Abstract: Solder materials and microelectronic devices and systems deploying the solder materials are discussed. The solder material includes a bulk material of tin and bismuth and particles interspersed in the tin and bismuth bulk material. The particles are a metal other than tin and bismuth, and an intermetallic compound is formed around the particles. The intermetallic compound includes the metal of the particles and tin or bismuth. The solder materials are deployed as interconnect structures to interconnect components, such as electrically coupling an integrated circuit package to a motherboard.

Abstract: In one embodiment, an integrated circuit device includes a substrate and a component coupled to the substrate. The substrate includes first reservoirs comprising Gallium-based liquid metal (LM), second reservoirs, first channels between the first reservoirs, and second channels between the second reservoirs and respective first reservoirs. The component includes circuitry and conductive contacts connected to the circuitry. Each contact defines a cavity and a portion of each conductive contact is within a respective first reservoir of the substrate such that it is in contact with the LM in the first reservoir. The component further includes dielectric lines between the conductive contacts, and each dielectric line is at least partially within a respective first channel of the substrate.

Abstract: An integrated circuit (IC) device includes a device substrate with front- and backside IC dies and an integrated heat spreader over the backside die. The heat spreader and the backside die may be coupled to the backside of the device substrate within an array of contacts. The backside heat spreader may include a mask layer over a thermally conductive layer. The IC device may include or be coupled to second substrate (such as a motherboard). The backside heat spreader may be thermally coupled to a heat spreader or heat sink by vias through the second substrate. The backside heat spreader may enclose the backside IC die in an electrically conductive cage.

Abstract: Embodiments include an apparatus with interconnects that have different structures. In an embodiment, the apparatus comprises a substrate and a first interconnect on the substrate, a second interconnect on the substrate, and a third interconnect on the substrate. In an embodiment, the first interconnect, the second interconnect, and the third interconnect are all different from each other.

Abstract: The present invention discloses a communication method having data transmission sorting mechanism. Whether an object under process is a mobile terminated object is determined. When the object under process is the mobile terminated object, a processing priority is set to be the highest priority, a receiving process is performed and response content is generated when required. When the object under process is a mobile originated object, a transmission process is performed, the processing priority is set according to a processing priority setting of a related transmission entity and the mobile originated object is added to a transmission list. When an object transmission is not able to be performed, the response content is added to a response list. When the object transmission is able to be performed, the response content in the response list is transmitted first and the mobile originated object in the transmission list is transmitted subsequently.

Abstract: Embodiments disclosed herein include socket interconnects with liquid metal. In an embodiment, a board comprises a substrate. A pad may be provided over the substrate. In an embodiment, a confinement layer is over the substrate, where the confinement layer defines a cavity over the pad. In an embodiment, a liquid metal is on the pad within the cavity. In an embodiment, a protective layer is provided over the liquid metal.

Abstract: A method and an apparatus for controlling a shutoff device, and a shutoff device. The shutoff device includes N main switching transistors and N bypass switching transistors. The method includes: controlling the N main switching transistors to be turned on after receiving a heartbeat signal; determining whether a power supply voltage of a processor is less than a first under-voltage protection voltage; and if so, controlling the N main switching transistors to be turned off, and controlling the N bypass switching transistors to be turned on. Thus, N photovoltaic modules and N main switching transistors corresponding to a shutoff device are separated from multiple photovoltaic module groups, so that the photovoltaic module groups corresponding to other shutoff devices can normally output DC voltage to an inverter, and the inverter can normally output AC power for integration into a power grid, thereby ensuring the normal operation of the photovoltaic system.

Abstract: A method and an apparatus for controlling a shutoff device, and a shutoff device. The method is applied to a processor of the shutoff device. The method includes: determining whether a heartbeat signal is received continuously during a first preset period; if so, controlling the N main switching transistors to be turned on, and determining whether the heartbeat signal is not received continuously during a second preset period; and if so, controlling the N main switching transistors to be turned off, and controlling the release circuit to be turned on to release a voltage on the bus. A release circuit is controlled to release voltage on the bus to the ground, thereby rapidly reducing the voltage on the bus, avoiding person danger and safety accidents caused by the long-term presence of the direct current high voltage on the bus, and improving the safety and reliability of a photovoltaic system.

Abstract: Systems and method are provided for fraud detection and user account deduplication. One method includes receiving a request from a user to register a third user account; receiving user information associated with the third user account, wherein the user information comprises a second attribute; at a third time entry, modifying the first data store by: searching the plurality of first entries in the first data store; comparing the second attribute to the first attribute of each first entry; determining that at least one first entry comprises a first attribute that is identical to the second attribute; adding second and third entries, wherein the second entry comprises the first and third user accounts, the second attribute, and the first and third time entries; and the third entry comprises the second and third user accounts, the second attribute, and the second and third time entries.

Abstract: Embodiments of the disclosure provide a media interaction method and apparatus, a device, and a storage medium. The method includes: displaying, in a first user interface, information about media content to be disclosed and a first interaction element used for reserving the media content; and presenting a second user interface in response to selection of the first interaction element, wherein the second user interface is at least displayed with: disclosure time information of the media content and a list of media items associated with the media content, wherein a media item that has been at least partially disclosed and a media item that has not been disclosed are displayed in different visual styles.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate; a second substrate; and an array of interconnects electrically coupling the first substrate to the second substrate. In an embodiment, the array of interconnects comprises first interconnects, wherein the first interconnects have a first volume and a first material composition, and second interconnects, wherein the second interconnects have a second volume and a second material composition, and wherein the first volume is different than the second volume and/or the first material composition is different than the second material composition.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate; a second substrate; and an array of interconnects electrically coupling the first substrate to the second substrate. In an embodiment, the array of interconnects comprises first interconnects, wherein the first interconnects have a first volume and a first material composition, and second interconnects, wherein the second interconnects have a second volume and a second material composition, and wherein the first volume is different than the second volume and/or the first material composition is different than the second material composition.

Abstract: In an example in accordance with the present disclosure, a system is described. The system includes a process monitor. The process monitor identifies a computing process to monitor and monitors a process characteristic of a monitored computing process. The system also includes a controller. The controller compares the process characteristic to threshold criteria for the process characteristic to identify an inactive computing process. Responsive to the identification of an inactive computing process, the controller also takes a remedial action to address the inactivity.

Abstract: A liquid metal (LM) dispensing apparatus and method for design and fabrication thereof. Components of the LM dispensing apparatus are designed and tooled based on a target pinout (e.g., a number of, arrangement of, and dimensions of, holes in a substrate to have LM injected therein) and desired LM material. Embodiments employ detachably attached needles using a locking means to provide leak-free interchangeability of the needles. The flexibility with needles makes replacing damaged needles more perfunctory. Embodiments contour the LM reservoir to enhance uniform LM flow to the needles and dispense or inject LM from multiple detachably attached needles concurrently.

Abstract: The present disclosure provides a log information obtaining system and method. The log information obtaining system includes a baseboard management controller (BMC), a storage device, a first interface, a controller and a first selector. The storage device stores log information of the electronic device. The controller obtains a first signal of the BMC and determines the working state of the BMC, the controller outputs a first selection signal when the working state of the BMC is abnormal. The first selector selects the first output terminal to output the log information received from the first input terminal to the external device. Even if the BMC cannot work normally, it can still obtain the log information of the electronic device and debug the electronic device.

Abstract: A data center security control module able to connect with motherboards of different platforms such as Intel platform, AMD platform, and Ampere platform includes a baseboard management controller (BMC), a chip selection module, and a control module. The BMC outputs an alarm signal. The chip selection module includes N chip selection units, the chip selection unit outputting alarm signal to an external motherboard which is connected to the data center security control module. The control module obtains information as to motherboard type being Intel platform, or AMD platform, or Ampere platform and outputs a control signal to the chip selection module according to the motherboard type to start the chip selection unit associated with such motherboard type. The application also provides a data center security control module control method.

Abstract: In one embodiment, a direct injection device includes a head, a plunger, a reservoir, and multiple needles. The head controls extrusion of liquid stored in the reservoir of the direct injection device. For example, the head causes the plunger to compress the liquid in the reservoir, which causes the liquid to be extruded through the needles.

Abstract: A microelectronic structure, a semiconductor package including the same, and a method of forming same. The microelectronic structures includes: a substrate defining a cavity therein; a bridge die within the cavity, the bridge die to electrically couple a pair of dies to be provided on a surface of the substrate; an electrical coupling layer between a top surface of the cavity and a bottom surface of the bridge die. The electrical coupling layer includes: a non-conductive component including a die bonding film and defining holes therein; and electrically conductive structures in the holes, the electrically conductive structures electrically coupling the substrate with the bridge die.

Abstract: In one embodiment, an integrated circuit apparatus comprises a substrate that includes electrical contacts on a first side of the substrate to couple the substrate to an integrated circuit die, a passivation layer on a second side of the substrate opposite the first side, metal pads on the second side of the substrate and within openings defined by the passivation layer, and solder bumps on the metal pads. The solder bumps are a material that is resistant to Gallium-based liquid metal embrittlement.

Abstract: A board mis-insertion prevention circuit includes a first detection circuit, a second detection circuit, and a control module. The first detection circuit detects whether a board is in a first state and outputs a first detection signal when the board is in the first state. The second detection circuit detects whether the board is in a second state when the board is not in the first state, and outputs a second detection signal when the board is in the second state. The control module receives the first detection signal or the second detection signal and can allow or disconnect a power supply to the board according to the first detection signal or the second detection signal.