Patents by Inventor XIAO-CHUN WU

XIAO-CHUN WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor IC packaging methods and structures
    Patent number: 9589815
    Abstract: An IC packaging method is provided. The method includes providing a semiconductor substrate. The semiconductor substrate has a metal pad and an insulating layer and the insulating layer has an opening to expose the meal pad. The method also includes forming an under-the-ball meal electrode on the exposed metal pad. The under-the-ball metal electrode has an electrode body and an electrode tail, the electrode body is located at a bottom portion of the under-the-ball metal electrode and is in contact with the metal pad, and the electrode tail is located at a top portion of the under-the-ball meal electrode. Further, the method includes forming a solder ball on the under-the-ball metal electrode.
    Type: Grant
    Filed: November 7, 2013
    Date of Patent: March 7, 2017
    Assignee: NANTONG FUJITSU MICROELECTRONICS CO., LTD.
    Inventors: Chang-Ming Lin, Lei Shi, Xiao-Chun Wu
  • SEMICONDUCTOR IC PACKAGING METHODS AND STRUCTURES
    Publication number: 20140124927
    Abstract: An IC packaging method is provided. The method includes providing a semiconductor substrate. The semiconductor substrate has a metal pad and an insulating layer and the insulating layer has an opening to expose the meal pad. The method also includes forming an under-the-ball meal electrode on the exposed metal pad. The under-the-ball metal electrode has an electrode body and an electrode tail, the electrode body is located at a bottom portion of the under-the-ball metal electrode and is in contact with the metal pad, and the electrode tail is located at a top portion of the under-the-ball meal electrode. Further, the method includes forming a solder ball on the under-the-ball metal electrode.
    Type: Application
    Filed: November 7, 2013
    Publication date: May 8, 2014
    Applicant: Nantong Fujitsu Microelectronics Co., Ltd.
    Inventors: CHANG-MING LIN, LEI SHI, XIAO-CHUN WU