Abstract: A test apparatus for supporting compatibility testing between a motherboard and a number of power supply units includes a plug, a number of sockets, and a microprocessor. The plug is configured for connecting to the motherboard. The number of sockets is configured for connecting to the number of power supply units. The microprocessor is connected to the plug and the number of sockets, and is capable of turning on or turning off the number of power supply units, according to a power supply on signal received from the motherboard.

Abstract: An adaptor for a memory card includes a printed circuit board (PCB) conversion board, a memory card connector, a serial interface connector, a signal convertor, and a parallel interface connector. When a motherboard is connected to the serial interface connector, serial signals output from the motherboard are transmitted to the signal convertor via the serial interface connector. The signal convertor converts the serial signals into parallel signals and transmits the parallel signals to the memory card. When the motherboard is connected to the parallel interface connector, parallel signals output from the motherboard are transmitted to the memory card via the PCB conversion board without any parallel-to-serial signal conversion.

Abstract: A fixing apparatus is provided for retaining a heat sink to a circuit board. The fixing apparatus includes a mount fixed to the circuit board, two locking members attached to the mount, and a clip. The mount defines a receiving hole accommodating the heat sink. The clip includes a positioning portion abutting against the heat sink, and two retaining arms extending from opposite ends of the positioning portion. The positioning portion presses the heat sink against the circuit board in response to the retaining arms engaging with the locking members.

Abstract: An exemplary mounting apparatus is for adjustably fixing a light guide pipe in a chassis of an electronic device. The chassis includes a mounting plate. The mounting apparatus includes a first sleeve engaging with the light guide pipe, a second sleeve attached to the mounting plate, and a resilient member disposed between the first sleeve and the second sleeve.

Abstract: A fan controller includes an input module and an output module. The input module is used for receiving a power supply signal from a power supply which is used for providing power to a fan, and outputting a trigger signal when the power supply signal when the power supply turns off. The output module is used for providing power for the fan when the power supply turns off. The output module includes a timer circuit and an integrator circuit. The timer circuit is coupled to the input module, and is used for receiving the trigger signal, and providing the power for the fan according to the trigger signal for a predetermined amount of time. The integrator circuit is used for providing a threshold voltage for the timer circuit, the threshold voltage tripping termination of the power provided by the timer circuit.

Abstract: A computer includes a chassis, a motherboard, an air guiding member, and a fan. The chassis includes a rear wall at a rear side thereof and a sidewall at a lateral side thereof. The rear wall defines a plurality of inlet holes therein, and the sidewall defines a plurality of outlet holes therein. The motherboard is received in the chassis opposite to the sidewall, a heat sink is installed on the motherboard for dissipating heat generated by a processor mounted on the motherboard. The air guiding member is received in the chassis at a front side, for guiding air drawn into the chassis through the inlet holes toward the outlet holes. The fan is used for drawing air from outside of the chassis through the inlet holes, and blowing the air out of the chassis through the outlet holes.

Abstract: A heat dissipating device with a temperature detecting function includes a heat sink module, a temperature detecting unit, a control unit, and a display unit. The heat sink module is configured for dissipating heat for a heat-generating electrical device. The temperature detecting unit is capable of sensing a temperature of the heat sink module, and converting an analog signal of the sensed temperature to a digital signal. The control unit transforms the digital signal to a display signal. The display unit receives the digital signal for displaying the sensed temperature.

Abstract: A mounting apparatus is provided for mounting a fan in a chassis defining an exhaust opening in an end wall thereof. The mounting apparatus includes a frame adapted to receive the fan, and be inserted into or drawn out of the chassis via the exhaust opening. The frame includes at least one resilient lock plate. The at least one resilient lock plate releasably abuts against the end wall of the chassis to prevent the frame sliding out of the chassis.

Abstract: A heat dissipation assembly for dissipating heat from a heat-generating component includes a first heat sink mounted on the heat-generating component for dissipating heat therefrom, and a second heat sink movably mounted to the first heat sink, to be adjustable relative to the first heat sink. The second heat sink can be moved to a desired position to fit a need of heat dissipation.

Abstract: A thermal testing apparatuses for a server system (22) includes a heating module (16), at least one temperature sensor (191), a micro control unit (MCU) (192), a trigger controlling circuit (193) and a display module (20). The heating module heats airflow at an entry of the server system. The temperature sensor senses temperature at the entry of the server system, and outputs temperature signals. The MCU receives temperature signals and converts them to temperatures in degrees. The trigger controlling circuit is electrically connected to the MCU to receive a controlling signal, and controls turning the heating module on or off. The display module is electrically connected to the MCU for showing the temperatures in degrees.

Abstract: An electronic device includes a first power supply unit, a second power supply unit, and a control circuit. The control circuit connected between the first power supply unit and the second power supply unit is configured for detecting an output power of the first power supply unit, and comparing the output power with a rated power of the first power supply unit. When the output power exceeds the rated power of the first power supply unit, the control circuit allows the second power supply unit to power the electronic device.

Abstract: A notebook computer includes a chassis and a heat dissipating device. The chassis has a receiving space for detachably receiving the heat dissipating device. For example, if the receiving space is configured to receive an installable device such as a CD drive or a battery compartment, then the heat dissipating device has a shape corresponding to the CD drive or a battery module. The heat dissipating device can be detachably received in the receiving space to further dissipate heat from the chassis when the installable device is not received in the receiving space.

Abstract: An airflow direction controlling apparatus includes a frame arranged near an outlet of a fan, at least one blade pivotably mounted to the frame and driven by a motor, at least two thermal sensors for detecting temperatures of at least two electronic components in a computer, and a control module electronically connected to the at least two sensors and the motor. The control module receives the detected temperatures from the sensors, determines if an electronic component is in danger of overheating, and controls the motor to rotate the at least one blade to a desired position where airflow of the fan blows toward the electronic component in danger of overheating, to quickly dissipate the heat generated by the electronic component.

Abstract: A clip for mounting a heat sink on a circuit board includes a positioning coil for rotatably engaging with the heat sink. Two elongated arms extend from two ends of a line bisecting the positioning coil respectively, and a pair of hooks formed at distal portions of the two arms respectively for engaging with the circuit board.

Abstract: A frame for mounting a data storage device, includes a holder configured for mounting the data storage thereto, a baffle board mounted to the holder, and a V-shaped air guiding board mounted to the holder between the baffle board and the data storage device. An intake defined in the baffle board is configured to let airflow therethrough to cool the data storage device mounted to the frame. The opening of the “V” of the air guiding board faces the data storage device. Because of the V-shaped air guiding board, the frame efficiently dissipates heat from and around the data storage device.

Abstract: A battery box includes a housing, a positive electrode member, and a negative electrode member. The housing includes a receiving space in a side thereof for receiving at least one battery therein. The receiving space defines two slots at opposite ends thereof. The positive electrode member is mounted to the housing and includes two positive electrode terminals each located at a corresponding one of the slots of the housing, respectively. The negative electrode member is mounted to the housing and includes two negative electrode terminals extending into the receiving space of the housing and each at a side of a corresponding slot of the housing.

Abstract: A heat dissipation device for a hard disk drive includes a first heat sink and a control circuit. The first heat sink includes an input interface, a counter unit, a controller unit, and an output unit. The input interface is used for receiving an input signal, which is determined by a temperature of the computer system. The counter unit is used for generating a high level signal on counting to a predetermined value. The controller unit is used for generating a switch signal on receiving the high level signal, and sending a clear signal to the counter unit for clearing the counter unit. The output unit is used for being switched on or off according to the switch signal, and sending a control signal to the first heat sink. The control signal is able to drive the cooling end of the first heat sink to cool down.

Abstract: A connector device having a counter thereof includes a connector, a micro control unit, an encoder, a display drive unit, and a display unit. The connector provides a power signal to the micro control unit when plugged an electrified device. The micro control unit outputs data and clock signals to the display drive unit to make the display drive unit count plug-in times of the connector, and also outputs a drive signal to the encoder after receiving the power signal. The encoder encodes the drive signal and outputs corresponding signals to the display drive unit to make the display drive unit control the display unit to display a count of plug-in times of the connector.

Abstract: An apparatus for measuring average power consumption of a computer system includes a current to voltage converter for receiving an operating current of the computer system and transforming the operating current into a voltage signal; an analog-digital converter connected to the current to voltage converter for receiving the voltage signal, and converting the voltage signal into a digital signal indicating a value of the operating current; a micro controller unit connected to the analog-digital converter for receiving the digital signal, and calculating a value of the average power consumption of the computer system during a determined period of time, the value of the average power consumption being converted into a display-driving signal; and a display module connected to the micro controller unit for receiving the display-driving signal, and displaying the value of the average power consumption.

Abstract: A thermal resistance measuring apparatus for a heat sink includes a heat source, a temperature sensor, a micro control unit (MCU), a display, and a power apparatus. The heat source heats the heat sink. The temperature sensor senses temperature signals of the heat source. The MCU receives the temperature signals from the temperature sensor and processes them to calculate thermal resistance of the heat sink. The display is electrically connected to the MCU for showing the thermal resistance of the heat sink. The power apparatus supplies power to the heat source, the temperature sensor, and the MCU.