Abstract: The present invention provides a multichannel parallel light emitting device comprising a semiconductor cooler, a cold surface of the semiconductor cooler completely covers the area of a hot surface, and when the hot surface and the cold surface are horizontally disposed, a horizontal distance is reserved between the edge of the cold surface and the edge of the hot surface, and a positive electrode and a negative electrode are fixed on a second surface of the cold surface.

Abstract: A benzothiazole meroterpenoid compound derived from deep sea fungi and a derivative thereof, and a preparation method therefor and the use thereof in the preparation of an anti-tumor drug are provided. The benzothiazole meroterpenoid compound is a compound as represented by formulas I to III or a salt thereof. The compound is isolated from a fermentation product of deep-sea-derived Penicillium allii-sativi and inhibits the transcriptional activity of an anti-tumor target RXRalpha by means of binding thereto so as to achieve a remarkable anti-tumor effect. The compound can be used for preparing, researching and developing anti-cancer drugs, and has good application prospects.

Abstract: A silicon photonics integrated chip includes the transmit-input waveguide unit, the splitter unit, the modulator unit, the transmit-output waveguide unit, the receive-input waveguide unit and the receiving detector unit integrated inside the chip. A silicon photonics multi-channel parallel optical component and a coupling method of the silicon photonics multi-channel parallel optical component are also provided. The integrated silicon photonics chip is adopted, the transmitting part still uses two-way DC laser group, the receiving chip is integrated inside the silicon photonics chip, and the optical interface adopts the mature FA-MPO in the industry. It has the advantages of mature technology, high degree of integration, relatively low cost, fewer coupling processes, etc., it is one of the advantageous choices for rates above 400 G.

Abstract: A silicon photonics integrated chip includes the transmit-input waveguide unit, the splitter unit, the modulator unit, the transmit-output waveguide unit, the receive-input waveguide unit and the receiving detector unit integrated inside the chip. A silicon photonics multi-channel parallel optical component and a coupling method of the silicon photonics multi-channel parallel optical component are also provided. The integrated silicon photonics chip is adopted, the transmitting part still uses two-way DC laser group, the receiving chip is integrated inside the silicon photonics chip, and the optical interface adopts the mature FA-MPO in the industry. It has the advantages of mature technology, high degree of integration, relatively low cost, fewer coupling processes, etc., it is one of the advantageous choices for rates above 400 G.

Abstract: The present invention provides an anti-CD47 antibody or antigen-binding fragment thereof, a preparation method therefor and the use for treating or preventing CD47-related diseases.

Abstract: A system and a method of interface communication being compatible with SFP+ optical modules and QSFP+ switch are provided. The system includes an adapter card. The adapter card includes a set of SFP+ golden fingers that comply with the SFP+ protocol, a set of QSFP+ golden fingers that comply with the QSFP+ protocol, and a microcontroller unit. The adapter card communicates with the SFP optical module through the SFP+ golden fingers, and communicates with the QSFP switch through the QSFP+ golden fingers. The microcontroller unit is used to extend and process the pin information in the adapter card, and to convert the two different protocols of SFP+ and QSFP+, so that the module under the SFP+ protocol can respond under the port of QSFP+, so as to realize the data communication between the SFP+ optical module and the QSFP+ switch.

Abstract: The present invention relates to the technical field of optical communication, and provides a light emitting assembly comprising: an LD chip component, an optical wavelength division multiplexer, a first package housing and a second package housing; the first package housing is fixedly connected with the second package housing to form a first chamber for packaging the LD chip component and a second chamber for packaging the optical wavelength division multiplexer, the first chamber is located inside the first package housing, and the second chamber is located inside the second package housing. The present invention also provides an optical module comprising: a housing, a light receiving assembly and the light emitting assembly mentioned above, wherein the light receiving assembly and the light emitting assembly are both disposed on the housing.

Abstract: A system and a method of interface communication being compatible with SFP+ optical modules and QSFP+ switch are provided. The system includes an adapter card. The adapter card includes a set of SFP+ golden fingers that comply with the SFP+ protocol, a set of QSFP+ golden fingers that comply with the QSFP+ protocol, and a microcontroller unit. The adapter card communicates with the SFP optical module through the SFP+ golden fingers, and communicates with the QSFP switch through the QSFP+ golden fingers. The microcontroller unit is used to extend and process the pin information in the adapter card, and to convert the two different protocols of SFP+ and QSFP+, so that the module under the SFP+ protocol can respond under the port of QSFP+, so as to realize the data communication between the SFP+ optical module and the QSFP+ switch.

Abstract: A package structure for the multi-channel parallel transmission optical device includes a package base, a package cap which is used to form a package shell with the package base, and a plurality of laser generating units that are all mounted on the package base and arranged annularly relative to the axis of the package base. Each laser generating unit is equipped with an optical mirror group to convert the laser emitted by the laser generating unit into the laser beam parallel to the axis of the package base. A converging lens is also configured inside or outside the package shell, or the package cap uses the converging lens as an optical window, and to converge each laser beam into output beam. The optical path design can significantly reduce the device package volume, which correspondingly increases the channel density.

Abstract: In the technical field of optical communication a multi-path wavelength division multiplexing light receiving component including a substrate placed at the bottom of a housing is provided. The housing and substrate form an installation chamber, and include a light emitting unit, a light de-multiplexing unit, a reflector and a light receiving unit. The light emission unit, the light de-multiplexing unit, the reflector, and the light receiving unit are located inside the installation cavity, and the light emission unit, the light de-multiplexing unit, and the reflector are fixed on the housing, and the light receiving unit is fixed on the substrate. An optical module includes the multiplex wavelength division multiplexing optical receiving component. The length of the light receiving unit is shortened by reflecting an optical signal decomposed by a light de-multiplexing unit, and disposing the light receiving unit integrally below a reflector.

Abstract: An anthraquinone compound and the use thereof in preparing anti-allergic drugs. The anthraquinone compound has a structure according to formula (I) and can be used to prepare anti-allergic drugs.

Abstract: An anthraquinone compound and the use thereof in preparing anti-allergic drugs. The anthraquinone compound has a structure according to formula (I) and can be used to prepare anti-allergic drugs.

Abstract: The present invention relates to the technical field of optical communication, and provides a light emitting assembly comprising: an LD chip component, an optical wavelength division multiplexer, a first package housing and a second package housing; the first package housing is fixedly connected with the second package housing to form a first chamber for packaging the LD chip component and a second chamber for packaging the optical wavelength division multiplexer, the first chamber is located inside the first package housing, and the second chamber is located inside the second package housing. The present invention also provides an optical module comprising: a housing, a light receiving assembly and the light emitting assembly mentioned above, wherein the light receiving assembly and the light emitting assembly are both disposed on the housing.

Abstract: The present invention relates to an all-in-one converter using a low-speed optical module on a high-speed switch. The present invention relates to the field of optical modules in optical communications. It provides a solution of using a 25G optical module on a 100G switch, and simultaneously enabling a 10G optical module to be used on a 40G switch. A first electrical interface of the converter is connected with a 100G/40G switch, which meets the requirements of SFF-8636 protocol and realizes the bidirectional transmission of signals from the switch to the converter. A second electrical interface of the converter is connected with the optical module, which realizes the module's bidirectional transmission from the converter to the optical module. There is a signal conversion circuit inside the converter, which makes the signals of the two electrical interfaces meet the requirements of their respective protocols.

Abstract: In the technical field of optical communication a multi-path wavelength division multiplexing light receiving component including a substrate placed at the bottom of a housing is provided. The housing and substrate form an installation chamber, and include a light emitting unit, a light de-multiplexing unit, a reflector and a light receiving unit. The light emission unit, the light de-multiplexing unit, the reflector, and the light receiving unit are located inside the installation cavity, and the light emission unit, the light de-multiplexing unit, and the reflector are fixed on the housing, and the light receiving unit is fixed on the substrate. An optical module includes the multiplex wavelength division multiplexing optical receiving component. The length of the light receiving unit is shortened by reflecting an optical signal decomposed by a light de-multiplexing unit, and disposing the light receiving unit integrally below a reflector.

Abstract: The invention provides an optical module including a circuit board, an optical component and an electrical interface, and the circuit board is provided with a signal rate transmission chip, a laser driver chip, a transimpedance limiting amplifier chip, a vertical cavity surface-emitting laser chip array and a photodetector chip array, and the signal rate transmission chip is electrically connected with the laser driver chip and the transimpedance limiting amplifier chip through the first microstrip line, and the optical component includes an interface end MT ferrule, and a light-emitting ribbon optical cable and a light-receiving ribbon optical cable both connected with the interface end MT ferrule, the light-emitting ribbon optical cable is coupled and aligned with the vertical cavity surface-emitting laser chip array, and the light-receiving ribbon optical cable is coupled and aligned with the photodetector chip array, and the electrical interface includes a gold finger disposed on one side of circuit board

Abstract: The invention provides an optical module including a circuit board, an optical component and an electrical interface, and the circuit board is provided with a signal rate transmission chip, a laser driver chip, a transimpedance limiting amplifier chip, a vertical cavity surface-emitting laser chip array and a photodetector chip array, and the signal rate transmission chip is electrically connected with the laser driver chip and the transimpedance limiting amplifier chip through the first microstrip line, and the optical component includes an interface end MT ferrule, and a light-emitting ribbon optical cable and a light-receiving ribbon optical cable both connected with the interface end MT ferrule, the light-emitting ribbon optical cable is coupled and aligned with the vertical cavity surface-emitting laser chip array, and the light-receiving ribbon optical cable is coupled and aligned with the photodetector chip array, and the electrical interface includes a gold finger disposed on one side of circuit board

Abstract: The present invention relates to an all-in-one converter using a low-speed optical module on a high-speed switch. The present invention relates to the field of optical modules in optical communications. It provides a solution of using a 25G optical module on a 100G switch, and simultaneously enabling a 10G optical module to be used on a 40G switch. A first electrical interface of the converter is connected with a 100G/40G switch, which meets the requirements of SFF-8636 protocol and realizes the bidirectional transmission of signals from the switch to the converter. A second electrical interface of the converter is connected with the optical module, which realizes the module's bidirectional transmission from the converter to the optical module. There is a signal conversion circuit inside the converter, which makes the signals of the two electrical interfaces meet the requirements of their respective protocols.

Abstract: The invention relates to the field of optical communication network modules, and provides a 4-channel CWDM QSFP optical module, comprising a QSFP base and four optical transmitting sub-devices. The four optical transmitting sub-devices are mounted on the base in parallel, and there is a gap between each of the optical transmitting sub-devices and the base. The QSFP optical module further includes CWDM optical components for multiplexing 4-channel optical signals emitted by the four optical transmitting sub-devices. The CWDM optical components comprise a single fiber pigtail for transmitting the multiplexed optical signal, the single fiber pigtail being at least partially located in the gap. The 4-channel CWDM QSFP optical module of the invention connects the four optical transmitting sub-devices with the CWDM optical components by a reasonable method of optical fiber winding, thereby solves the problem that it is difficult to achieve single-mode fiber coupling of four LDs in a small space.

Abstract: The invention relates to the field of optical communication network modules, and provides a 4-channel CWDM QSFP optical module, comprising a QSFP base and four optical transmitting sub-devices. The four optical transmitting sub-devices are mounted on the base in parallel, and there is a gap between each of the optical transmitting sub-devices and the base. The QSFP optical module further includes CWDM optical components for multiplexing 4-channel optical signals emitted by the four optical transmitting sub-devices. The CWDM optical components comprise a single fiber pigtail for transmitting the multiplexed optical signal, the single fiber pigtail being at least partially located in the gap. The 4-channel CWDM QSFP optical module of the invention connects the four optical transmitting sub-devices with the CWDM optical components by a reasonable method of optical fiber winding, thereby solves the problem that it is difficult to achieve single-mode fiber coupling of four LDs in a small space.