Patents by Inventor Xiao Liang Chen
Xiao Liang Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11289446Abstract: According to a first aspect of the present invention, there is provided a bond apparatus for bonding a wire to a bonding surface, comprising: a bond head body movably retained by a mounting portion; a first actuator; and a second actuator, wherein the bond head body has a tool portion configured to receive a bonding tool for receiving and bonding the wire and an actuator portion coupled with the first actuator and the second actuator, the first actuator and the second actuator being operative to act on the actuator portion for moving the bond head body with respect to the mounting portion to move the bonding tool with respect to the bonding surface.Type: GrantFiled: March 28, 2018Date of Patent: March 29, 2022Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Keng Yew Song, Yue Zhang, Xiao Liang Chen, Zheng Yu Lin
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Patent number: 11239197Abstract: A method for automatically threading wire in a wire bonding apparatus includes the steps of extending a wire tail of a wire from a wire spool, locating the wire tail in a wire locating device and positioning the wire tail at a straightening location of the wire locating device. The wire tail is straightened at the straightening location with a wire manipulating device and then conveyed to a threading location. With a wire threading device, the straightened wire tail is received at the threading location and is threaded through a capillary of the wire bonding apparatus.Type: GrantFiled: November 27, 2019Date of Patent: February 1, 2022Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Keng Yew Song, Yue Zhang, Xiao Liang Chen, Yao Tong
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Patent number: 11205634Abstract: A bonding apparatus has a bonding tool for bonding a wire to a bonding surface, a bonding tool retainer configured to releasably retain the bonding tool, a bonding tool holder configured to hold at least one bonding tool, a bonding tool manipulator configured to transfer said bonding tool between said bonding tool holder and said bonding tool retainer, and a bonding tool guide configured to guide said bonding tool to be received by said bonding tool retainer during transfer by said bonding tool manipulator.Type: GrantFiled: July 16, 2018Date of Patent: December 21, 2021Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Keng Yew Song, Yue Zhang, Xiao Liang Chen
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Patent number: 11205937Abstract: A driving system has a driving motor body operative to produce a driving force for driving an object to move in reciprocating directions. A pivotal support is located between the driving motor body and a machine base for supporting the driving motor body on the machine base. The pivotal support causes at least a portion of the driving motor body to rotate relative to the machine base in an opposite direction to a direction of the driving force produced by the driving motor body to drive the object, so as to reduce vibration transmission to the machine base.Type: GrantFiled: July 18, 2018Date of Patent: December 21, 2021Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Keng Yew Song, Ka Shing Kwan, Yue Zhang, Xiao Liang Chen, Chu Fan Feng
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Publication number: 20210159205Abstract: A method for automatically threading wire in a wire bonding apparatus includes the steps of extending a wire tail of a wire from a wire spool, locating the wire tail in a wire locating device and positioning the wire tail at a straightening location of the wire locating device. The wire tail is straightened at the straightening location with a wire manipulating device and then conveyed to a threading location. With a wire threading device, the straightened wire tail is received at the threading location and is threaded through a capillary of the wire bonding apparatus.Type: ApplicationFiled: November 27, 2019Publication date: May 27, 2021Inventors: Keng Yew SONG, Yue ZHANG, Xiao Liang CHEN, Yao TONG
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Publication number: 20200028407Abstract: A driving system has a driving motor body operative to produce a driving force for driving an object to move in reciprocating directions. A pivotal support is located between the driving motor body and a machine base for supporting the driving motor body on the machine base. The pivotal support causes at least a portion of the driving motor body to rotate relative to the machine base in an opposite direction to a direction of the driving force produced by the driving motor body to drive the object, so as to reduce vibration transmission to the machine base.Type: ApplicationFiled: July 18, 2018Publication date: January 23, 2020Inventors: Keng Yew SONG, Ka Shing KWAN, Yue ZHANG, Xiao Liang CHEN, Chu Fan FENG
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Publication number: 20200020661Abstract: A bonding apparatus has a bonding tool for bonding a wire to a bonding surface, a bonding tool retainer configured to releasably retain the bonding tool, a bonding tool holder configured to hold at least one bonding tool, a bonding tool manipulator configured to transfer said bonding tool between said bonding tool holder and said bonding tool retainer, and a bonding tool guide configured to guide said bonding tool to be received by said bonding tool retainer during transfer by said bonding tool manipulator.Type: ApplicationFiled: July 16, 2018Publication date: January 16, 2020Inventors: Keng Yew SONG, Yue ZHANG, Xiao Liang CHEN
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Publication number: 20190304947Abstract: According to a first aspect of the present invention, there is provided a bond apparatus for bonding a wire to a bonding surface, comprising: a bond head body movably retained by a mounting portion; a first actuator; and a second actuator, wherein the bond head body has a tool portion configured to receive a bonding tool for receiving and bonding the wire and an actuator portion coupled with the first actuator and the second actuator, the first actuator and the second actuator being operative to act on the actuator portion for moving the bond head body with respect to the mounting portion to move the bonding tool with respect to the bonding surface.Type: ApplicationFiled: March 28, 2018Publication date: October 3, 2019Inventors: Keng Yew SONG, Yue ZHANG, Xiao Liang CHEN, Zheng Yu LIN
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Patent number: 9640512Abstract: A wire bonding apparatus comprises an ultrasonic transducer including a capillary, a flexible connecting frame having a first side to which the ultrasonic transducer is connected and at least one electrically-driven actuator which is connected to a second side of the flexible connecting frame that is opposite to the first side thereof, the actuator having a longitudinal actuation direction. An elongated slit located in the flexible connecting frame extends substantially transversely to the actuation direction of the at least one actuator to form at least one pivot point adjacent to an end of the slit about which the flexible connecting frame is rotatable when it is driven by the at least one actuator.Type: GrantFiled: July 20, 2015Date of Patent: May 2, 2017Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Keng Yew Song, Ka Shing Kwan, Yue Zhang, Yan Dong Sun, Xiao Liang Chen
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Publication number: 20160023298Abstract: A wire bonding apparatus comprises an ultrasonic transducer including a capillary, a flexible connecting frame having a first side to which the ultrasonic transducer is connected and at least one electrically-driven actuator which is connected to a second side of the flexible connecting frame that is opposite to the first side thereof, the actuator having a longitudinal actuation direction. An elongated slit located in the flexible connecting frame extends substantially transversely to the actuation direction of the at least one actuator to form at least one pivot point adjacent to an end of the slit about which the flexible connecting frame is rotatable when it is driven by the at least one actuator.Type: ApplicationFiled: July 20, 2015Publication date: January 28, 2016Inventors: Keng Yew SONG, Ka Shing KWAN, Yue ZHANG, Yan Dong SUN, Xiao Liang CHEN
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Patent number: 8459530Abstract: Wire is fed to a bonding tool of a wire bonder by a pneumatic device that is operative to urge the wire to feed through an outlet of the pneumatic device towards the bonding tool. A wire clamp is located adjacent to the outlet of the pneumatic device and a wire guider with a hole is located adjacent to the wire clamp between the wire clamp and the bonding tool for threading the wire through the hole before being fed to the bonding tool.Type: GrantFiled: October 29, 2009Date of Patent: June 11, 2013Assignee: ASM Technology Singapore Pte LtdInventors: Yue Zhang, Keng Yew James Song, Xiao Liang Chen
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Publication number: 20120132695Abstract: A wire bonder comprises a bonding tool for forming wire bonds and a pneumatic device for feeding wire to the bonding tool. An upper clamp and a lower clamp are aligned along a wire feeding route between the pneumatic device and the bonding tool to clamp the wire at respective clamping points. A fixed intermediate guiding chamber extends substantially from the upper clamp to the lower clamp. The said intermediate guiding chamber encloses the wire along the wire feeding route and is operative to shield and guide the wire.Type: ApplicationFiled: November 30, 2010Publication date: May 31, 2012Inventors: Yue ZHANG, Xiao Liang CHEN, Keng Yew James SONG
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Publication number: 20110101073Abstract: Wire is fed to a bonding tool of a wire bonder by a pneumatic device that is operative to urge the wire to feed through an outlet of the pneumatic device towards the bonding tool. A wire clamp is located adjacent to the outlet of the pneumatic device and a wire guider with a hole is located adjacent to the wire clamp between the wire clamp and the bonding tool for threading the wire through the hole before being fed to the bonding tool.Type: ApplicationFiled: October 29, 2009Publication date: May 5, 2011Inventors: Yue ZHANG, Keng Yew James SONG, Xiao Liang CHEN
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Patent number: 7063545Abstract: An electrical connector (1) includes an insulative housing (10) and a number of terminal (20) received in the housing. The housing includes a mating portion (11), a number of upper and lower terminal receiving passageways (131, 132), a pair of sidewalls (14) extending rearwardly from the mating portion and a number of ribs (16) and recesses (17) formed between the pair of sidewalls. Each terminal includes a contact portion (21), an engaging portion (22) perpendicularly and downwardly extending from the contact portion, and a soldering portion (23) connecting with the engaging portion. The engaging portions (221, 222) of the terminals extend out of the upper and the lower terminal receiving passageways and are respectively retained in the recesses and abutting against the ribs. The ribs and the recesses form a better terminal positioning structure.Type: GrantFiled: September 9, 2004Date of Patent: June 20, 2006Assignee: Hon Hai Precision Ind. Co., Ltd.Inventors: Jin Ping Zu, Chun Sheng Li, Xiao Liang Chen, Feng Zhu
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Publication number: 20050054223Abstract: An electrical connector (1) includes an insulative housing (10) and a number of terminal (20) received in the housing. The housing includes a mating portion (11), a number of upper and lower terminal receiving passageways (131, 132), a pair of sidewalls (14) extending rearwardly from the mating portion and a number of ribs (16) and recesses (17) formed between the pair of sidewalls. Each terminal includes a contact portion (21), an engaging portion (22) perpendicularly and downwardly extending from the contact portion, and a soldering portion (23) connecting with the engaging portion. The engaging portions (221, 222) of the terminals extend out of the upper and the lower terminal receiving passageways and are respectively retained in the recesses and abutting against the ribs. The ribs and the recesses form a better terminal positioning structure.Type: ApplicationFiled: September 9, 2004Publication date: March 10, 2005Inventors: Jin Ping Zu, Chun Sheng Li, Xiao Liang Chen, Feng Zhu
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Publication number: 20030049024Abstract: The invention provides an electric fireplace flame simulator having a light source mounted within a rotatable hollow cylinder, the cylinder having flanged perforations that disperse heat from the light source and through which is projected a simulacrum of flames upon the cylinder being rotated about the light source. A light diffuser panel and other patterned and transparent screens are used to enhance the flame illusion. The simulator does away with the problems of an actual fire such as containment of the fire, smoke disposal, and fuel replenishment, while providing provides heat and an excellent illusion of a flame for a fireplace.Type: ApplicationFiled: September 7, 2001Publication date: March 13, 2003Applicant: Globaltec Distributors Ltd.Inventor: Xiao Liang Chen