Patents by Inventor Xianhe Wei

Xianhe Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240288742
    Abstract: An electro-optic display includes a backplane with at least one electrode, a layer of an electro-optic material disposed adjacent to the backplane, and a light-transmissive electrically-conductive layer disposed on the opposite side of the layer of electro-optic material from the backplane. The electro-optic display also includes a rod member disposed laterally adjacent to the backplane, the electro-optic material, and the light-transmissive electrically-conductive layer. A first barrier layer is disposed adjacent to the light-transmissive electrically-conductive layer and a first side of the rod member, and a second barrier is layer disposed on the backplane and a second side of the rod member. The second side is the opposite side of the rod member from the first side. A flexible barrier tape extends from an edge portion of the first barrier layer, around the rod member, to an edge portion of the second barrier layer.
    Type: Application
    Filed: February 23, 2023
    Publication date: August 29, 2024
    Inventors: George G. HARRIS, Richard J. PAOLINI, JR., David Victor MARCOLIN, Xianhe WEI, Shyamala SUBRAMANIAN
  • Patent number: 10867830
    Abstract: Embodiments in accordance with the present invention are directed to a method of fabricating a semiconductor device wherein a device wafer substrate is coated with a composition encompassing a surface energy modifier and a thermally stable polymer which is then bonded to a carrier wafer substrate coated with a composition encompassing a crosslinkable polymer composition. The polymer composition allows thinning of a device wafer before separating from the carrier wafer at room temperature.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: December 15, 2020
    Assignee: PROMERUS, LLC
    Inventors: Venkat R. Dukkipati, Xianhe Wei, Larry F. Rhodes
  • Patent number: 10141216
    Abstract: Embodiments in accordance with the present invention are directed to a method of fabricating a semiconductor device wherein a device wafer substrate is coated with a composition encompassing a surface energy modifier and a thermally stable polymer which is then bonded to a carrier wafer substrate coated with a composition encompassing a crosslinkable polymer composition. The polymer composition allows thinning of a device wafer before separating from the carrier wafer at room temperature.
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: November 27, 2018
    Assignee: PROMERUS, LLC
    Inventors: Venkat R. Dukkipati, Xianhe Wei, Larry F. Rhodes
  • Publication number: 20170003499
    Abstract: This disclosure provides devices and methods of reducing stiction during a fluid-filling process. A device can include two substrates with movable MEMS components on at least one of the substrates. The device can include a fluid between the two substrates and surrounding or at least partially surrounding the movable MEMS components, where the fluid can serve as a lubricant for the movable MEMS components. The fluid can be a liquid solution doped with a surface energy modifier, where the surface energy modifier includes a nonpolar functional group R. In some implementations, the nonpolar functional group R can be selected from the group consisting of: alkyl, aryl and naphthenic.
    Type: Application
    Filed: July 2, 2015
    Publication date: January 5, 2017
    Inventors: Ji Ma, Xianhe Wei, Eugene Fike, III, Tyler Dunn
  • Publication number: 20160093070
    Abstract: This disclosure provides systems, methods and apparatus for packaging a display device, such as an electromechanical systems (EMS) device, with a seal. In one aspect, the display device includes a seal or sealant surrounding a display region of the display device in contact with and between two substrates. The sealant can include an epoxy matrix with a plurality of first spacers and a plurality of second spacers. In some implementations, the first spacers can be about the same size and define a substrate-to-substrate gap between the two substrates. In some implementations, each of the second spacers can be smaller than the first spacers, where the second spacers have a water vapor transmission rate less than the epoxy.
    Type: Application
    Filed: September 26, 2014
    Publication date: March 31, 2016
    Inventors: Ji Ma, Xianhe Wei, Eugene Fike