Patents by Inventor XIAO-CHU JIN

XIAO-CHU JIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CIRCUIT BOARD STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20220369474
    Abstract: A circuit board structure includes a rigid circuit board, a flexible circuit board, a plurality of conductive bumps, and a plurality of spacers. The rigid and flexible circuit boards are stacked one above the other. The conductive bumps are formed between the rigid and flexible circuit boards. The spacers are formed between the rigid and flexible circuit boards and spaced apart from the conductive bumps.
    Type: Application
    Filed: May 31, 2021
    Publication date: November 17, 2022
    Inventors: HOU-YUAN CHOU, XIAO-CHU JIN, SHI ZHANG, BO WU, ZHI-HONG XU, MEI-WEN KAO, YI-CHIH WU