Patents by Inventor Xianlei Bi

Xianlei Bi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240147602
    Abstract: A circuit board module relates to the field of touch technologies. The above circuit board module includes a touch chip, a first circuit board, a second circuit board and at least one conductive connection portion. The touch chip includes at least one ground pin and a plurality of signal pins. The first circuit board includes a first ground portion and a plurality of signal pads; the signal pads are electrically connected to the signal pins; the first ground is electrically connected to the at least one ground pin. The second circuit board includes a second ground portion. The at least one conductive connection portion is electrically connected to the first ground portion and the second ground portion.
    Type: Application
    Filed: March 19, 2021
    Publication date: May 2, 2024
    Inventors: Xianfeng YANG, Xianlei BI, Chuanyan LAN, Qian MA
  • Publication number: 20230209704
    Abstract: A flexible printed circuit includes a substrate, a first conductive layer, and a first protective layer. The substrate has a body region, a first bonding region, and a connection region located between the body region and the first bonding region. The first conductive layer is located on a first side of the substrate, and extends from the body region to the first bonding region via the connection region. The first protective layer is located on a side of the first conductive layer away from the substrate, and extends from the body region to the connection region. The first protective layer partially covers the connection region.
    Type: Application
    Filed: November 8, 2021
    Publication date: June 29, 2023
    Applicants: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Xianlei BI, Xun YAO, Jianjun WU, Chuanyan LAN, Qian MA
  • Publication number: 20230180448
    Abstract: A circuit board assembly includes a connection circuit board, a near field communication antenna and solders. The connection circuit board includes circuit board pads. The near field communication antenna is attached to the connection circuit board, and the near field communication antenna includes: an antenna coil, antenna pads electrically connected to the antenna coil, and through holes penetrating the antenna pads and disposed opposite to the circuit board pads. The solders are connected to the circuit board pads through the through holes.
    Type: Application
    Filed: October 11, 2021
    Publication date: June 8, 2023
    Applicants: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Fengxian WANG, Chuanyan LAN, Qiang TANG, Xianlei BI
  • Patent number: 11588123
    Abstract: The present disclosure discloses a protective film, a display module, a display assembly, a method for preparing the display assembly and a display device. The protective film is configured to be attached to a surface on a display side of the flexible display substrate before a mother set is cut. The protective film includes a base material layer, a first adhesive layer and a second adhesive layer, wherein the first adhesive layer is located on the side, facing the flexible display substrate, of the base material layer; the viscosity of the first adhesive layer is 0.5 gf/inch to 1.5 gf/inch; the second adhesive layer is located on the side, facing the flexible display substrate, of the base material layer, is independently arranged relative to the first adhesive layer; and the viscosity of the second adhesive layer is 3 gf/inch to 4 gf/inch.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: February 21, 2023
    Assignees: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Fengxian Wang, Wen Huang, Xianlei Bi
  • Publication number: 20220206538
    Abstract: Provided is a flexible display structure, including a reinforcing strip, and a flexible display panel and a supporting layer that are laminated. The flexible display panel is provided with a first surface and a second surface opposite to each other, and a first side surface connecting the first surface and the second surface, and the reinforcing strip is disposed on the first side surface and configured to adhere the flexible display panel to the supporting layer.
    Type: Application
    Filed: March 10, 2021
    Publication date: June 30, 2022
    Inventors: Shaokui Liu, Wei Qing, Qiang Tang, Zhihui Wang, Xingguo Liu, Xianlei Bi