Patents by Inventor Xiao Li

Xiao Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10902015
    Abstract: Several replication subscriptions are defined for a table in a database management system. The table is divided into partitions. Each replication subscription replicates transactions to a range of partitions. Subscriptions are assignable to different consistency groups. Transaction consistency is preserved at the consistency group level. A persistent delay table is created for each of several apply functions. Each apply function processes replication subscriptions for one consistency group, to replicate the table to a target table in parallel. Transactions for a given range of a partition are executed in parallel. When an apply function upon a row of the target table results in an error, the row is stored in the delay table. Application of each row in the delay table is repeatedly retried, and if successful, the row is removed from the delay table.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: January 26, 2021
    Assignee: International Business Machines Corporation
    Inventors: Serge Bourbonnais, Austin F. M. D'Costa, Xiao Li, Jonathan W. Wierenga, Xin Wu, Christian Zentgraf, Xiang W. Zhou
  • Publication number: 20210014477
    Abstract: Embodiments provide a camera design (e.g., an eyeball camera) that mimics a human eye in geometry, optical performance and/or motion. The eyeball camera adopts the same cornea and pupil geometry from the human eye, and has the iris and pupil configured with multiple texture, color or diameter options. The resolution of the eyeball camera is designed to match the acuity of typical 20/20 human vision, and focus is adjusted from 0 to 4 diopters. A pair of eyeball cameras are mounted independently on two hexapods to simulate the human eye gaze and vergence. The perceived virtual and real world are calibrated and evaluated based on eye conditions like pupil location and gaze using the eyeball cameras. The eyeball camera serves as a bridge to combine the data from spatial computing like eye tracking, 3D geometry of the digital world, display color accuracy/uniformity, and display optical quality (sharpness, contrast, etc.).
    Type: Application
    Filed: July 10, 2020
    Publication date: January 14, 2021
    Applicant: Magic Leap, Inc.
    Inventors: Zhiheng Jia, Jeffrey Todd Daiker, Tim Ellis, Xiao Li, Jeremy A. Grata
  • Publication number: 20210010948
    Abstract: Strontium tetraborate can be used as an optical material. Strontium tetraborate exhibits high refractive indices, high optical damage threshold, and high microhardness. The transmission window of strontium tetraborate covers a very broad range of wavelengths, from 130 nm to 3200 nm, making the material particularly useful at VUV wavelengths. An optical component made of strontium tetraborate can be incorporated in an optical system, such as a semiconductor inspection system, a metrology system, or a lithography system. These optical components may include mirrors, lenses, lens arrays, prisms, beam splitters, windows, lamp cells or Brewster-angle optics.
    Type: Application
    Filed: July 6, 2020
    Publication date: January 14, 2021
    Inventors: Yung-Ho Alex Chuang, Yinying Xiao-Li, Elena Loginova, John Fielden
  • Patent number: 10881667
    Abstract: A method of treating a subject suffering from epilepsy includes administering an effective amount of a cholecystokinin-2 receptor antagonist or a pharmaceutical acceptable salt thereof to the subject. A pharmaceutical composition includes the cholecystokinin-2 receptor antagonist or a pharmaceutical acceptable salt thereof as active ingredient, one or more antiepileptic compounds, and a pharmaceutically acceptable excipient.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: January 5, 2021
    Assignee: City University of Hong Kong
    Inventors: Jufang He, Xiao Li, Ailian Tan, Yujie Peng, Shenghui Xu, Yujie Yang, Xu Zhang, MD. Monir Hossain
  • Patent number: 10868273
    Abstract: Display panel and display device are provided. The display panel includes: a display region and a non-display region surrounding the display region. The display region includes a light-emitting layer above a substrate, and a thin-film encapsulation layer is on a side of the light-emitting layer away from the substrate; the thin-film encapsulation layer includes at least one organic layer extending to the non-display region; and in a direction perpendicular to a plane of the substrate, a height of the at least one organic layer at a corner of the display region is greater than a height of the at least one organic layer at a side of the display region.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: December 15, 2020
    Assignee: WUHAN TIANMA MICRO-ELECTRONICS CO., LTD.
    Inventors: Linshan Guo, Jun Yan, Wenxin Jiang, Xiao Li
  • Patent number: 10865432
    Abstract: A system that indicates the presence or absence of microorganisms in fluid food products. The system has a bottle for receiving sample to be tested. The bottle has a sensor that will monitor and detect changes in at least one sample parameter, but no additives that contain nutrients that support microbial growth. The bottle is placed in an incubator and the sensor in the bottle is monitored for changes. The incubator is programed so that, if the sensor detects that the value of the monitored parameter has reached a certain value, then the sample is determined to be positive for microbial growth.
    Type: Grant
    Filed: May 26, 2015
    Date of Patent: December 15, 2020
    Assignee: BECTON DICKINSON HOLDINGS PTE LTD.
    Inventors: Xiao Li, Yan Zhang, Jianwei Liu
  • Publication number: 20200388481
    Abstract: A broadband ultraviolet illumination source for a characterization system is disclosed. The broadband ultraviolet illumination source includes an enclosure having one or more walls, the enclosure configured to contain a gas, and a plasma discharge device based on a graphene-dielectric-semiconductor (GOS) planar-type structure. The GOS structure includes a silicon substrate having a top surface, a dielectric layer disposed on the top surface of the silicon substrate, and at least one layer of graphene disposed on a top surface of the dielectric layer. A metal contact may be formed on the top surface of the graphene layer. The GOS structure has several advantages for use in an illumination source, such as low operating voltage (below 50 V), planar surface electron emission, and compatibility with standard semiconductor processes. The broadband ultraviolet illumination source further includes electrodes placed inside the enclosure or magnets placed outside the enclosure to increase the current density.
    Type: Application
    Filed: May 20, 2020
    Publication date: December 10, 2020
    Inventors: Yung-Ho Alex Chuang, Yinying Xiao-Li, Edgardo Garcia-Berrios, John Fielden
  • Publication number: 20200388967
    Abstract: An electrical connector includes an insulative housing defining a space. A connection module is received within the space. The connection module includes a pair of contact modules commonly sandwiching a grounding module therebetween in the transverse direction. Each contact module includes a plurality of contacts integrally formed within the corresponding insulative wafer via insert-molding. The grounding module includes a grounding plate embedded within an insulative wafer. The grounding plate forms a plurality of fingers respectively electrically and mechanically connecting to the corresponding grounding contacts of the contact modules. The wafer forms a plurality of transverse grooves to receive corresponding grounding bars each having a plurality of inward parts respectively mechanically and electrically connecting to the grounding plate, and a plurality of outward parts respectively mechanically and electrically connecting to the grounding contacts of the contact modules.
    Type: Application
    Filed: June 8, 2020
    Publication date: December 10, 2020
    Inventors: SHIH-WEI HSIAO, YU-SAN HSIAO, YEN-CHIH CHANG, WEI-CHOU LIN, YU-KE CHEN, MENG LIU, NA YANG, XIAO-LI LIU
  • Patent number: 10861765
    Abstract: A semiconductor device assembly having a semiconductor device attached to a substrate with a foil layer on a surface of the substrate. A layer of adhesive connects the substrate to a first surface of the semiconductor device. The semiconductor device assembly enables processing on the second surface of the semiconductor device. An energy pulse may be applied to the foil layer causing an exothermic reaction to the foil layer that releases the substrate from the semiconductor device. The semiconductor device assembly may include a release layer positioned between the foil layer and the layer of adhesive that connects the substrate to the semiconductor device. The heat generated by the exothermic reaction breaks down the release layer to release the substrate from the semiconductor device. The energy pulse may be an electric charge, a heat pulse, or may be applied from a laser.
    Type: Grant
    Filed: June 5, 2019
    Date of Patent: December 8, 2020
    Assignee: MICRON TECHNOLOGY, INC.
    Inventors: James M. Derderian, Andrew M. Bayless, Xiao Li
  • Patent number: 10860813
    Abstract: A server system includes a server rack having a plurality of slots, a plurality of servers and a plurality of memory cards. Each server is positioned on a respective slot of the server rack. Each memory card is programmed with information relating to a location of the respective server at the server rack. Each server comprises a controller and an interface coupled to the controller. The respective memory card is brought into an electrical connection with the interface to transmit the information relating to the corresponding location of the respective server to the controller.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: December 8, 2020
    Assignee: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
    Inventors: Xiao Le Shang, Xiao Li Yin, Xu Fei Zhang
  • Publication number: 20200355621
    Abstract: Strontium tetraborate is used as an optical coating material for optical components utilized in semiconductor inspection and metrology systems to take advantage of its high refractive indices, high optical damage threshold and high microhardness in comparison to conventional optical materials. At least one layer of strontium tetraborate is formed on the light receiving surface of an optical component's substrate such that its thickness serves to increase or decrease the reflectance of the optical component. One or multiple additional coating layers may be placed on top of or below the strontium tetraborate layer, with the additional coating layers consisting of conventional optical materials. The thicknesses of the additional layers may be selected to achieve a desired reflectance of the optical component at specific wavelengths. The coated optical component is used in an illumination source or optical system utilized in a semiconductor inspection system, a metrology system or a lithography system.
    Type: Application
    Filed: March 16, 2020
    Publication date: November 12, 2020
    Inventors: Yung-Ho Alex Chuang, Yinying Xiao-Li, Elena Loginova, John Fielden
  • Patent number: 10833455
    Abstract: An electrical connector includes a pair of opposite contact modules commonly sandwiching a grounding module therebetween in a transverse direction wherein each contact module includes two sided contacts on two sides of an insulator while the front mating sections and/or the bottom connecting sections of all the contacts are aligned in the same line. The contacts on each side of the insulator include a plurality of differential pair contacts and a plurality of grounding contacts alternately arranged with each other along the side face wherein the lengths of the pair of contacts in each differential pair essentially have the same length for reducing skewing effect by extending the body of the lower contact curvedly while keeping that of the upper contact essentially straight in each differential pair.
    Type: Grant
    Filed: December 29, 2019
    Date of Patent: November 10, 2020
    Assignees: FU DING PRECISION INDUSTRIAL (ZHENGHOU) CO., LTD., FOXONN INTERCONNECTY TECHNOLOGY LIMITED
    Inventors: Yen-Chih Chang, Shih-Wei Hsiao, Na Yang, Xiao-Li Liu, Meng Liu, Yu-Ke Chen
  • Patent number: 10830215
    Abstract: A modular gas-heat anti-icing method as well as a device for high-power wind turbine blades, wherein a modular heating system is provided on the blade root, a ventilation duct is provided inside the blade, a wind deflector is provided at the end of the ventilation duct, which divides the front edge of the blade into two parts, so that the hot air in the ventilation duct is only to be conducted to the blade tip and then circulates into the blade root via the rear edge of the blade, enabling the hot air to circulate inside the blade and form a “blade root to blade tip to blade root” closed loop, so that the purpose of heating the front edge of the blade is achieved, and it is ensured that the whole blade does not ice by preventing the front edge of the blade from icing.
    Type: Grant
    Filed: March 18, 2015
    Date of Patent: November 10, 2020
    Assignee: ZHUZHOU TIMES NEW MATERIALS TECHNOLOGY CO., LTD.
    Inventors: Jiangang Zhao, Wentao Yang, Chaoyi Peng, Jingcheng Zeng, Binbin Hou, Jiaotong Jin, Xiao Li
  • Publication number: 20200350224
    Abstract: Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a plurality of first semiconductor dies arranged in a stack and a second semiconductor die carrying the first semiconductor dies. The second semiconductor die can include a peripheral portion that extends laterally outward beyond at least one side of the first semiconductor dies. The semiconductor die assembly can further include a thermal transfer feature at the peripheral portion of the second semiconductor die. The first semiconductor dies can define a first thermal path, and the thermal transfer feature can define a second thermal path separate from the first semiconductor dies.
    Type: Application
    Filed: July 23, 2020
    Publication date: November 5, 2020
    Inventors: Steven K. Groothuis, Jian Li, Haojun Zhang, Paul A. Silvestri, Xiao Li, Shijian Luo, Luke G. England, Brent Keeth, Jaspreet S. Gandhi
  • Publication number: 20200350294
    Abstract: Apparatuses and methods for semiconductor die heat dissipation are described. For example, an apparatus for semiconductor die heat dissipation may include a substrate and a heat spreader. The substrate may include a thermal interface layer disposed on a surface of the substrate, such as disposed between the substrate and the heat spreader. The heat spreader may include a plurality of substrate-facing protrusions in contact with the thermal interface layer, wherein the plurality of substrate-facing protrusions are disposed at least partially through the thermal interface layer.
    Type: Application
    Filed: July 21, 2020
    Publication date: November 5, 2020
    Applicant: Micron Technology, Inc.
    Inventors: SAMEER S. VADHAVKAR, XIAO LI, ANILKUMAR CHANDOLU
  • Publication number: 20200335288
    Abstract: A waterproof button module includes a pressing element, a circuit board, an adhesive layer, and an elastic layer sequentially stacked. The adhesive layer is attached to the circuit board and the elastic layer. The adhesive layer includes a first opening, and the elastic layer includes a second opening. The first opening is aligned with the second opening and exposes a part of the rear surface of the circuit board. The adhesive layer has an annular zone adjacent to and surrounding the first opening. The annular zone directly contacts the circuit board. The waterproof button module further includes an electric-connection assembly and a switch. The electric-connection assembly is electrically connected to the circuit board, and passes through the first opening and the second opening. The switch is electrically connected to the circuit board, and has a button. In addition, an electronic device including the waterproof button module is disclosed.
    Type: Application
    Filed: April 16, 2020
    Publication date: October 22, 2020
    Inventors: XIAO LI, CHIH-YUAN CHEN, SHUN-LONG LEE
  • Publication number: 20200327852
    Abstract: Provided are a pixel driving circuit, a driving method, a display panel and a display device. The pixel driving circuit includes: a data writing device, a voltage stabilizing storage device, a driving device and a light-emitting component; where the data writing device is configured for transmitting a data signal voltage; the driving device is configured for generating a driving current according to the data signal voltage transmitted by the data writing device; the voltage stabilizing storage device is configured for storing the data signal voltage transmitted to the driving device; the light-emitting component is configured for emitting light in response to the driving current generated by the driving device; where the voltage stabilizing storage device includes at least two voltage stabilizing storage sub-devices connected in parallel, each voltage stabilizing storage sub-device includes a capacitor, at least one of the voltage stabilizing storage sub-devices includes a switch device.
    Type: Application
    Filed: June 29, 2020
    Publication date: October 15, 2020
    Inventors: Qitai JI, Qingjun LAI, Xiao LI
  • Patent number: 10804256
    Abstract: A semiconductor die assembly in accordance with an embodiment of the present technology includes first and second semiconductor dies and a package substrate carrying the first and second semiconductor dies. The second semiconductor die includes a first peripheral portion extending laterally outward beyond a first edge surface of the first semiconductor die. Similarly, the package substrate includes a second peripheral portion extending laterally outward beyond a second edge surface of the second semiconductor die. The semiconductor die assembly further includes a first volume of molded underfill material between the first and second semiconductor dies, a second volume of molded underfill material between the package substrate and the second semiconductor die, a first molded peripheral structure laterally adjacent to the first edge surface of the first semiconductor die, and a second molded peripheral structure laterally adjacent to the second edge surface of the second semiconductor die.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: October 13, 2020
    Assignee: Micron Technology, Inc.
    Inventors: Bradley R. Bitz, Xiao Li
  • Patent number: 10789038
    Abstract: Embodiments of the disclosure include an improved content streaming system that is configured to simplify and streamline the process of streaming media content from one or more content providers to one or more electronic devices. In some embodiments, the interaction of a user with one or more components in a content distribution system is used to initiate the streaming of media content to one or more content players from either a first content server or a second content server.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: September 29, 2020
    Assignee: LOGITECH EUROPE S.A.
    Inventors: James L. Thurman, John Dittlinger, William Johnson, Xiao Li, Yezhou Wang
  • Publication number: 20200291320
    Abstract: A regeneration method for a liquefied gas thiol-removing alkaline solution comprising the following steps: performing an oxygenation reaction with respect to a liquefied gas thiol-removing alkaline solution and, at the same time, utilizing a high air-liquid condition to extract a disulfide and a polysulfide into a gas phase, thus completing the separation of the disulfide and the polysulfide from the alkaline solution, and implementing the regeneration of the liquefied gas thiol-removing alkaline solution.
    Type: Application
    Filed: April 12, 2019
    Publication date: September 17, 2020
    Inventors: Xuesheng Hu, Fei Gao, Shengbao He, Yingwen Li, Xiao Li, Ming Fan, Weigang Dong, Jing Chen, Wei Li, Qing Hu, Yuan Wang, Huaqun Zhou