Patents by Inventor Xianxin Lang

Xianxin Lang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High performance die attach adhesives (DAAs) nanomaterials for high brightness LED
    Patent number: 9005485
    Abstract: The present invention relates to a composition for a one-part die attach adhesives material useful for packaging semi-conductors including HB-LED. The composition of the present invention includes a thermal and electrical conductive filler, a polymer matrix and a solvent which form a material with high thermal conductivity, low curing temperature and high self-life temperature. The present invention also relates to a method of preparing said composition by mixing a size-selected and surface-modified filler formulation, a polymer matrix and a non-reactive organic solvent together followed by curing the mixture at a low temperature.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: April 14, 2015
    Assignee: Nano and Advanced Materials Institute Limited
    Inventors: Chenmin Liu, Dong Lu, Xianxin Lang, Bo Wang, Zhiying Li
  • HIGH PERFORMANCE DIE ATTACH ADHESIVES (DAAs) NANOMATERIALS FOR HIGH BRIGHTNESS LED
    Publication number: 20140001414
    Abstract: The present invention relates to a composition for a one-part die attach adhesives material useful for packaging semi-conductors including HB-LED. The composition of the present invention includes a thermal and electrical conductive filler, a polymer matrix and a solvent which form a material with high thermal conductivity, low curing temperature and high self-life temperature. The present invention also relates to a method of preparing said composition by mixing a size-selected and surface-modified filler formulation, a polymer matrix and a non-reactive organic solvent together followed by curing the mixture at a low temperature.
    Type: Application
    Filed: March 22, 2012
    Publication date: January 2, 2014
    Applicant: NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
    Inventors: Chenmin Liu, Dong Lu, Xianxin Lang, Bo Wang, Zhiying Li