Patents by Inventor Xianqui MENG

Xianqui MENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WIRE ELECTRODE FOR WIRECUT ELECTRICAL DISCHARGE MACHINING WITH CARBONACEOUS SURFACE LAYER AND THE PREPARATION METHODS THEREOF
    Publication number: 20220258262
    Abstract: A wire electrode for wirecut electrical discharge machining (WEDM) having a carbonaceous surface layer is disclosed. The wire electrode can include a core material, an outermost carbonization layer, and a phase transition layer between the core material and the carbonization layer.
    Type: Application
    Filed: April 1, 2020
    Publication date: August 18, 2022
    Inventors: Huogen LIN, Xianqui MENG, Tong WU, Meijun HU, Hongfang GU, Yibo CHEN, Zhining LIANG, Tobias NÖTHE