Abstract: A phase shifter and a method for operating the same, an antenna and a communication device are provided. The phase shifter includes: a first substrate and a second substrate opposite to each other; a dielectric layer between the first substrate and the second substrate; a first electrode on a side of the first substrate proximal to the second substrate; a second electrode on a side of the second substrate proximal to the first substrate; and a ground electrode on a side of the second substrate distal to the first substrate. The dielectric layer includes liquid crystal molecules, and the first electrode and the second electrode are configured to control rotation of the liquid crystal molecules according to different voltages respectively received by the first electrode and the second electrode. The second electrode has a one-piece structure.

Abstract: An amplifying circuit and a rectifying antenna are provided. The amplifying circuit includes: a first rectifying circuit (20), configured to output a first direct current signal according to an alternating current signal; a second rectifying circuit (30), configured to output a second direct current signal according to the alternating current signal; a differential amplifying circuit (40), configured to receive the first direct current signal and the second direct current signal, amplify a difference between the first direct current signal and the second direct current signal, and output an amplified difference between the first direction current signal and the second direct current, the first direct current signal and the second direct current signal have directions opposite to each other. The amplifying circuit can improve sensitivity of an antenna with relatively low costs.

Abstract: An optical module includes a housing, and a main circuit board, an optical transmitting assembly, an optical receiving assembly, and an electrical connector that are disposed inside the housing. The optical transmitting assembly includes at least two sets of lasers, a transmitting-end optical assembly, and a transmitting-end optical fiber receptacle. The optical receiving assembly includes at least two sets of photoelectric detectors, a receiving-end optical assembly, and a receiving-end optical fiber receptacle. The electrical connector electrically connects the optical transmitting assembly and the optical receiving assembly to the main circuit board.

Abstract: An optical module includes a housing, and a main circuit board, an optical transmitting assembly, an optical receiving assembly, and an electrical connector that are disposed inside the housing. The optical transmitting assembly includes at least two sets of lasers, a transmitting-end optical assembly, and a transmitting-end optical fiber receptacle. The optical receiving assembly includes at least two sets of photoelectric detectors, a receiving-end optical assembly, and a receiving-end optical fiber receptacle. The electrical connector electrically connects the optical transmitting assembly and the optical receiving assembly to the main circuit board.

Abstract: An optical module includes a housing, and a main circuit board, an optical transmitting assembly, an optical receiving assembly, and an electrical connector that are disposed inside the housing. The optical transmitting assembly includes at least two sets of lasers, a transmitting-end optical assembly, and a transmitting-end optical fiber receptacle. The optical receiving assembly includes at least two sets of photoelectric detectors, a receiving-end optical assembly, and a receiving-end optical fiber receptacle. The electrical connector electrically connects the optical transmitting assembly and the optical receiving assembly to the main circuit board.

Abstract: A hybrid carrier board and a manufacturing method, an assembly, and an optical module thereof. The hybrid carrier board includes a PCB and a package substrate bonded to the PCB, the package substrate and the PCB being electrically connected. A surface of the package substrate is partially exposed outside of the PCB to form a packaging area adapted for bare die installation.

Abstract: An optical module includes a housing, and a main circuit board, an optical transmitting assembly, an optical receiving assembly, and an electrical connector that are disposed inside the housing. Each one of the optical transmitting assembly and optical receiving assembly includes at least two sets of optoelectronic chips, an optical assembly, and an optical fiber receptacle. The electrical connector electrically connects the optical transmitting assembly and/or optical receiving assembly to the main circuit board.

Abstract: An optical module includes a housing, and a main circuit board, an optical transmitting assembly, an optical receiving assembly, and an electrical connector that are disposed inside the housing. Each one of the optical transmitting assembly and optical receiving assembly includes at least two sets of optoelectronic chips, an optical assembly, and an optical fiber receptacle. The electrical connector electrically connects the optical transmitting assembly and/or optical receiving assembly to the main circuit board.

Abstract: An optical module includes a housing, and a main circuit board, an optical transmitting assembly, an optical receiving assembly, and an electrical connector that are disposed inside the housing. The optical transmitting assembly includes at least two sets of lasers, a transmitting-end optical assembly, and a transmitting-end optical fiber receptacle. The optical receiving assembly includes at least two sets of photoelectric detectors, a receiving-end optical assembly, and a receiving-end optical fiber receptacle. The electrical connector electrically connects the optical transmitting assembly and the optical receiving assembly to the main circuit board.

Abstract: An avalanche photodiode (APD) bias control method may include acquiring a photocurrent intensity voltage and generating a control signal by superposing the acquired photocurrent intensity voltage and a bias setting signal, wherein the control signal controls a voltage drop between an adjustable power supply output voltage and a voltage of the APD. The APB bias control method may further include adjusting the adjustable power supply output voltage and the bias setting signal simultaneously so that the voltage drop is within a target voltage drop range and the APD bias voltage approaches a bias voltage that corresponds to an APD optical input power. An avalanche photodiode (APD) bias controller and an avalanche photodiode (APD) photoelectric receiver are also provided.

Abstract: An optical module may include a case, an optical assembly, a circuit board interface positioned on the case, and a circuit board attached to the case through the circuit board interface. The optical assembly may be arranged in the case. The circuit board may include a first area that may electrically connect the circuit board to the optical assembly. The circuit board may also include a second area that may secure the circuit board to the circuit board interface. An optical module manufacturing method is also provided.

Abstract: An optical module includes an optical fiber connector, a transmitter optical component, a receiver optical component and a printed circuit board arranged within an optical module housing; the transmitter optical component and the receiver optical component are optically coupled to the optical fiber connector, and electrically connected to the printed circuit board which is arranged horizontally within the optical module housing. The transmitter optical component and the receiver optical component are stacked in a direction perpendicular to the printed circuit board. Stacking the transmitter optical component and the receiver optical component makes use of the width of the optical module by improving design flexibility of the optical path and the electric circuit, reducing or even substantially eliminating crosstalk between the high-speed devices and high-speed signals, and improving the heat dissipation effect of the optical module.

Abstract: A laser driver for a laser, which includes an adjustable DC-DC power source, an optical power control loop, and a power source voltage regulator. The adjustable DC-DC power source is coupled to the optical power control loop and the power source voltage regulator, in order to provide a working current for the laser. The optical power control loop is configured to adjust the output optical power of the laser to a set value for optical power by adjusting a working voltage of the laser, and to generate a power source voltage state indicator voltage. The power source voltage regulator is used to generate the power source setting voltage, so that the power source voltage state indicator voltage is greater than or equal to a first preset threshold, or less than or equal to a second preset threshold.

Abstract: A laser driver for a laser, which includes an adjustable DC-DC power source, an optical power control loop, and a power source voltage regulator. The adjustable DC-DC power source is coupled to the optical power control loop and the power source voltage regulator, in order to provide a working current for the laser. The optical power control loop is configured to adjust the output optical power of the laser to a set value for optical power by adjusting a working voltage of the laser, and to generate a power source voltage state indicator voltage. The power source voltage regulator is used to generate the power source setting voltage, so that the power source voltage state indicator voltage is greater than or equal to a first preset threshold, or less than or equal to a second preset threshold.

Abstract: An optical transceiver module includes a first flexible circuit board and a second flexible circuit board; a light receiving unit and a light transmitting unit disposed on the first flexible circuit board and the second flexible circuit board, respectively; a printed circuit board connected to the first flexible circuit board and the second flexible circuit board, and including a connecting point; and a signal processing unit disposed on at least one of the first flexible circuit board, the second flexible circuit board, and the printed circuit board. The signal processing unit processes optical signals received by the light receiving unit and transmits the signals to the connecting point of the printed circuit board, and processes electrical signals transmitted from the connecting point of the printed circuit board and transmits the signals out through the light transmitting unit.

Abstract: This disclosure provides an optical assembly, comprising a base body and a wave filtering apparatus. A first slot is disposed on an upper surface of the base body. A total internal reflection surface and a connecting part are formed in the first slot. The total internal reflection surface reflects collimated light formed by a first lens from a light emitting apparatus. The wave filtering apparatus comprises a first part removably connected to the connecting portion, and a second portion forming a beam splitting surface. The wave filtering apparatus has a light-pervious optical coating at least on the beam splitting surface of the apparatus, and is configured to split the collimated light reflected from the total internal reflection surface into a first beam and a second beam. The first beam travels towards the side where the third lens is located, and the second beam travels towards a photoelectric detection apparatus.

Abstract: An optical module may include a case, an optical assembly, a circuit board interface positioned on the case, and a circuit board attached to the case through the circuit board interface. The optical assembly may be arranged in the case. The circuit board may include a first area that may electrically connect the circuit board to the optical assembly. The circuit board may also include a second area that may secure the circuit board to the circuit board interface. An optical module manufacturing method is also provided.

Abstract: An avalanche photodiode (APD) bias control method may include acquiring a photocurrent intensity voltage and generating a control signal by superposing the acquired photocurrent intensity voltage and a bias setting signal, wherein the control signal controls a voltage drop between an adjustable power supply output voltage and a voltage of the APD. The APB bias control method may further include adjusting the adjustable power supply output voltage and the bias setting signal simultaneously so that the voltage drop is within a target voltage drop range and the APD bias voltage approaches a bias voltage that corresponds to an APD optical input power. An avalanche photodiode (APD) bias controller and an avalanche photodiode (APD) photoelectric receiver are also provided.

Abstract: An optical module includes an optical fiber connector, a transmitter optical component, a receiver optical component and a printed circuit board arranged within an optical module housing; the transmitter optical component and the receiver optical component are optically coupled to the optical fiber connector, and electrically connected to the printed circuit board which is arranged horizontally within the optical module housing. The transmitter optical component and the receiver optical component are stacked in a direction perpendicular to the printed circuit board. Stacking the transmitter optical component and the receiver optical component makes use of the width of the optical module by improving design flexibility of the optical path and the electric circuit, reducing or even substantially eliminating crosstalk between the high-speed devices and high-speed signals, and improving the heat dissipation effect of the optical module.

Abstract: A packaging structure and an optical module using the same are disclosed, wherein said packaging structure includes: a printed circuit board, having a first surface and a second surface opposite to each other; a heat dissipation hole running through the first and second surfaces of the printed circuit board; a heat dissipation block fixed within the heat dissipation hole; a power device provided on the first surface of the printed circuit board, wherein the power device is in a thermal conductive connection with the heat dissipation block. No adhesive or other dielectric of low heat conductivity coefficient is necessary during the manufacturing process of the heat dissipation block. The heat dissipation hole can open wider, as the fixation of copper paste and the heat dissipation hole are not a concern. Therefore, the heat dissipation ability of the packaging structure is optimized and the stable operation of the device is ensured.