Patents by Inventor Xiantao Yan
Xiantao Yan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11032884Abstract: A method for making a light-emitting diode (LED) emitter module includes providing a substrate and providing two or more groups of LED dies disposed on the substrate. Each group has one or more LED dies, and each of the LED dies is coupled to an electrical contact and electrical paths are configured for feeding separate electrical currents to the groups of LED dies. The method also includes determining information associating a plurality output light colors with a corresponding plurality of combinations of electrical currents, each combination specifying a plurality of electrical current values, each electrical current value being associated with an LED die from one of the two or more groups of LED dies. The method also includes storing the information in the memory device, and providing a circuit for accessing the information in a memory device.Type: GrantFiled: November 16, 2018Date of Patent: June 8, 2021Assignee: LedEngin, Inc.Inventors: Xiantao Yan, Kachun Lee, David Tahmassebi
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Patent number: 10575374Abstract: An emitter for an LED-based lighting device can incorporate “flip-chip” LEDs, in which all electrical contacts are disposed on the bottom surface of the chip. The emitter base can be a multilayer high-temperature cofired ceramic (HTCC) substrate, with metal traces formed between the layers and vias through the layers to join traces in different layers, thereby providing electrical connectivity to each LED. The paths can be arranged such that current can be supplied independently to different subsets of the LEDs. The top layer of the emitter base is fabricated with exposed vias at the top surface. Metal pads are then printed onto the exposed vias on the top surface, and flip-chip LEDs are bonded to the metal pads, e.g., using solder.Type: GrantFiled: March 9, 2018Date of Patent: February 25, 2020Assignee: LedEngin, Inc.Inventor: Xiantao Yan
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Publication number: 20190332098Abstract: An emitter for an LED-based lighting device has multiple groups of LEDs that are independently addressable, allowing the emitter to be tuned to a desired color bin (e.g., a specific white color) by adjusting the relative current supplied to different groups. The LED dies for the groups and a phosphor chip for each LED die are individually selected such that each LED-die/phosphor-chip combination produces light in a desired source region associated with the group to which the LED belongs. Robotic pick-and-place systems can be used to automate assembly of the emitters by selecting LED dies from a bin based on spectral characteristics and phosphor chips from a number of distinct phosphor chip types.Type: ApplicationFiled: May 8, 2019Publication date: October 31, 2019Applicant: LedEngin, Inc.Inventors: Xiantao Yan, Kachun Lee
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Publication number: 20190281672Abstract: An emitter for an LED-based lighting device can incorporate “flip-chip” LEDs, in which all electrical contacts are disposed on the bottom surface of the chip. The emitter base can be a multilayer high-temperature cofired ceramic (HTCC) substrate, with metal traces formed between the layers and vias through the layers to join traces in different layers, thereby providing electrical connectivity to each LED. The paths can be arranged such that current can be supplied independently to different subsets of the LEDs. The top layer of the emitter base is fabricated with exposed vias at the top surface. Metal pads are then printed onto the exposed vias on the top surface, and flip-chip LEDs are bonded to the metal pads, e.g., using solder.Type: ApplicationFiled: March 9, 2018Publication date: September 12, 2019Applicant: LedEngin, Inc.Inventor: Xiantao Yan
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Publication number: 20190090323Abstract: A method for making a light-emitting diode (LED) emitter module includes providing a substrate and providing two or more groups of LED dies disposed on the substrate. Each group has one or more LED dies, and each of the LED dies is coupled to an electrical contact and electrical paths are configured for feeding separate electrical currents to the groups of LED dies. The method also includes determining information associating a plurality output light colors with a corresponding plurality of combinations of electrical currents, each combination specifying a plurality of electrical current values, each electrical current value being associated with an LED die from one of the two or more groups of LED dies. The method also includes storing the information in the memory device, and providing a circuit for accessing the information in a memory device.Type: ApplicationFiled: November 16, 2018Publication date: March 21, 2019Applicant: LedEngin, Inc.Inventors: Xiantao Yan, Kachun Lee, David Tahmassebi
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Patent number: 10219345Abstract: A light emitting device can include a substrate with LED chips disposed on a surface of the substrate. The LED chips can include chips of at least four different colors. Electrical paths disposed in part on the substrate and in part within the substrate can connect the LED chips into at least three independently addressable groups, and the number of independently addressable groups can be less than the number of colors of LED chips, so that at least one of the groups includes LED chips of two or more different colors.Type: GrantFiled: November 10, 2016Date of Patent: February 26, 2019Assignee: LedEngin, Inc.Inventors: Xiantao Yan, Kachun Lee, Shifan Cheng, Julio Cesar Alvarado
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Patent number: 10172206Abstract: A substrate for an LED emitter includes a body with a recess region formed therein. Bonding pads are disposed within the recess region, including LED bonding pads for LEDs and supporting chip bonding pads for one or more semiconductor chips that provide supporting circuitry (e.g., driver and/or controller circuitry) to support operation of the LEDs. External electrical contacts can be disposed outside the recess region. Electrical paths, disposed at least partially within the body of the substrate, connect the external electrical contacts to a first subset of the supporting chip bonding pads and connect a second subset of the supporting chip bonding pads to the plurality of LED bonding pads such that one or more supporting chips connected to the controller pads can be operated to deliver different operating currents to different ones of the LEDs.Type: GrantFiled: April 13, 2017Date of Patent: January 1, 2019Assignee: LedEngin, Inc.Inventors: Xiantao Yan, Kachun Lee
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Patent number: 10149363Abstract: A method for making a light-emitting diode (LED) emitter module includes providing a substrate and providing two or more groups of LED dies disposed on the substrate. Each group has one or more LED dies, and each of the LED dies is coupled to an electrical contact and electrical paths are configured for feeding separate electrical currents to the groups of LED dies. The method also includes determining information associating a plurality output light colors with a corresponding plurality of combinations of electrical currents, each combination specifying a plurality of electrical current values, each electrical current value being associated with an LED die from one of the two or more groups of LED dies. The method also includes storing the information in the memory device, and providing a circuit for accessing the information in the memory device.Type: GrantFiled: May 2, 2016Date of Patent: December 4, 2018Assignee: LedEngin, Inc.Inventors: Xiantao Yan, Kachun Lee, David Tahmassebi
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Publication number: 20180132329Abstract: A light emitting device can include a substrate with LED chips disposed on a surface of the substrate. The LED chips can include chips of at least four different colors. Electrical paths disposed in part on the substrate and in part within the substrate can connect the LED chips into at least three independently addressable groups, and the number of independently addressable groups can be less than the number of colors of LED chips, so that at least one of the groups includes LED chips of two or more different colors.Type: ApplicationFiled: November 10, 2016Publication date: May 10, 2018Applicant: LedEngin, Inc.Inventors: Xiantao Yan, Kachun Lee, Shifan Cheng, Julio Cesar Alvarado
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Patent number: 9929326Abstract: According to some embodiments of the invention, a light-emitting device package includes a body including top and bottom surfaces and a cavity in the body, the cavity extending from the top surface towards the bottom surface and having a floor. The light-emitting device package also includes a plurality of LED (light-emitting-diode) dies disposed on the floor of the cavity. A socket is formed over the plurality of LED dies. The socket includes a top surface, a socket sidewall, and a bottom surface, the socket sidewall disposed between the top surface and the bottom surface of the socket. A lens is disposed over the over the socket. The lens includes two or more optical materials with different indices of refraction. The lens includes a cap and a plug. The cap has an upper surface and a lower surface, and the plug has a lower surface and a plug sidewall between the lower surface of the plug and the lower surface of the cap.Type: GrantFiled: May 1, 2015Date of Patent: March 27, 2018Assignee: LedEngin, Inc.Inventor: Xiantao Yan
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Patent number: 9897284Abstract: An LED-based lamp can be made to have a form factor compatible with fixtures designed for MR16 lamps. Such a lamp can have a housing that provides an external electrical connection. Inside the housing is disposed a single emitter structure having a substrate with multiple light-emitting diodes (LEDs) arranged thereon. Different LEDs produce light of different colors (or color temperatures). For example, at least one LED can produce a warm white light, while at least one other LED produces a cool white light and at least one other LED produces a red light. A total-internal-reflection (TIR) lens is positioned to collect light emitted from the single emitter structure and adapted to mix the light from the LEDs to produce a uniform white light. A diffusive coating is applied to a front face of the TIR lens for further color mixing.Type: GrantFiled: March 26, 2013Date of Patent: February 20, 2018Assignee: LedEngin, Inc.Inventors: Xiantao Yan, Wu Jiang, Zequn Mei
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Publication number: 20180007759Abstract: A substrate for an LED emitter includes a body with a recess region formed therein. Bonding pads are disposed within the recess region, including LED bonding pads for LEDs and supporting chip bonding pads for one or more semiconductor chips that provide supporting circuitry (e.g., driver and/or controller circuitry) to support operation of the LEDs. External electrical contacts can be disposed outside the recess region. Electrical paths, disposed at least partially within the body of the substrate, connect the external electrical contacts to a first subset of the supporting chip bonding pads and connect a second subset of the supporting chip bonding pads to the plurality of LED bonding pads such that one or more supporting chips connected to the controller pads can be operated to deliver different operating currents to different ones of the LEDs.Type: ApplicationFiled: April 13, 2017Publication date: January 4, 2018Applicant: LedEngin, Inc.Inventors: Xiantao Yan, Kachun Lee
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Patent number: 9842973Abstract: Methods of fabricating a light-emitting device are provided. A light-emitting device can be formed from bonding a lens including a plug and a cap to an LED package including a socket configured to receive the plug. The lens can be fabricated using an injection mold formed from a well secured to the LED package and injecting a material into the injection mold to cure into a shape of the lens. The lens can also be fabricated using a blank about the shape of the lens and machining the blank to produce the plug and the cap of the lens. The lens can be bonded to the LED package using a convex bead of adhesive deposited on the surface of the LED package and spreading the adhesive between the lens and the LED package.Type: GrantFiled: July 22, 2014Date of Patent: December 12, 2017Assignee: LedEngin, Inc.Inventor: Xiantao Yan
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Patent number: 9816691Abstract: A flexible sheet of light-emitting diode (LED) light emitters includes a support substrate having a thermally conductive material. The flexible sheet of LED light emitters also has an LED emitter sheet overlying the support substrate, and the LED emitter sheet including a plurality of LED light emitters. The flexible sheet of LED light emitters also has a flexible circuit sheet overlying the LED emitter sheet, and a phosphor sheet overlying the flexible circuit sheet. The phosphor sheet includes a wave-length converting material. The flexible sheet of LED light emitters also has a lens sheet overlying the phosphor sheet. The lens sheet includes a plurality of lenses.Type: GrantFiled: August 4, 2016Date of Patent: November 14, 2017Assignee: LedEngin, Inc.Inventor: Xiantao Yan
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Patent number: 9794999Abstract: LED-based light source modules can incorporate color tunability and brightness control, allowing a user to select a desired color temperature and/or brightness and to change either or both dynamically. An emitter can include multiple independently addressable groups of LEDs, each emitting light of a different color. By controlling the relative operating current provided to each group, a desired color temperature can be achieved, and by controlling the absolute operating currents, the brightness of the output light can be controlled. Pulse width modulation (PWM) can be used to control the relative and absolute operating currents. Smooth, gradual transitions between brightness and/or color temperature settings in response to changes can be provided.Type: GrantFiled: April 3, 2014Date of Patent: October 17, 2017Assignee: LedEngin, Inc.Inventors: Kachun Lee, Xiantao Yan, Zequn Mei
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Patent number: 9653663Abstract: A package for multiple LED's and for attachment to a substrate includes a body, which includes a top body layer, a cavity disposed through the top body layer and having a floor for bonding to the multiple LED's, and a thermal conduction layer bonded to the top body layer and having a top surface forming the floor of the cavity and a bottom surface. The thermal conduction layer includes a thermally conducting ceramic material disposed between the floor and the bottom surface. The package also includes a plurality of LED bonding pads in direct contact with the floor and configured to bond to the multiple LED's and a plurality of electrical bonding pads in direct contact with the floor, proximate to the LED bonding pads, and in electrical communication with a plurality of electrical contacts disposed on a surface of the body.Type: GrantFiled: March 28, 2014Date of Patent: May 16, 2017Assignee: LedEngin, Inc.Inventor: Xiantao Yan
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Patent number: 9642206Abstract: A substrate for an LED emitter includes a body with a recess region formed therein. Bonding pads are disposed within the recess region, including LED bonding pads for LEDs and supporting chip bonding pads for one or more semiconductor chips that provide supporting circuitry (e.g., driver and/or controller circuitry) to support operation of the LEDs. External electrical contacts can be disposed outside the recess region. Electrical paths, disposed at least partially within the body of the substrate, connect the external electrical contacts to a first subset of the supporting chip bonding pads and connect a second subset of the supporting chip bonding pads to the plurality of LED bonding pads such that one or more supporting chips connected to the controller pads can be operated to deliver different operating currents to different ones of the LEDs.Type: GrantFiled: November 25, 2015Date of Patent: May 2, 2017Assignee: LedEngin, Inc.Inventors: Xiantao Yan, Kachun Lee
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Patent number: 9634214Abstract: Substrates and packages for LED based light devices can incorporate a material with high thermal conductivity in at least the lateral direction (e.g., graphite or graphene) to spread heat across the surface of the substrate. A substrate or layer in a multi-layer substrate can have a graphite core disposed between ceramic sublayers that provide electrical insulation and thermal conductivity in the transverse direction. Another substrate or layer in a multi-layer substrate can be fabricated using a composite of graphite and ceramic materials.Type: GrantFiled: November 5, 2013Date of Patent: April 25, 2017Assignee: LedEngin, Inc.Inventor: Xiantao Yan
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Patent number: 9560713Abstract: LED-based light source modules can incorporate color tunability and brightness control, allowing a user to select a desired color temperature and/or brightness and to change either or both dynamically. An emitter can include multiple independently addressable groups of LEDs, each emitting light of a different color. By controlling the relative operating current provided to each group, a desired color temperature can be achieved, and by controlling the absolute operating currents, the brightness of the output light can be controlled. Pulse width modulation (PWM) can be used to control the relative and absolute operating currents. Smooth, gradual transitions between brightness and/or color temperature settings in response to changes can be provided.Type: GrantFiled: April 3, 2014Date of Patent: January 31, 2017Assignee: LedEngin, Inc.Inventors: Kachun Lee, Xiantao Yan, Zequn Mei
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Patent number: 9554457Abstract: Substrates and packages for LED-based light devices can significantly improve thermal performance and provide separate electrical and thermal paths through the substrate. One substrate includes multiple electrically insulating base layers. On a top one of these layers are disposed top-side electrical contacts, including light device pads to accommodate a plurality of light devices. External electrical contacts are disposed on an exterior surface of the substrate. Electrical paths connect the top-side electrical contacts to the external electrical contacts. At least portions of some of the electrical paths are disposed between the electrically insulating base layers. The electrical paths can be arranged such that different subsets of the light device pads are addressable independently of each other. A heat dissipation plate can be formed on the bottom surface of a bottom one of the base layers.Type: GrantFiled: March 31, 2014Date of Patent: January 24, 2017Assignee: LedEngin, Inc.Inventor: Xiantao Yan