Patents by Inventor Xiao-Qiong Liao

Xiao-Qiong Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10074941
    Abstract: A high-speed connector includes an insulating body, an insulating cap, two terminal sets and two shielding sheets. The insulating body includes a body portion and a tongue plate. The tongue plate divides the interior of the body portion into two accommodating spaces. The insulating cap is fitted around the front end of the tongue plate of the insulating body. Each of the two terminal sets includes a terminal base and a plurality of terminals. The two shielding sheets are disposed on one side of each of the two terminal sets respectively. A plurality of ground ports is disposed on one side of each shielding sheet respectively, in which the plurality of ground ports contacts the plurality of ground terminals of the plurality of terminals of each terminal set so that the two shielding sheets form ground shielding with the ground terminals of each terminal set respectively.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: September 11, 2018
    Assignee: NEXTRONICS ENGINEERING CORP.
    Inventors: Hou-An Su, Hung-Wei Hsu, Chang-Fa Yang, Xiao-Qiong Liao, Mei-Jie Zhou
  • Patent number: 8197282
    Abstract: A small form-factor pluggable (SFP) connector structure is disclosed. The SFP connector structure comprises an insulating body, a plurality of first terminals, a plurality of second terminals, and a metal cover. Two card entry slots are formed vertically on the insulating body. Dovetail structures are formed on the sides of the insulating body. The first and second terminals are disposed on the insulating body and extend into the card entry slots. The metal cover is over the insulating body. Thus, the SFP connectors can be connected in parallel without tolerance variation, hence achieving better alignment. A SFP connector assembly is also disclosed.
    Type: Grant
    Filed: April 12, 2011
    Date of Patent: June 12, 2012
    Assignee: Nextronics Engineering Corp.
    Inventors: Hou-An Su, Hai-Wen Yang, Xiao-Qiong Liao
  • Publication number: 20120027363
    Abstract: An optical electronic connecting device with dual modules includes a first module and a second module. The first module meets the specification of a Small Form-Factor Pluggable connector. The first module includes a first main body, a plurality of first terminals, and a first metallic casing. The second module meets the specification of a RJ connector. The second module includes a second main body, a plurality of second terminals, and a second metallic casing. The first module and the second module are stacked together and respectively have a metallic casing. The optical electronic connecting device with dual modules has a simplified configuration, can be produced easily with lower cost, and therefore can be sold at lower price.
    Type: Application
    Filed: July 28, 2010
    Publication date: February 2, 2012
    Applicant: NEXTRONICS ENGINEERING CORP.
    Inventors: HOU-AN SU, HAI-WEN YANG, XUAN LUO, XIAO-QIONG LIAO, HAI-YANG XIAO