Patents by Inventor Xianlei Yang

Xianlei Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240147602
    Abstract: A circuit board module relates to the field of touch technologies. The above circuit board module includes a touch chip, a first circuit board, a second circuit board and at least one conductive connection portion. The touch chip includes at least one ground pin and a plurality of signal pins. The first circuit board includes a first ground portion and a plurality of signal pads; the signal pads are electrically connected to the signal pins; the first ground is electrically connected to the at least one ground pin. The second circuit board includes a second ground portion. The at least one conductive connection portion is electrically connected to the first ground portion and the second ground portion.
    Type: Application
    Filed: March 19, 2021
    Publication date: May 2, 2024
    Inventors: Xianfeng YANG, Xianlei BI, Chuanyan LAN, Qian MA
  • Patent number: D1017531
    Type: Grant
    Filed: July 12, 2022
    Date of Patent: March 12, 2024
    Assignee: Hixon (Shenzhen) Technology Limited
    Inventors: Xiong Li, Xianlei Yang, Jun Liang
  • Patent number: D1019539
    Type: Grant
    Filed: July 12, 2022
    Date of Patent: March 26, 2024
    Assignee: Hixon (Shenzhen) Technology Limited
    Inventors: Xiong Li, Xianlei Yang, Jun Liang
  • Patent number: D1019540
    Type: Grant
    Filed: July 12, 2022
    Date of Patent: March 26, 2024
    Assignee: Hixon (Shenzhen) Technology Limited
    Inventors: Xiong Li, Xianlei Yang, Jun Liang