Abstract: A display panel and a preparation method therefor are provided. The display panel includes: a driving backplate, a first surface of which is provided with normal bonding areas and redundant bonding areas, at least one of first distances between every two normal bonding areas, which are adjacent to each other is greater than at least one of second distances between each normal bonding area and a corresponding redundant bonding area which is adjacent to the normal bonding area, and at least one normal bonding area and at least one redundant bonding area adjacent thereto constitute a bonding group; and a light emitting layer, located on the first surface and including sub-pixels electrically connected to the normal bonding areas or the redundant bonding areas, and the normal bonding area and the redundant bonding area of the same bonding group are electrically connected to sub-pixels with the same emitting color.

Abstract: The bonding method of a micro-light emitting diode chip includes providing a backplane, and two solder columns are formed on electrodes of each chip bonding area of the backplane; forming a glue groove in the chip bonding area, forming a glue layer in the glue groove to make the glue layer cover tops of the solder columns; moving the chip to make positive and negative electrodes of the chip aligned with the two solder columns respectively; heating the backplane to make the glue layer melt into liquid glue; making positive and negative electrodes of the chip immersed in the liquid glue; after cooling to a room temperature, making the positive electrode and the negative electrode of the chip adhered to the two solder columns respectively; removing a transfer head; soldering the positive electrode and the solder column adhered together, and the negative electrode and the solder column adhered together.