Abstract: A package structure includes a printed circuit board (PCB), a duplexer, a first dam, a second dam and a cover. The duplexer includes a transmission filter and a reception filter and is electrically connected with the PCB. The first dam is located on a surface of the PCB, and in cooperation with the PCB forms a first receptacle receiving the transmission filter. The second dam is located on the surface of the PCB, and in cooperation with the PCB forms a second receptacle receiving the reception filter. The cover is fixed with top parts of the first dam and the second dam to seal the transmission filter and the reception filter. A method of manufacturing plural such package structures is also provided.

Abstract: A package structure includes a printed circuit board (PCB), a duplexer, a first dam, a second dam and a cover. The duplexer includes a transmission filter and a reception filter and is electrically connected with the PCB. The first dam is located on a surface of the PCB, and in cooperation with the PCB forms a first receptacle receiving the transmission filter. The second dam is located on the surface of the PCB, and in cooperation with the PCB forms a second receptacle receiving the reception filter. The cover is fixed with top parts of the first dam and the second dam to seal the transmission filter and the reception filter. A method of manufacturing plural such package structures is also provided.

Abstract: An optical transceiver includes a substrate, a plurality of laser components, a bracket and a plurality of lenses. The substrate defines a plurality of through holes, a plurality of receiving grooves and at least two fixing holes. The laser components are received in the plurality of receiving grooves and installed on the substrate. The bracket includes a top cover with an upper surface and one or more side walls. The one or more sidewalls include at least two positioning posts and one or more fixing surfaces. The positioning posts are engaged with the fixing holes to position the bracket to the substrate. The fixing surfaces are affixed on the substrate by an adhesive. The one or more sidewalls define one or more through channels extending from the one or more fixing surface to the upper surface. The lenses are installed on the bracket and correspond to the laser components.

Abstract: An optical transceiver includes a substrate, a plurality of laser components, a bracket and a plurality of lenses. The substrate defines a plurality of through holes, a plurality of receiving grooves and at least two fixing holes. The laser components are received in the plurality of receiving grooves and installed on the substrate. The bracket includes a top cover with an upper surface and one or more side walls. The one or more sidewalls include at least two positioning posts and one or more fixing surfaces. The positioning posts are engaged with the fixing holes to position the bracket to the substrate. The fixing surfaces are affixed on the substrate by an adhesive. The one or more sidewalls define one or more through channels extending from the one or more fixing surface to the upper surface. The lenses are installed on the bracket and correspond to the laser components.

Abstract: An optical transceiver includes a substrate, a positioning seat, a plurality of laser components, a bracket and a plurality of lenses. The positioning seat is installed on the substrate and includes a pair of positioning posts and a plurality of receiving holes between the positioning posts. The laser components pass through the receiving holes and are installed on the substrate. The bracket includes a top cover and one or more sidewalls. The one or more sidewalls surround the positioning seat and the plurality of laser components. The top cover defines a pair of positioning holes engaged with the pair of positioning posts to position the bracket corresponding to the positioning seat. The lenses are installed on the top cover of the bracket and correspond to the plurality of laser components on the substrate.