Patents by Inventor Xiangxuan Tan

Xiangxuan Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power module and heat sink system
    Patent number: 11974387
    Abstract: Provided are a power module and a heat sink system. The power module includes a first circuit board, a second circuit board, at least one discrete component and an encapsulation body. One discrete component includes a lead frame and at least one chip, the lead frame is disposed between the first circuit board and the second circuit board, the lead frame includes two end faces and multiple mounting lateral surfaces connected in sequence, an angle is formed between one end face and one mounting lateral surface, one of the two end faces is electrically connected to the first circuit board and the other of the two end faces is electrically connected to the second circuit board, and the chip is disposed on each of the multiple mounting lateral surfaces. The encapsulation body is configured to pot a space between the first circuit board and the second circuit board.
    Type: Grant
    Filed: July 19, 2022
    Date of Patent: April 30, 2024
    Assignee: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.
    Inventors: Nianbin Cheng, Cheng Li, Lifang Liang, Yikai Yuan, Honggui Zhan, Xiangxuan Tan
  • DISCRETE COMPONENT, POWER MODULE AND HEAT SINK SYSTEM
    Publication number: 20230245945
    Abstract: Provided are a discrete component, a power module and a heat sink system. The discrete component includes a lead frame and a chip. The lead frame includes a top and a bottom disposed adjacent to each other. The top includes a support surface and multiple lateral surfaces connected in sequence. The multiple lateral surfaces are located between the support surface and the bottom. The chip is disposed on each of at least one lateral surface of the multiple lateral surfaces separately. The top of the lead frame is configured to be a metal structure.
    Type: Application
    Filed: July 22, 2022
    Publication date: August 3, 2023
    Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.
    Inventors: Nianbin Cheng, Cheng Li, Lifang Liang, Yikai Yuan, Honggui Zhan, Xiangxuan Tan
  • POWER MODULE AND HEAT SINK SYSTEM
    Publication number: 20230217580
    Abstract: Provided are a power module and a heat sink system. The power module includes a first circuit board, a second circuit board, at least one discrete component and an encapsulation body. One discrete component includes a lead frame and at least one chip, the lead frame is disposed between the first circuit board and the second circuit board, the lead frame includes two end faces and multiple mounting lateral surfaces connected in sequence, an angle is formed between one end face and one mounting lateral surface, one of the two end faces is electrically connected to the first circuit board and the other of the two end faces is electrically connected to the second circuit board, and the chip is disposed on each of the multiple mounting lateral surfaces. The encapsulation body is configured to pot a space between the first circuit board and the second circuit board.
    Type: Application
    Filed: July 19, 2022
    Publication date: July 6, 2023
    Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.
    Inventors: Nianbin Cheng, Cheng Li, Lifang Liang, Yikai Yuan, Honggui Zhan, Xiangxuan Tan