Abstract: Disclosed is a substrate manufacturing method for realizing three-dimensional packaging, which includes: preparing a base plate, the base plate including a dielectric material layer, a first sidewall pad, a first through-hole pillar and a cavity, the cavity being filled with a first metal block; processing a first circuit layer and a second circuit layer, the first circuit layer including a first padding plate and a second metal block, and the second circuit layer including a second padding plate and a plurality of pin pads; processing and laminating interlayer through-hole pillars; processing a third circuit layer and a fourth circuit layer, the third circuit layer including a second sidewall pad and the fourth circuit layer including a routing circuit; and etching to expose the first sidewall pad, the second sidewall pad and the pin pads.

Abstract: A packaged cavity structure includes an embedded packaging frame having a first cavity and a first conductive post respectively penetrating an insulation layer in a height direction, a chipset within the first cavity, a first circuit layer on an upper surface of the embedded packaging frame, a first dielectric layer on the first circuit layer, a second circuit layer on the first dielectric layer, a through-hole penetrating the first dielectric layer and the insulation layer, a third circuit layer on a lower surface of the embedded packaging frame, a support post enclosure on the third circuit layer, and a packaging layer formed along the outside of the support post enclosure. A second cavity communicating with the through-hole is formed between the packaging layer and the lower surface of the embedded packaging frame, and the chipset includes a first chip and a second chip provided in a back-to-back stack.

Abstract: A semiconductor package structure and a manufacturing method therefor are disclosed. The semiconductor package structure includes a package layer, a first device layer, a first insulation layer, a conductive copper pillar, and a second device layer. The package layer covers the first device layer. The first device layer, the first insulation layer, and the second device layer are sequentially stacked. The conductive copper pillar extends through the first insulation layer. The first device layer and the second device layer are electrically connected through the conductive copper pillar. The first device layer includes a first circuit layer, a trench, and an embedded device. The embedded device is connected to the first circuit layer. The trench is arranged below the embedded device. The trench is partially or completely overlapped with a projection of the embedded device in a mounting direction of the embedded device.

Abstract: Disclosed is a manufacturing method for an embedded structure. The method includes: preparing a temporary carrier board; preparing a second circuit layer on at least one of the upper surface and the lower surface of the temporary carrier board, and preparing a first dielectric layer to cover the second circuit layer; patterning and curing the first dielectric layer to form a cavity, mounting a device in the cavity, and performing hot-curing, wherein a surface of the device provided with a terminal faces an opening of the cavity; and preparing a second dielectric layer, wherein the device is embedded in the second dielectric layer, and a surface of the second dielectric layer is higher than a surface of the terminal by a preset value.

Abstract: A chip high-density interconnection package structure includes a plate having a groove and a glass frame, a first via post penetrating the glass frame, a second via post penetrating the groove, a first line layer and a second line layer on the glass frame and electrically connected via the first via post, a third line layer and a fourth line layer on the groove and electrically connected via the second via post, a chip connection bridge on the third line layer in the groove, and a fifth line layer on the first line layer, and chips on the second line layer and the fourth line layer. The chip connection bridge has a first pad connected to the third line layer, the terminals of the two chips are connected to the fourth line layer and/or the second line layer, and the fifth line layer is connected to the first line layer.

Abstract: Disclosed is an embedded chip package, comprising at least one chip and a frame surrounding the at least one chip, the chip having a terminal face and a back face separated by a height of the chip, the frame having a height equal to or larger than the height of the chip, wherein the gap between the chip and the frame is fully filled with a photosensitive polymer dielectric, the terminal face of the chip being coplanar with the frame, a first wiring layer being formed on the terminal face of the chip and a second wiring layer being formed on the back face of the chip. Moreover, a method for manufacturing an embedded chip package is disclosed.

Abstract: A method for manufacturing a high-heat-dissipation mixed substrate includes: preparing a mother substrate, the mother substrate including an insulating layer and a temporary carrier plate which are laminated; arranging a plurality of first grooves and a plurality of first cavities on the mother substrate; filling the first groove with a thermally-conductive material to form a first thermally-conductive block, and adhering an embedded device in the first cavity and filling the first cavity with the thermally-conductive material to form a second thermally-conductive block; removing the temporary carrier plate to obtain a semi-finished substrate; manufacturing circuit layers on two opposite side surfaces of the semi-finished substrate to obtain a target mother substrate; and cutting the target mother substrate along region dividing lines to obtain a mixed substrate with a side surface being a thermally-conductive surface.

Abstract: A manufacturing method for an embedded flip chip package substrate includes laminating a first dielectric layer on the first line layer formed on a carrier plate, forming a first window on the first dielectric layer, filling a first copper post in the first window, forming a second window on the first dielectric layer, mounting a flip chip to the second window, sequentially stacking a packaging layer and a second dielectric layer covered with a first metal layer on the first dielectric layer, pressing a packaging layer encapsulating the first copper post and the flip chip and a second dielectric layer, curing the packaging layer, opening a hole through the first metal layer, the second dielectric layer and the packaging layer to form an interlayer conducting blind hole, forming a second line layer on the first metal layer, and removing the carrier plate to obtain a package substrate.

Abstract: The present invention provides an anti-TIGIT immunosuppressant and use thereof. The immunosuppressant can bind to the extracellular region of human TIGIT, and can be used for treating diseases such as a cancer.

Abstract: A connector assembly including a first intermediate connector member associated with a first device and having a first connector interface and a second intermediate connector having a second connector interface. The first intermediate connector and the second intermediate connector are movable between an interfaced state in which the first connector interface is in contact with the second connector, and a tethered state in which the first connector interface is spaced apart from the second connector interface. The connector assembly further includes a tether member connecting the first intermediate connector and the second intermediate connector in the tethered state. The tether may include a flexible body configured to control a path along at least an axis of either the first intermediate connector or the second intermediate connector during movement from the interfaced state to the tethered state.

Abstract: The present disclosure provides a lens system having a stacked structure. The lens system comprises at least: a first lens; a second lens adjacent to the first lens, a first space formed between the second lens and the first lens; and a shim between the first lens and the second lens, the shim having at least one venting hole, the at least one venting hole connecting the first space and a second space outside the first space. The present disclosure also provides an imaging apparatus comprising the lens system described above.

Abstract: Magnetic detents for input controls are described herein. In one or more implementations, a rotary input control (e.g., a scroll wheel or dial) includes a rotor assembly configured to employ a magnetic detent mechanism. The rotary input control may be integrated with an input device such as a computer mouse, keyboard, or, stylus. The rotor assembly includes a rotor that rotates around an axis of rotation and includes multiple magnetic elements disposed around the rotor, such as teeth of a gear, spokes, metallic regions, and so forth. At least one permanent magnet is arranged radially outward from the axis of rotation and configured to apply a magnetic field to the magnetic elements. This creates a magnetic detent effect when the rotor is rotated due to changes in rotational resistance produced as the magnetic elements rotate through the magnetic field.

Abstract: Magnetic detents for input controls are described herein. In one or more implementations, a rotary input control (e.g., a scroll wheel or dial) includes a rotor assembly configured to employ a magnetic detent mechanism. The rotary input control may be integrated with an input device such as a computer mouse, keyboard, or, stylus. The rotor assembly includes a rotor that rotates around an axis of rotation and includes multiple magnetic elements disposed around the rotor, such as teeth of a gear, spokes, metallic regions, and so forth. At least one permanent magnet is arranged radially outward from the axis of rotation and configured to apply a magnetic field to the magnetic elements. This creates a magnetic detent effect when the rotor is rotated due to changes in rotational resistance produced as the magnetic elements rotate through the magnetic field.

Abstract: A slidable battery door assembly is described. In implementations, the slidable battery door assembly (hereinafter “door assembly”) includes a door that is slidable to control access to a battery compartment for a device. Also included is a battery contact inside the battery compartment that is coupled to the door. When the door is closed, the battery contact holds a battery in place and serves as a portion of an electrical circuit that includes the battery. The door may be slidably opened such that the battery contact releases the battery, allowing the battery to be removed from the battery compartment. Thus, the door assembly enables easy installation and removal of a battery. Further, the door assembly can be positioned to hold a battery securely in place and provide an electrically conductive connection between the battery and an electrical circuit.

Abstract: A slidable battery door assembly is described. In implementations, the slidable battery door assembly (hereinafter “door assembly”) includes a door that is slidable to control access to a battery compartment for a device. Also included is a battery contact inside the battery compartment that is coupled to the door. When the door is closed, the battery contact holds a battery in place and serves as a portion of an electrical circuit that includes the battery. The door may be slidably opened such that the battery contact releases the battery, allowing the battery to be removed from the battery compartment. Thus, the door assembly enables easy installation and removal of a battery. Further, the door assembly can be positioned to hold a battery securely in place and provide an electrically conductive connection between the battery and an electrical circuit.

Abstract: Disclosed are surprising discoveries concerning the role of anionic phospholipids and aminophospholipids in tumor vasculature and in viral entry and spread, and compositions and methods for utilizing these findings in the treatment of cancer and viral infections. Also disclosed are advantageous antibody, immunoconjugate and duramycin-based compositions and combinations that bind and inhibit anionic phospholipids and aminophospholipids, for use in the safe and effective treatment of cancer, viral infections and related diseases.

Abstract: Disclosed are surprising discoveries concerning the role of anionic phospholipids and aminophospholipids in tumor vasculature and in viral entry and spread, and compositions and methods for utilizing these findings in the treatment of cancer and viral infections. Also disclosed are advantageous antibody, immunoconjugate and duramycin-based compositions and combinations that bind and inhibit anionic phospholipids and aminophospholipids, for use in the safe and effective treatment of cancer, viral infections and related diseases.

Abstract: Disclosed are surprising discoveries concerning the role of anionic phospholipids and aminophospholipids in tumor vasculature and in viral entry and spread, and compositions and methods for utilizing these findings in the treatment of cancer and viral infections. Also disclosed are advantageous antibody, immunoconjugate and duramycin-based compositions and combinations that bind and inhibit anionic phospholipids and aminophospholipids, for use in the safe and effective treatment of cancer, viral infections and related diseases.