Abstract: A Christmas LED bulb manufacturing process includes: taking a conductive wire: taking a conductive wire with a preset length, the conductive wire being a Dumet wire or a platinum wire; removing impurities: removing foreign matters and impurities on a surface of the conductive wire; welding a chip: welding and fixing a LED chip to the conductive wire after impurity removal; sealing: after the chip is welded, injecting one of silica gel, resin and silica gel, or a mixture of resin and a high thermal conductivity material into the LED chip to wrap the LED chip; assembling: inserting the sealed LED chip into a glass tube; and performing glass-sealing: melting two ends of the glass tube for sealing and molding.

Abstract: A Christmas LED bulb manufacturing process includes: taking a conductive wire: taking a conductive wire with a preset length, the conductive wire being a Dumet wire or a platinum wire; removing impurities: removing foreign matters and impurities on a surface of the conductive wire; welding a chip: welding and fixing a LED chip to the conductive wire after impurity removal; sealing: after the chip is welded, injecting one of silica gel, resin and silica gel, or a mixture of resin and a high thermal conductivity material into the LED chip to wrap the LED chip; assembling: inserting the sealed LED chip into a glass tube; and performing glass-sealing: melting two ends of the glass tube for sealing and molding.

Abstract: Integrated circuit devices, methods, and circuitry are provided for performing timing analysis for chip-to-chip connections between integrated circuits in a multichip package. A system may include an integrated circuit package and a computing system. The integrated circuit package may have a first integrated circuit connected to a second integrated circuit via a chip-to-chip connection. The chip-to-chip connection may also be connected to a package ball. The computing system may perform timing analysis on a circuit design for the first integrated circuit with respect the chip-to-chip connection based on user-specified parasitic data relating to the connection to the package ball.

Abstract: An integrated circuit with programmable logic circuitry is provided. The integrated circuit may include quiet regions, toggling regions, or unused regions. An integrated circuit may also include heavily-used metal routing paths, lightly-used metal routing paths, and unused metal routing paths. Circuit design tools may be used to generate multiple configuration images that replace the quiet regions with toggling or unused regions, that swap the heavily-used metal routing paths with lightly-used or unused metal routing paths, or that use random fitter seeds of improve the usage coverage to statistically reduce the always quiet regions on the integrated circuit. The multiple configuration images implement the same design and can be used to reconfigure the integrated circuit upon startup to reduce aging effects and improve circuit performance.

Abstract: An integrated circuit with programmable logic circuitry is provided. The integrated circuit may include quiet regions, toggling regions, or unused regions. An integrated circuit may also include heavily-used metal routing paths, lightly-used metal routing paths, and unused metal routing paths. Circuit design tools may be used to generate multiple configuration images that replace the quiet regions with toggling or unused regions, that swap the heavily-used metal routing paths with lightly-used or unused metal routing paths, or that use random fitter seeds of improve the usage coverage to statistically reduce the always quiet regions on the integrated circuit. The multiple configuration images implement the same design and can be used to reconfigure the integrated circuit upon startup to reduce aging effects and improve circuit performance.

Abstract: An integrated circuit with programmable logic circuitry is provided. The integrated circuit may include quiet regions, toggling regions, or unused regions. An integrated circuit may also include heavily-used metal routing paths, lightly-used metal routing paths, and unused metal routing paths. Circuit design tools may be used to generate multiple configuration images that replace the quiet regions with toggling or unused regions, that swap the heavily-used metal routing paths with lightly-used or unused metal routing paths, or that use random fitter seeds of improve the usage coverage to statistically reduce the always quiet regions on the integrated circuit. The multiple configuration images implement the same design and can be used to reconfigure the integrated circuit upon startup to reduce aging effects and improve circuit performance.

Abstract: Systems and methods are provided for data extraction based on model-view-controller (MVC). For example, a data extraction request of a control layer object is acquired; network address parameters and a data carrier object corresponding to the data extraction request are acquired; a network data capturing function of the data carrier object is called based on at least information associated with the network address parameters to capture network data; the captured network data is analyzed based on at least information associated with the data carrier object; value assignment is performed on the data carrier object based on at least information associated with the analysis of the network data; and the data carrier object is returned to the control layer object corresponding to the data extraction request.

Abstract: A method and associated computer program product is provided for determining placement of I/O pins on an integrated circuit device. In an exemplary embodiment, a set of pins to be placed is partitioned into pin groups prior to placing individual pins. After partitioning the pins into pin groups, pin groups may, in a preferred embodiment, be ranked according to difficulty of placement. Pins in the most difficult group are placed first by applying a method that, in a preferred embodiment, places pins within the limits imposed by current density requirements while achieving high pin density within those limits when pad resources are relatively limited.