Patents by Inventor XianMan Zhang

XianMan Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Diene/dienophile couples and thermosetting resin compositions having reworkability
    Patent number: 10472548
    Abstract: Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: November 12, 2019
    Assignee: Henkel IP & Holding GmbH
    Inventors: Timothy M. Champagne, Laxmisha M. Sridhar, Jonathan B. Israel, Philip T. Klemarczyk, XianMan Zhang, Benny E. Jordan
  • DIENE/DIENOPHILE COUPLES AND THERMOSETTING RESIN COMPOSITIONS HAVING REWORKABILITY
    Publication number: 20180155588
    Abstract: Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.
    Type: Application
    Filed: October 27, 2017
    Publication date: June 7, 2018
    Inventors: Timothy M. Champagne, Laxmisha M. Sridhar, Jonathan B. Israel, Philip T. Klemarczyk, XianMan Zhang, Benny E. Jordan
  • Diene/dienophile couples and thermosetting resin compositions having reworkability
    Patent number: 9938437
    Abstract: Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.
    Type: Grant
    Filed: September 18, 2015
    Date of Patent: April 10, 2018
    Assignee: Henkel IP & Holding GmbH
    Inventors: Timothy M. Champagne, Laxmisha M. Sridhar, Jonathan B. Israel, Philip T. Klemarczyk, XianMan Zhang, Benny E. Jordan
  • DIENE/DIENOPHILE COUPLES AND THERMOSETTING RESIN COMPOSITIONS HAVING REWORKABILITY
    Publication number: 20160002510
    Abstract: Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.
    Type: Application
    Filed: September 18, 2015
    Publication date: January 7, 2016
    Inventors: Timothy M. Champagne, Laxmisha M. Sridhar, Jonathan B. Israel, Philip T. Klemarczyk, XianMan Zhang, Benny E. Jordan