Abstract: An automatic soldering apparatus and a soldering method thereof are provided. The soldering method has steps of: (S1) positioning a to-be-soldered part and an electronic component having a solder material; (S2) driving a hot press to firstly move, until the hot press is in contact with the part; (S3) heating the solder material by the hot press; and (S4) driving the hot press to secondly move to press the solder material after the solder material on the electronic component is melted, so as to connect the part to the melted solder material on the electronic component by soldering. When the automatic soldering apparatus and the soldering method of the present invention are used to execute a soldering process, a route of the hot press can be controlled to firstly melt the solder material and then deform it, so as to avoid the hot press from impacting and damaging the part.