Abstract: A strain sensor that has an associated temperature compensation circuit. The strain sensor is temperature-compensated as it has a temperature compensation circuit that, when powered, applies an applied voltage across the applied voltage terminals of the strain sensor that has a compensating temperature dependency. That is, the applied voltage has a temperature dependency of one polarity that is opposite a temperature dependency of the strain sensor. Because of this temperature compensation, the signal representing strain has a more stable scale factor between the endured strain and the signal representing the strain. Thus, the accuracy of the strain sensor is improved.

Abstract: Examples are disclosed that relate to scanning mirror systems for display devices. One example provides a scanning mirror system comprising a mirror portion, a flexure arm extending from the mirror portion, and a piezoelectric actuator support portion supporting a piezoelectric actuator comprising a piezoelectric film. The scanning mirror system further comprises a transmission arm extending between the flexure arm and the piezoelectric actuator support portion to transmit motion of the piezoelectric film to the flexure arm, the transmission arm separated at least partially from the piezoelectric actuator support portion by a first gap. The scanning mirror system further comprises an anchor portion separated at least partially from the piezoelectric actuator support portion by a second gap, the anchor portion configured to anchor the scanning mirror system to another structure.

Abstract: A flip chip micromirror assembly comprising a micromirror chip that is flip chip mounted onto the circuit board via a bonding layer. The micromirror chip has a micromirror layer in which a micromirror is formed. The micromirror chip has a flip chip surface facing the electrode surface of the circuit board. The bonding layer includes conductive region(s) that electrically couples corresponding board electrodes with corresponding chip electrodes. However, the bonding layer is not interposed between the electrode surface of the circuit board and the micromirror itself. In other words, the bonding layer spaces the micromirror chip from the circuit board, and provides a gap underneath the micromirror between the micromirror chip and the circuit board. This gap is of sufficient thickness that the micromirror can be actuated with full movement without being mechanically obstructed by the circuit board.

Abstract: A device includes a mirror coupled via a pair of flexible beams supported by a block of semiconductor material that has a cavity about the mirror and beams to allow the mirror to rotate about an axis along the beams. A piezoresistive sensor is coupled to one of the beams to provide information representative of an angle of rotation of the mirror. A light blocking shield covers exposed portions of the block of semiconductor material about the mirror.

Abstract: Examples are disclosed herein relating to reducing strain in a resonant scanning mirror system. One example provides a thin film piezoelectric-actuated resonant scanning mirror system, comprising a body comprising an anchor portion, a scanning mirror portion, a piezoelectric film support portion, a transmission beam extending from the piezoelectric thin film support portion, and a torsion beam extending between the scanning mirror portion and the transmission beam, and a piezoelectric film formed on the piezoelectric film support portion, the piezoelectric film support portion comprising an area of a surface of the body in which a stress on the piezoelectric film does not exceed a yield stress of the piezoelectric film during oscillation of the scanning mirror portion.

Abstract: A microelectromechanical systems (MEMS) scanning device comprising a torsional beam flexure that has a variable width in relation to a rotational axis for a scanning mirror. The geometric properties of the torsional beam vary along the rotational axis to increase a desired mode of mechanical strain at a location where a strain sensor is operating within the MEMS scanning device to generate a feedback signal. The torsional beam flexure mechanically suspends the scanning mirror from a frame structure. During operation of the MEMS scanning device, actuators induce torsional deformation into the torsional beam flexure to cause rotation of the scanning mirror about the rotational axis. The degree or amount of this torsional deformation is directly related to the angular position of the scanning mirror and, therefore, the desired mode of mechanical strain may be this torsional deformation strain component.

Abstract: A microelectromechanical systems (MEMS) scanning device comprising a torsional beam flexure that has a variable width in relation to a rotational axis for a scanning mirror. The geometric properties of the torsional beam vary along the rotational axis to increase a desired mode of mechanical strain at a location where a strain sensor is operating within the MEMS scanning device to generate a feedback signal. The torsional beam flexure mechanically suspends the scanning mirror from a frame structure. During operation of the MEMS scanning device, actuators induce torsional deformation into the torsional beam flexure to cause rotation of the scanning mirror about the rotational axis. The degree or amount of this torsional deformation is directly related to the angular position of the scanning mirror and, therefore, the desired mode of mechanical strain may be this torsional deformation strain component.

Abstract: Disclosed are highly compliant bioelectronic neural interface devices with hydrogel adhesion. Example devices include adhesion-promoting functional groups that facilitate enhanced electrical contact with the nerve without the need for continuous application of pressure. A transfer process may be used to fabricate the device using a sacrificial material (e.g., polyacrylic acid (PAA)) that has tunable solubility in aqueous media, helping avoid the need for harsher release chemicals that may affect the properties of the hydrogel. The transfer process also helps achieve electrode contacts that are flush with a surface of the device and facilitate more intimate contact with the nerve. A gradual change in Young's modulus from a stiff contact pad region to a more compliant electrode contact region may be achieved via a varied amount of an epoxy-based material (such as SU-8 ) and with silicone-based material (such as polydimethylsiloxane (PDMS)) to encapsulate the device cable.