Patents by Inventor Xianqiang YANG

Xianqiang YANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10748276
    Abstract: A positioning method of rectangular pin element based on vertex points includes the steps of: obtaining component information and classifying components of a model into two classes; extracting feature descriptors of each vertex point of pin element of the model; obtaining a real image of the component and extracting feature points and an angle between two straight lines where the feature points are located and the positive direction of the X-axis respectively; obtaining a rotation angle and an precise feature point position; determining an precise feature point position corresponding to all the vertex points; obtaining feature descriptor of the vertex points of the actual component pin, a weight value of the vertex points of the component in the model, the vertex points of the actual component corresponding to feature point; and determining the final position of the center of the chip and a precise rotation angle of the chip.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: August 18, 2020
    Inventors: Huijun Gao, Xianqiang Yang, Chao Xu, Lifei Bai
  • Publication number: 20190147580
    Abstract: A positioning method of rectangular pin element based on vertex points. The positioning method of rectangular pin element of the present invention solves the problems of weak robustness, low precision, poor versatility and low real-time performance of the on-line positioning algorithm of the patch-type rectangular lead component.
    Type: Application
    Filed: November 14, 2018
    Publication date: May 16, 2019
    Inventors: Huijun GAO, Xianqiang YANG, Chao XU, Lifei BAI
  • Patent number: 9965847
    Abstract: A multi-type BGA chip visual recognition method using line based clustering to solve the problems of BGA inspection algorithms which have limited applicability, low flexibility caused by template matching, poor robustness to illumination and interferences and high time complexity.
    Type: Grant
    Filed: January 16, 2016
    Date of Patent: May 8, 2018
    Inventors: Huijun Gao, Wanxin Jin, Xianqiang Yang, Jinyong Yu, Guanghui Sun, Weiyang Lin, Zhan Li
  • Publication number: 20170193649
    Abstract: A multi-type BGA chip visual recognition method using line based clustering to solve the problems of BGA inspection algorithms which have limited applicability, low flexibility caused by template matching, poor robustness to illumination and interferences and high time complexity.
    Type: Application
    Filed: January 16, 2016
    Publication date: July 6, 2017
    Inventors: Huijun GAO, Wanxin JIN, Xianqiang YANG, Jinyong YU, Guanghui SUN, Weiyang LIN, Zhan LI