Abstract: A signal processing system and method for inductive oil abrasive particle sensor, comprising a sensor, an excitation signal generator, an analog signal processing circuit, a MCU signal acquisition module and a computer signal processing module is disclosed. The sensor is provided with two groups of induction coils, the excitation signal generator generates excitation signals and drives the excitation coils of the sensor to output induction signals containing abrasive particle information, and the analog signal processing circuit receives the induction signals output by the sensor and demodulates and amplifies the induction signals. The signal processing system of the sensor applied to online monitoring of oil abrasive particles is simple in structure and convenient to apply, has a complete signal statistics and monitoring interface, and can be used to effectively monitor the size, concentration and other information of the metal abrasive particles in oil in real time.

Abstract: The present disclosure relates to a method for ultrasonic guided wave quantitative imaging in a form of variable array and belongs to the technical field of ultrasonic non-destructive testing. The method includes: converting a non-linear lippmann-Schwinger equation into a form of linear summation by a method of moments; and selecting acquisition arrays with different numbers of probes to measure a scattered field signal, and modifying Green's functions by variable born approximation for continuous iterations to approximate a true solution, so as to obtain a final objective function Ok to be solved. According to the present disclosure, by adjusting the arrays, the number of probes and appropriate solution algorithm can be selected based on the testing accuracy; and the method can achieve quantitative evaluation of non-destructive testing, and can be widely used in practical guided wave testing applications of industrial non-destructive testing.

Abstract: A method for determining a bonding pad spacing on the surface of a bonding wire chip includes the steps of setting a loop height (“K”); selecting a capillary, measuring an expansion angle of a capillary sharp mouth (“C”); measuring the diameter of the capillary sharp mouth (“T”); measuring the hole diameter of the capillary (“H”); and determining a bonding pad spacing on the surface of a bonding wire chip (“P”). The formula is as follows: P=(T+H)/2+[tan(C/2)]*K. This method more accurately determines bonding pad spacing on the surface of a bonding wire chip, thereby providing a wider performance adjustment space. Additionally, problems, such as mutual inductance abnormalities caused by wire deformation or even by short circuits with other circuits due to the contact between a packaged capillary and a bonded wire can be lowered, thereby improving the working efficiency and reducing the number of times verification is performed.