Patents by Inventor Xiao-Bai Gu

Xiao-Bai Gu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pluggable form factor release mechanism
    Patent number: 7766686
    Abstract: Briefly, various embodiments of a pluggable form factor release mechanism are described. For example, but without intending to limit the scope of claimed subject matter, a transceiver module may include the following: a module housing; a bail lever; an actuator; and a spring adjacent to the actuator. The bail lever and the actuator may be movably connected to the module housing in such a manner so that pivoting the bail lever away from the housing engages an end of the actuator to move towards the module housing. The actuator may rotate about a fulcrum with an opposing end of the actuator moving away from the module housing.
    Type: Grant
    Filed: January 7, 2008
    Date of Patent: August 3, 2010
    Assignee: Applied Optoelectronics, Inc.
    Inventor: Xiao-Bai Gu
  • Pluggable form factor release mechanism
    Publication number: 20090176401
    Abstract: Briefly, various embodiments of a pluggable form factor release mechanism are described.
    Type: Application
    Filed: January 7, 2008
    Publication date: July 9, 2009
    Applicant: Applied Optoelectronics, Inc.
    Inventor: Xiao-Bai Gu
  • Cable modem housing
    Patent number: D417223
    Type: Grant
    Filed: March 4, 1999
    Date of Patent: November 30, 1999
    Assignee: Motorola, Inc.
    Inventors: William R. Groves, Xiao-Bai Gu, Roger W. Ady, David J. Pineau, Kenneth Warren Larson