 2022
    Date of Patent: February 11, 2025
    Inventors: Xiangwu Wang, Zhongxiang Wang, Weiming Lin
  • Publication number: 20230011560
    Abstract: A female connector and a male connector are disclosed. The female connector includes a ring-shaped outer wall, a first terminal seat, a second terminal seat, and a third terminal seat. The male connector includes a front connecting block. A front end surface of the front connecting block includes a first terminal hole, a second terminal hole, and a third terminal hole. The first terminal hole has a first terminal supporting surface. The second terminal hole has a second terminal supporting surface. The third terminal hole has a third terminal supporting surface.
    Type: Application
    Filed: July 5, 2022
    Publication date: January 12, 2023
    Inventors: Xiangwu Wang, Zhongxiang Wang, Weiming Lin
  • Patent number: 10043850
    Abstract: An HV-LED module having 3D light-emitting structure and a method for manufacturing the HV-LED module are disclosed. The HV-LED module has at least two stacked parts of substage LEDs that each have an independent light-emitting structure and are bonded in a staggered pattern, and the substage LEDs are connected in series to form the 3D light-emitting structure, thereby significantly increasing light-emitting power per unit area, downsizing a high-voltage chip module using it by nearly two times, and effectively reducing packaging costs for the HV-LED module.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: August 7, 2018
    Assignee: Xiamen Changelight Co., Ltd.
    Inventors: Zhiwei Lin, Kaixuan Chen, Yong Zhang, Xiangjing Zhuo, Wei Jiang, Tianzu Fang, Yinqiao Zhang, Xiangwu Wang
  • Publication number: 20160276402
    Abstract: An HV-LED module having 3D light-emitting structure and a method for manufacturing the HV-LED module are disclosed. The HV-LED module has at least two stacked parts of substage LEDs that each have an independent light-emitting structure and are bonded in a staggered pattern, and the substage LEDs are connected in series to form the 3D light-emitting structure, thereby significantly increasing light-emitting power per unit area, downsizing a high-voltage chip module using it by nearly two times, and effectively reducing packaging costs for the HV-LED module.
    Type: Application
    Filed: March 18, 2016
    Publication date: September 22, 2016
    Inventors: Zhiwei Lin, Kaixuan Chen, Yong Zhang, Xiangjing Zhuo, Wei Jiang, Tianzu Fang, Yinqiao Zhang, Xiangwu Wang
  • Patent number: D1024968
    Type: Grant
    Filed: July 8, 2022
    Date of Patent: April 30, 2024
    Inventors: Xiangwu Wang, Weiming Lin
  • Patent number: D1027860
    Type: Grant
    Filed: January 6, 2022
    Date of Patent: May 21, 2024
    Inventors: Xiangwu Wang, Zhongxiang Wang
  • Patent number: D1027861
    Type: Grant
    Filed: July 8, 2022
    Date of Patent: May 21, 2024
    Inventors: Xiangwu Wang, Weiming Lin
  • Patent number: D1030673
    Type: Grant
    Filed: March 11, 2022
    Date of Patent: June 11, 2024
    Inventors: Xiangwu Wang, Zhongxiang Wang