Abstract: A method of assembling a semiconductor chip device is provided. The method includes providing a first circuit board that has a plurality of thermally conductive vias. A second circuit board is mounted on the first circuit board over and in thermal contact with the thermally conductive vias. The second circuit board includes first side facing the first circuit board and a second and opposite side.

Abstract: A method of assembling a semiconductor chip device is provided. The method includes providing a first circuit board that has a plurality of thermally conductive vias. A second circuit board is mounted on the first circuit board over and in thermal contact with the thermally conductive vias. The second circuit board includes first side facing the first circuit board and a second and opposite side.

Abstract: Various apparatus and methods of addressing crosstalk in a circuit board are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first layer of a circuit board with a first signal trace and forming a second layer of the circuit board with a second signal trace. A first guard trace is formed on the first layer and offset laterally from the first signal trace but at least partially overlapping the second signal trace and a second guard trace is formed on the second layer and offset laterally from the second signal trace but at least partially overlapping the first signal trace.

Abstract: Various apparatus and methods of addressing crosstalk in a circuit board are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first layer of a circuit board with a first signal trace and forming a second layer of the circuit board with a second signal trace. A first guard trace is formed on the first layer and offset laterally from the first signal trace but at least partially overlapping the second signal trace and a second guard trace is formed on the second layer and offset laterally from the second signal trace but at least partially overlapping the first signal trace.

Abstract: Various apparatus and method of packaging semiconductor chips are disclosed. In one aspect, a method of manufacturing is provided that includes placing a semiconductor chip package into a mold. The semiconductor chip package includes a substrate that has a side and a first semiconductor chip coupled to the side in spaced apart relation to define a space between the first semiconductor chip and the side. A second semiconductor chip is mounted on the first semiconductor chip. At least one conductor wire is electrically coupled to the second semiconductor chip and the substrate. A molding material is introduced into the mold to flow into the space and establish an underfill and encapsulate the first semiconductor chip and the second semiconductor chip.