Abstract: A lens module includes a photosensitive chip, a hollow mounting frame, a filter, a lens holder, a lens, and a circuit board defining a first through hole and comprising a first surface and an opposite second surface. The photosensitive chip is installed on the first surface facing. The first surface includes electronic components and gold fingers installed thereon. One side of the photosensitive chip includes an electrical coupling portion electrically coupled to the gold fingers. The circuit board further includes an injection molding layer integrally formed onto the first surface. The injection molding layer seals the electronic components and the photosensitive chip therein. The mounting frame is fixed onto the second surface of the circuit board. The lens is installed within the lens holder. The lens holder is fixed onto a surface of the mounting frame facing away from the circuit board.

Abstract: A voice coil motor strongly attached to the base of a camera module comprises the base and a casing. The casing and the base are interlocked with each other. The casing is a hollow structure. The casing comprises a top surface and a side wall surrounding the top surface. The side wall and the base are engaged with each other. The side wall is extended in parts to form at least one extending leg. The extending leg extends to a side of the base away from the top surface and is bent toward the base.

Abstract: A robust and repairable lens module adaptable in size and height for different electronic devices includes a lens holder and a lens unit. The lens holder and the lens unit are both detachable. The lens holder defines a receiving hole with double threads to mount the lens unit in the receiving hole. A gap exists between the threads to allow equalization of pressure in the lens module with ambient air pressure. An electronic device applying such a lens module is also provided.

Abstract: A voice coil motor in a camera module with a means of being mounted robustly on a base comprises a casing and the base. The casing is hollow, the casing comprises a top surface and a side wall around the top surface. The base comprises a base portion and projections, the base portion being in contact with the side wall of the casing and engaged with the casing to form a cavity. The side wall is provided with recesses external to the cavity to accept the projections, the projections lending structural reinforcement to the casing.

Abstract: A camera module of minimal size but with zoom function includes a zoom assembly, a base, and a fixed focus assembly. The zoom assembly and the fixed focus assembly are fixed in the base. The zoom assembly is driven by piezoelectric element instead of voice coil motor and includes an actuator and an optical unit. The actuator defines a first receiving groove holding the optical unit in place over the first through hole. When powered, the piezoelectric element changes a shape of the optical unit to change a focal length of the zoom assembly. An electronic device including such a camera module is also provided.

Abstract: A lens module includes a circuit board, a carrier, and an optical filter. The carrier is fixed on a surface of the circuit board. The carrier defines a through hole. The optical filter is mounted on the carrier. The carrier defines at least one gas escape structure. A receiving space is between the optical filter and the circuit board, and the gas escape structure communicates with the receiving space to release water vapor in the receiving space and allow air pressure equalization and thus the relief of stress. The disclosure further provides an electronic device including the lens module.

Abstract: A camera module includes a circuit board, an image sensor, a lens holder, and a lens. The image sensor is arranged on the circuit board. The lens holder is covered over the image sensor. The lens is arranged on the lens holder. The lens holder is adhered to the circuit board by a colloid. The lens holder includes a projection on a side of the lens holder facing the circuit board. The projection is embedded within the colloid.

Abstract: An imaging chip packaging structure includes a circuit substrate, an imaging chip, and a pedestal. The circuit substrate has a first through hole extending through the circuit substrate. The imaging chip comprises a photosensitive area, and the first through hole through the substrate exposes the photosensitive area. The pedestal is integrated with the circuit substrate. The pedestal is formed on a first surface of the circuit substrate and comprises a second through hole on an optical path of the light reaching the imaging chip.

Abstract: A camera includes a bracket, a lens base, a lens, a filter, a circuit board, and a photosensitive, chip. The bracket defines a first receiving space, a second receiving space, and a through hole. The through hole is in communication with the first receiving space and the second receiving space. The lens is mounted on the lens base. The filter is received within the first receiving space. The circuit board is mounted on the side of the bracket defining the second receiving space. The photosensitive chip mounted on the circuit board faces the through hole. The bracket includes a heating member and two conductive circuits. The filter is mounted on the heating member such that a periphery of the filter is in contact with the heating member. Each of the two conductive circuit layers is electrically coupled between the heating member and the circuit board to heat the filter.

Abstract: A lens module with compact appearance includes a circuit board, an image sensor, a package bracket, an optical filter, and a lens unit. The circuit board defines a first receiving groove for receiving the image sensor. The circuit board has electronic components and gold fingers on one surface. Metallic wires are arranged on edges of a surface of the image sensor. The package bracket is integrally formed on the circuit board to wrap the electronic components, the gold fingers, and the metallic wires therein. The optical filter is connected to surface of the package bracket facing away from the circuit board. The lens unit includes a hollow lens holder and a lens mounted in the lens holder. The lens holder is connected to the surface of the mounting frame facing away from the circuit board.

Abstract: A lens module includes a photosensitive chip, a hollow mounting frame, a filter, a lens holder, a lens, and a circuit board defining a first through hole and comprising a first surface and an opposite second surface. The photosensitive chip is installed on the first surface facing. The first surface includes electronic components and gold fingers installed thereon. One side of the photosensitive chip includes an electrical coupling portion electrically coupled to the gold fingers. The circuit board further includes an injection molding layer integrally formed onto the first surface. The injection molding layer seals the electronic components and the photosensitive chip therein. The mounting frame is fixed onto the second surface of the circuit board. The lens is installed within the lens holder. The lens holder is fixed onto a surface of the mounting frame facing away from the circuit board.

Abstract: A lens module with physically stronger foundations and enhanced stability includes a circuit board, an image sensor thereon, a mounting bracket, an optical filter, and a lens unit. The mounting bracket is connected to the surface of the circuit board which has the image sensor. The optical filter is connected to mounting bracket and positioned above the image sensor. The lens unit is connected to the mounting bracket facing away from the circuit board through a frame of adhesive. The surface of the lens unit connected to the mounting bracket has protrusions which are positioned at inner edges of the adhesive layer. The protrusions are taller than the depth of the adhesive layer.

Abstract: A camera device proofed against ghosting and light flare includes a printed circuit board, an image sensor mounted on the printed circuit board, a supporting bracket fixed on the printed circuit board, and a lens module. The supporting bracket includes supporting plate and perpendicular side wall, the supporting plate and the side wall together forming a receiving room over the image sensor. The supporting plate has a central through hole for light ingress and a flange barrier protruding. The protruding flange barrier surrounds the light through hole, the lens module is fixed on the supporting surface, and the protruding flange barrier locates inside an inner side surface of the lens module.

Abstract: An imaging device proofed against ghosting and flaring in captured images includes a lens barrel and a lens module received in the lens barrel. The lens barrel comprises an inner surface and a supporting portion extending radially from the inner wall surface. The supporting portion has through hole for light entry, the through hole comprises a reflecting surface, the supporting portion comprises a top surface and a bottom surface, the reflecting surface connects the top surface and the bottom surface, and a plurality of light-scattering structures are formed on the reflecting surface.

Abstract: A lens module with physically stronger foundations and enhanced stability includes a circuit board, an image sensor thereon, a mounting bracket, an optical filter, and a lens unit. The mounting bracket is connected to the surface of the circuit board which has the image sensor. The optical filter is connected to mounting bracket and positioned above the image sensor. The lens unit is connected to the mounting bracket facing away from the circuit board through a frame of adhesive. The surface of the lens unit connected to the mounting bracket has protrusions which are positioned at inner edges of the adhesive layer. The protrusions are taller than the depth of the adhesive layer.

Abstract: A camera module which is sealed and given protection against damage from forcible impacts includes a lens module, a lens tube, and a protecting cover. The lens module has lens screw threads on its outer wall. The lens tube includes a lens receiving space, the lens module is received in the lens receiving space, lens tube screw threads are formed on an inner wall of the lens receiving space. The lens tube screw threads match the lens screw threads. The protecting cover includes a cushioning portion and a dustproofing portion. The cushioning portion and the dustproofing portion are attached to and cover the outer exposed surfaces of the lens tube. The dustproofing portion covers the lens thread and the lens tube screw threads.

Abstract: An imaging chip packaging structure includes a circuit substrate, an imaging chip, and a pedestal. The circuit substrate has a first through hole extending through the circuit substrate. The imaging chip comprises a photosensitive area, and the first through hole through the substrate exposes the photosensitive area. The pedestal is integrated with the circuit substrate. The pedestal is formed on a first surface of the circuit substrate and comprises a second through hole on an optical path of the light reaching the imaging chip.

Abstract: A lens module with compact appearance includes a circuit board, an image sensor, a package bracket, an optical filter, and a lens unit. The circuit board defines a first receiving groove for receiving the image sensor. The circuit board has electronic components and gold fingers on one surface. Metallic wires are arranged on edges of a surface of the image sensor. The package bracket is integrally formed on the circuit board to wrap the electronic components, the gold fingers, and the metallic wires therein. The optical filter is connected to surface of the package bracket facing away from the circuit board. The lens unit includes a hollow lens holder and a lens mounted in the lens holder. The lens holder is connected to the surface of the mounting frame facing away from the circuit board.

Abstract: A voice coil motor of reduced thickness includes a pedestal and a housing. The side walls of the pedestal are formed with a metal sheet. The housing includes top and side plates, the side plates perpendicularly extending from an edge of the top plate. The side plate is notched, the housing covers the pedestal, and the at least one notch exposes a portion of the metal sheet for purposes of attachment between fixation area the housing and the pedestal fixation area.

Abstract: A small-scale camera device with heat-dissipating properties includes a pedestal bracket and a camera module mounted on the pedestal bracket. The pedestal bracket includes a top plate and a side plate extending perpendicularly from edges of the top plate. The side plate includes an inner side surface and an outer side surface opposite to the inner side surface. The bottom of the side plate defines a plurality of first receiving recesses, each of the first receiving recesses carries a heat dissipation member.