Abstract: A packaging structure includes a substrate, a semiconductor temperature control device including opposed first and second surfaces, with first and second columnar electrodes protruding on the first surface, a semiconductor chip including opposed back and functional surfaces, with an external terminal being on the functional surface, a molding layer covering the semiconductor chip and semiconductor temperature control device and disposed on the upper surface of the substrate, and first and second external connection protrusions electrically connected to the first and second columnar electrodes, respectively, and a third external connection protrusion electrically connected to the external terminal. The second surface of the semiconductor temperature control device is mounted on an upper surface of the substrate. The back surface of the semiconductor chip is mounted on the first surface of the semiconductor temperature control device.

Abstract: A semiconductor device is made by calculating a thermal resistance matrix for the semiconductor device. A plurality of maximum junction temperatures for the plurality of die of the semiconductor device is selected. A plurality of power envelope surfaces are calculated for the semiconductor device based on the thermal resistance matrix and the maximum junction temperatures. A plurality of powers is selected for the plurality of die. The plurality of powers are compared against the plurality of power envelope surfaces to determine a plurality of risk values.

Abstract: The present disclosure may disclose methods and systems for treating an object. The method may include imaging an object fixed on a positioning device using an imaging device. The method may include obtaining a plan image of the object. The method may include generating information of a region of interest (ROI) of the object based on the plan image of the object. The method may include generating a treatment plan based on the information of the ROI. The treatment plan may include a plan isocenter on the plan image. The method may further include treating a target portion of the object based on the treatment plan using a treatment device. The object may be fixed on the positioning device from a moment that the object is started to fixed on the positioning device to an end of the treatment of the target portion.

Abstract: A method for classifying terms and conditions of legal documents is provided. The method includes the steps of: standardizing terms and conditions of all of the legal documents stored in a database; classifying the all of the legal documents having standardized terms and conditions into different categories according to different areas of practices; extracting universal terms and conditions of each of the categories; extracting universal terms and conditions of all of the legal documents in all categories; and extracting categorical terms and conditions of each of the categories.

Abstract: A method for emendation of attention trajectory in video content analysis is disclosed. The method includes steps of extracting attention area for each frame in a video sequence, each attention area of a frame selectively being a reference for the other frames, projecting the attention area of the reference to a current frame, and determining an enhanced attention area of the current frame by collecting and merging all the projected attention areas together with the original attention area of the current frame to emend the attention trajectory of the video sequence so as to make the attention trajectory smooth. Advantageously, short-life attention or noise is omitted, and the attention area is also enriched, therefore, the smooth of the attention trajectory improves subjective viewing experience of human being.