Patents by Inventor Xiao Peng

Xiao Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020118081
    Abstract: An electronic filter includes a substrate, a ground conductor, a plurality of linear microstrips positioned on a the substrate with each having a first end connected to the ground conductor. A capacitor is connected between a second end of the each of the linear microstrips and the ground conductor. A U-shaped microstrip is positioned adjacent the linear microstrips, with the U-shaped microstrip including first and second extensions positioned parallel to the linear microstrips. Additional capacitors are connected between a first end of the first extension of the U-shaped microstrip and the ground conductor, and between a first end of the second extension of the U-shaped microstrip and the ground conductor. Additional U-shaped microstrips can be included. An input can coupled to one of the linear microstrips or to one of the extensions of the U-shaped microstrips. An output can be coupled to another one of the linear microstrips or to another extension of one of the U-shaped microstrips.
    Type: Application
    Filed: November 13, 2001
    Publication date: August 29, 2002
    Inventors: Xiao-Peng Liang, Yongfei Zhu
  • Publication number: 20020105083
    Abstract: An electronic module includes an interconnect module having a plurality of metal layers separated by a plurality of dielectric layers in a stacked structure with electronic components mounted on one surface of the module. The electronic components are selectively interconnected by drilling via holes completely through all dielectric layers with a conductive material such as solder in each via contacting metal layers to be interconnected and each metal layer which is not connected by a via having a metal pattern devoid of metal at the via location. For via connecting non-ground layers, there will be a patch of solder mask on the backside ground layer to electrically prevent this via from inadvertently connecting to ground.
    Type: Application
    Filed: February 1, 2002
    Publication date: August 8, 2002
    Applicant: EiC Corporation
    Inventors: Xiao-Peng Sun, Nanlei Larry Wang
  • Publication number: 20020097112
    Abstract: A method is provided for operating a duplexer including a first tunable bandpass filter, a second tunable bandpass filter and means for coupling the first bandpass filter and the second bandpass filter to an antenna. The method comprises the steps of tuning the first tunable bandpass filter to provide a passband corresponding to an assigned transmit frequency, and tuning the second tunable bandpass filter to provide a passband offset from an assigned receive frequency, when the duplexer is operated in a transmit mode. When the duplexer is operated in a receive mode, the first tunable bandpass filter is tuned to provide a passband offset from an assigned transmit frequency and the second tunable bandpass filter is tuned to provide a passband corresponding to the assigned receive frequency.
    Type: Application
    Filed: November 2, 2001
    Publication date: July 25, 2002
    Inventors: Xiao-Peng Liang, John Robinson
  • Publication number: 20020097094
    Abstract: A hybrid microwave and millimeter wave integrated circuit (MMIC) RF power amplifier includes an integrated circuit in which an amplifier circuit is fabricated and an output impedance matching network comprising metal-insulator-metal (MIM) capacitors mounted on the integrated circuit chip with bonding wire inductors connecting the amplifier circuit with the capacitor elements. The resulting structure has a smaller form factor as compared to conventional power amplifiers employing planar transmission lines and surface mount technology capacitors.
    Type: Application
    Filed: January 19, 2001
    Publication date: July 25, 2002
    Applicant: EiC Corporation
    Inventors: Nanlei Larry Wang, Shuo-Yuan Hsiao, Xiao-Peng Sun
  • Patent number: 6424223
    Abstract: A hybrid microwave and millimeter wave integrated circuit (MMIC) RF power amplifier includes an integrated circuit in which an amplifier circuit is fabricated and an output impedance matching network comprising metal-insulator-metal (MIM) capacitors mounted on the integrated circuit chip with bonding wire inductors connecting the amplifier circuit with the capacitor elements. The resulting structure has a smaller form factor as compared to conventional power amplifiers employing planar transmission lines and surface mount technology capacitors.
    Type: Grant
    Filed: January 19, 2001
    Date of Patent: July 23, 2002
    Assignee: EiC Corporation
    Inventors: Nanlei Larry Wang, Shuo-Yuan Hsiao, Xiao-Peng Sun
  • Publication number: 20020084874
    Abstract: A dielectric loaded cavity filter having a housing and a cover and defining at least two adjacent cavities having respective dielectric resonators mounted therein and separated by a transverse partition defining a coupling window in the housing. In one form, the coupling window has two spaced opposing sidewalls confronting each other, and vertically offset shoulders intermediate their length. A conductive coupling strip is secured to the shoulder of one sidewall and extends across the coupling window and over the shoulder of the other sidewall. A tuning screw is secured by threading to the housing and has an outer free end accessible from the exterior of the filter, and an internal end disposed adjacent the coupling strip, whereby when the tuning screw is rotated, the internal end of the screw moves toward and away from the coupling strip in a direction perpendicular to the cover for tuning without requiring access to the coupling strip.
    Type: Application
    Filed: February 19, 2002
    Publication date: July 4, 2002
    Inventors: Xiao-Peng Liang, Michael Buttler
  • Patent number: 5805033
    Abstract: A dielectric resonator loaded cavity filter comprises a housing having an exterior and an interior, the housing interior including at least two adjacent cavities having dielectric resonators mounted therein. The adjacent cavities are separated by a transverse partition having a coupling window therein, the coupling window having first and second spaced opposing sidewalls. In one embodiment a coupling disk is interposed between opposing sidewalls of the transverse partition. In another embodiment a coupling strip extends from a shoulder portion of a first opposing sidewall toward a shoulder portion of a second opposing sidewall.
    Type: Grant
    Filed: February 26, 1996
    Date of Patent: September 8, 1998
    Assignee: Allen Telecom Inc.
    Inventors: Xiao-Peng Liang, Jennifer C. Nugent