Abstract: The present utility model discloses a multi-position change-over device and a multi-side socket with it, wherein each of at least three sides of a core frame is arranged with a first slot and a second slot which are paired; meanwhile, the first slots located on two adjacent sides are intersected to form the first mounting grooves used for installing a first conducting sheet and the second slots located on two adjacent sides are intersected to form the second mounting grooves used for installing a second conducting sheet so that the first slots located on two adjacent sides share one first conducting sheet and the second slots located on two adjacent sides share one second conducting sheet in order to make the core frame smaller, save the consumption of the first conducting sheet and the second conducting sheet and improve the assembly efficiency and thus make the whole multi-side socket smaller, more exquisite, easier to carry and cost-lower.

Abstract: A multi-position conversion device and a conversion socket with the multi-position conversion device; the first pin, the second pin, the first connecting sheet and the second connecting sheet are installed together onto the main frame to modularize and integrate the conversion device; therefore, only one main frame is needed to complete the installation of the first pin, the second pin, the first connecting sheet and the second connecting sheet, and this can effectively decrease the volume of the multi-position conversion device and thus decrease the volume and weight of the whole conversion socket, prevent the conversion socket from sagging due to gravity and thus increase the corresponding user experience and safety; meanwhile, after being modularized, the multi-position conversion device is installed directly into the housing and thus can decrease the assembling steps, reduce the assembling difficulty and finally improve the assembling efficiency.

Abstract: A multi-position conversion device and a conversion socket with the multi-position conversion device; the first pin, the second pin, the first connecting sheet and the second connecting sheet are installed together onto the main frame to modularize and integrate the conversion device; therefore, only one main frame is needed to complete the installation of the first pin, the second pin, the first connecting sheet and the second connecting sheet, and this can effectively decrease the volume of the multi-position conversion device and thus decrease the volume and weight of the whole conversion socket, prevent the conversion socket from sagging due to gravity and thus increase the corresponding user experience and safety; meanwhile, after being modularized, the multi-position conversion device is installed directly into the housing and thus can decrease the assembling steps, reduce the assembling difficulty and finally improve the assembling efficiency.

Abstract: A sputtering target includes an indium cerium zinc oxide represented by In2CexZnO4+2x, wherein x=0.5˜2. A relative density of the sputtering target is larger than or equal to 90%. A bulk resistance of the sputtering target in a range from about 10?2 ?cm to about 10 ?cm. A weight percentage of crystalline In2CexZnO4+2x in the sputtering target is larger than 80%.

Abstract: A sputtering target includes an indium cerium zinc oxide represented by In2CexZnO4+2x, wherein x=0.5˜2. A relative density of the sputtering target is larger than or equal to 90%. A bulk resistance of the sputtering target in a range from about 10?2 ?cm to about 10 ?cm. A weight percentage of crystalline In2CexZnO4+2x in the sputtering target is larger than 80%.

Abstract: A sputtering target includes an indium cerium zinc oxide represented by In2CexZnO4+2x, wherein x=0.5˜2. A method for making a sputtering target includes steps of: mixing indium oxide (In2O3) powder, cerium oxide (CeO2) powder, and zinc oxide (ZnO) powder to form a mixture, a molar ratio of indium (In), cerium (Ce), and zinc (Zn) as In:Ce:Zn in the mixture is 2:(0.5 to 2):1; and sintering the mixture at a temperature in a range from about 1250° C. to about 1650° C.

Abstract: A tin oxide sputtering target includes uniformly mixed elemental Sn and SnO2. An atomic ratio of Sn atoms and O atoms in the tin oxide sputtering target satisfies 1:2<Sn:O?2:1. A method for making a tin oxide sputtering target includes steps of: providing Sn powder and SnO2 powder; mixing the Sn powder and the SnO2 powder to form a mixture, an atomic ratio of Sn atoms and O atoms in the mixture satisfies 1:2<Sn:O?2:1; and press-molding and sintering the mixture to obtain a tin oxide sputtering target, the sintering is performed in an inert atmosphere.

Abstract: A sputtering target includes an indium cerium zinc oxide represented by In2CexZnO4+2x, wherein x=0.5˜2. A method for making a sputtering target includes steps of: mixing indium oxide (In2O3) powder, cerium oxide (CeO2) powder, and zinc oxide (ZnO) powder to form a mixture, a molar ratio of indium (In), cerium (Ce), and zinc (Zn) as In:Ce:Zn in the mixture is 2:(0.5 to 2):1; and sintering the mixture at a temperature in a range from about 1250° C. to about 1650° C.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of a heat pipe requiring testing. A movable portion is capable of moving relative to the immovable portion and has a heating member therein for heating the evaporating section of the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A positioning structure extends from the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion and a movable portion each having a heating member located therein for heating an evaporating section of the heat pipe. The movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section therein. A positioning structure extends from the immovable portion toward the movable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable and movable portions for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space therein for movement of the movable portion relative to the immovable portion.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of a heat pipe requiring testing. A movable portion is capable of moving relative to the immovable portion and has a heating member therein for heating the evaporating section of the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A positioning structure extends from the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion and a movable portion each having a heating member located therein for heating an evaporating section of the heat pipe. The movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section therein. A positioning structure extends from the immovable portion toward the movable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable and movable portions for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space therein for movement of the movable portion relative to the immovable portion.