Patents by Inventor Xiantao Geng

Xiantao Geng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11778774
    Abstract: A pumpless liquid-cooling heat dissipator includes a cooling head assembly and a condensing assembly. The cooling head assembly and the condensing assembly are connected through the connecting assembly to form a loop. The cooling head assembly and the condensing assembly both are filled with a liquid refrigerant. The use of refrigerant as a cooling medium is more effective compared with the water cooling, has better overall heat dissipation, and can overcome disadvantages of complex wiring of the water-cooling heat dissipator and poor heat dissipation of the heat pipe, and thus can quickly cool down the temperature of component. Compared with the existing water-cooling heat dissipator, the structure is simpler, the circulating cooling can be realized without mechanical drive e.g., water pump, and there is no extension of excess water pipe, which is more convenient for installation and makes the computer case cleaner.
    Type: Grant
    Filed: January 20, 2022
    Date of Patent: October 3, 2023
    Assignee: DONGGUAN LEADING SHIP PUMP TECH CO;LTD
    Inventor: Xiantao Geng
  • Publication number: 20230232574
    Abstract: A pumpless liquid-cooling heat dissipator includes a cooling head assembly and a condensing assembly. The cooling head assembly and the condensing assembly are connected through the connecting assembly to form a loop. The cooling head assembly and the condensing assembly both are filled with a liquid refrigerant. The use of refrigerant as a cooling medium is more effective compared with the water cooling, has better overall heat dissipation, and can overcome disadvantages of complex wiring of the water-cooling heat dissipator and poor heat dissipation of the heat pipe, and thus can quickly cool down the temperature of component. Compared with the existing water-cooling heat dissipator, the structure is simpler, the circulating cooling can be realized without mechanical drive e.g., water pump, and there is no extension of excess water pipe, which is more convenient for installation and makes the computer case cleaner.
    Type: Application
    Filed: January 20, 2022
    Publication date: July 20, 2023
    Inventor: Xiantao Geng
  • Publication number: 20210385969
    Abstract: The utility model discloses a water-cooling grid, and relates to the technical field of radiators. The water-cooling grid includes a water pump component, a first liquid pipe, a lower water tank, an upper water tank, second liquid pipes and fins. The utility model mainly solves the problem that a water-cooling head is extremely large in volume, and can effectively reduce the volume of the water-cooling head and avoid occupation of the space.
    Type: Application
    Filed: March 26, 2021
    Publication date: December 9, 2021
    Inventor: Xiantao Geng