Patents by Inventor Xiao Tiang Zhang

Xiao Tiang Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7633140
    Abstract: A semiconductor package includes a lead frame having a plurality of leads and a lead frame pad, the lead frame pad including a die coupled thereto, at least one of the plurality of leads having an external portion sloped upwards relative to a bottom surface of the package, metal connectors connecting the die to the plurality of leads, and a resin body encapsulating the die, metal connectors and at least a portion of the lead frame.
    Type: Grant
    Filed: December 9, 2003
    Date of Patent: December 15, 2009
    Assignee: Alpha and Omega Semiconductor Incorporated
    Inventors: Leeshawn Luo, Anup Bhalla, Sik K. Lui, Yueh-Se Ho, Mike F. Chang, Xiao Tiang Zhang