Patents by Inventor Xiaobing Ma
Xiaobing Ma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240085086Abstract: The present invention discloses a control system and a control method of a refrigerator. The control system comprises a collection unit and a fan control unit, and the fan control unit controls a heat dissipation fan to operate at different rotation speeds according to a power-on signal of the refrigerator, a closing signal and an opening signal of the first air port collected by the collection unit. The present invention solves the problem that the hot air discharged out of the compressor compartment blends with cold air and re-enters the compressor compartment, and the problem of poor heat dissipation of the refrigerator when the refrigerator is embedded in the cupboard.Type: ApplicationFiled: February 5, 2021Publication date: March 14, 2024Inventors: JIAN MA, XIAOBING ZHU, WEIJIE LI, MENGCHENG LI, BIN FEI, PENG LIU, CHANGZHI WANG
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Patent number: 11892391Abstract: An electrochemical method for field monitoring of protective properties of organic coatings in seawater environment includes: Step 1: Determine the actual service environment of the coating structure and prepare the simulated electrolyte solution. Step 2: Select the anode block for testing. Step 3: Test the corrosion current and potential of the coating structure under different manual peeling areas. Step 4: Fit the peeling area model of organic coating. Step 5: Real-time monitoring of the actual service coating peeling area. Through the method, we reached to map the deteriorating state of the organic coating to metal substrate for coating on the activity of area of the effect of stripping state recognition, resolved to organic anticorrosive coating anticorrosion performance timely and accurate assessment of the actual problem, achieved by monitoring the anode current to evaluate the organic coating stripping area. This method is scientific and has good technics and broad application value.Type: GrantFiled: November 8, 2022Date of Patent: February 6, 2024Assignee: BEIHANG UNIVERSITYInventors: Xiaobing Ma, Haodi Ji, Yikun Cai
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Publication number: 20230143519Abstract: An electrochemical method for field monitoring of protective properties of organic coatings in seawater environment includes: Step 1: Determine the actual service environment of the coating structure and prepare the simulated electrolyte solution. Step 2: Select the anode block for testing. Step 3: Test the corrosion current and potential of the coating structure under different manual peeling areas. Step 4: Fit the peeling area model of organic coating. Step 5: Real-time monitoring of the actual service coating peeling area. Through the method, we reached to map the deteriorating state of the organic coating to metal substrate for coating on the activity of area of the effect of stripping state recognition, resolved to organic anticorrosive coating anticorrosion performance timely and accurate assessment of the actual problem, achieved by monitoring the anode current to evaluate the organic coating stripping area. This method is scientific and has good technics and broad application value.Type: ApplicationFiled: November 8, 2022Publication date: May 11, 2023Applicant: Beihang UniversityInventors: Xiaobing MA, Haodi JI, Yikun CAI
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Patent number: 11280019Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.Type: GrantFiled: June 19, 2019Date of Patent: March 22, 2022Assignee: SunPower CorporationInventors: Emmanuel Chua Abas, Chen-An Chen, Diana Xiaobing Ma, Kalyana Bhargava Ganti, Edmundo Anida Divino, Jake Randal G. Ermita, Jose Francisco S. Capulong, Arnold Villamor Castillo
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Publication number: 20190301046Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.Type: ApplicationFiled: June 19, 2019Publication date: October 3, 2019Applicant: SunPower CorporationInventors: Emmanuel Chua ABAS, Chen-An CHEN, Diana Xiaobing MA, Kalyana Bhargava GANTI, Edmundo Anida DIVINO, Jake Randal G. ERMITA, Jose Francisco S. CAPULONG, Arnold Villamor CASTILLO
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Publication number: 20160108541Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.Type: ApplicationFiled: December 2, 2015Publication date: April 21, 2016Applicant: SunPower CorporationInventors: Emmanuel Chua ABAS, Chen-An CHEN, Diana Xiaobing MA, Kalyana Bhargava GANTI, Edmundo Anida DIVINO, Jake Randal G. ERMITA, Jose Francisco S. CAPULONG, Arnold Villamor CASTILLO
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Patent number: 9222193Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.Type: GrantFiled: October 26, 2012Date of Patent: December 29, 2015Assignee: SunPower CorporationInventors: Emmanuel Chua Abas, Chen-An Chen, Diana Xiaobing Ma, Kalyana Bhargava Ganti, Edmundo Anida Divino, Jake Randal G. Ermita, Jose Francisco S. Capulong, Arnold Villamor Castillo
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Patent number: 8317987Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.Type: GrantFiled: September 23, 2010Date of Patent: November 27, 2012Assignee: SunPower CorporationInventors: Emmanuel Chua Abas, Chen-An Chen, Diana Xiaobing Ma, Kalyana Bhargava Ganti
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Patent number: 8221601Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The carrier includes a non-conductive carrier body on which the substrates are placed and conductive lines embedded within the carrier body. A plurality of conductive clip attachment parts are attached in a permanent manner to the conductive lines embedded within the carrier body. A plurality of contact clips are attached in a removable manner to the clip attachment parts. The contact clips hold the substrates in place and conductively connecting the substrates with the conductive lines. Other embodiments, aspects and features are also disclosed.Type: GrantFiled: September 23, 2010Date of Patent: July 17, 2012Assignee: SunPower CorporationInventors: Chen-An Chen, Emmanuel Chua Abas, Edmundo Anida Divino, Jake Randal G. Ermita, Jose Francisco S. Capulong, Arnold Villamor Castillo, Diana Xiaobing Ma
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Publication number: 20120073974Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.Type: ApplicationFiled: September 23, 2010Publication date: March 29, 2012Inventors: Emmanuel Chua ABAS, Chen-An CHEN, Diana Xiaobing MA, Kalyana Bhargava GANTI
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Publication number: 20120073976Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The carrier includes a non-conductive carrier body on which the substrates are placed and conductive lines embedded within the carrier body. A plurality of conductive clip attachment parts are attached in a permanent manner to the conductive lines embedded within the carrier body. A plurality of contact clips are attached in a removable manner to the clip attachment parts. The contact clips hold the substrates in place and conductively connecting the substrates with the conductive lines. Other embodiments, aspects and features are also disclosed.Type: ApplicationFiled: September 23, 2010Publication date: March 29, 2012Inventors: Chen-An CHEN, Emmanuel Chua ABAS, Edmundo Anida DIVINO, Jake Randal G. ERMITA, Jose Francisco S. CAPULONG, Arnold Villamor CASTILLO, Diana Xiaobing MA
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Publication number: 20090004875Abstract: Methods for forming an ultra thin structure using a method that includes trimming a mask layer during an etching process are provided. The embodiments described herein may be advantageously utilized to fabricate a submicron structure on a substrate having a critical dimension less than 55 nm and beyond. In one embodiment, a method of forming a submicron structure on a substrate may include providing a substrate having a patterned photoresist layer disposed on a film stack into an etch chamber, wherein the film stack includes at least a hardmask layer disposed on an underlying layer, trimming the photoresist layer to a first predetermined critical dimension, etching the hardmask layer through openings defined by the trimmed photoresist layer, trimming the hardmask layer to a second predetermined critical dimension, and etching the underlying layer through openings defined by the trimmed hardmask layer.Type: ApplicationFiled: June 27, 2008Publication date: January 1, 2009Inventors: Meihua Shen, Diana Xiaobing Ma, Wendy H. Yeh, Kenneth MacWilliams, Wei Liu, Thorsten B. Lill
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Patent number: 6949203Abstract: An integrated in situ etch process performed in a multichamber substrate processing system having first and second etching chambers. In one embodiment the first chamber includes an interior surface that has been roughened to at least 100 Ra and the second chamber includes an interior surface that has a roughness of less than about 32 Ra. The process includes transferring a substrate having formed thereon in a downward direction a patterned photoresist mask, a dielectric layer, a barrier layer and a feature in the substrate to be contacted into the first chamber where the dielectric layer is etched in a process that encourages polymer formation over the roughened interior surface of the chamber. The substrate is then transferred from the first chamber to the second chamber under vacuum conditions and, in the second chamber, is exposed to a reactive plasma such as oxygen to strip away the photoresist mask deposited over the substrate.Type: GrantFiled: March 3, 2003Date of Patent: September 27, 2005Assignee: Applied Materials, Inc.Inventors: Chang-Lin Hsieh, Diana Xiaobing Ma, Brian Sy Yuan Shieh, Gerald Zheyao Yin, Jennifer Sun, Senh Thach, Lee Luo, Claes H. Bjorkman
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Patent number: 6829056Abstract: A substrate processing apparatus has a chamber having a substrate support, gas distributor, gas energizer, and gas exhaust port. A process monitor is provided to monitor features in a first region of the substrate and generate a corresponding first signal, and to monitor features in a second region of the substrate and generate a second signal. A chamber controller receives and evaluates the first and second signals, and operates the chamber in relation to the signals. For example, the chamber controller can select a process recipe depending upon the signal values. The chamber controller can also set a process parameter at a first level in a first processing sector and at a second level in a second processing sector. The apparatus provides a closed control loop to independently monitor and control processing of features at different regions of the substrate.Type: GrantFiled: August 21, 2003Date of Patent: December 7, 2004Inventors: Michael Barnes, John Holland, Hongqing Shan, Bryan Y. Pu, Mohit Jain, Zhifeng Sui, Michael D. Armacost, Neil E. Hanson, Diana Xiaobing Ma, Ashok K. Sinha, Dan Maydan
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Patent number: 6711359Abstract: A lightwave communication system is provided that includes first and second optical transmitters/receivers remotely located with respect to one another. First and second optical transmission paths couple the first transmitter/receiver to the second transmitter/receiver for bidirectionally transmitting optical information therebetween. First and second doped optical fibers are respectively disposed in the first and second optical transmission paths. Optical pump energy is supplied by first and second optical pump sources. The first optical pump source generates Raman gain in the first transmission path and the second optical pump source generates Raman gain in the second transmission path. A first optical coupler is provided for optically coupling pump energy from the first pump source to the second-doped optical fiber and a second optical coupler is provided for optically coupling pump energy from the second pump source to the first doped optical fiber.Type: GrantFiled: March 10, 1999Date of Patent: March 23, 2004Assignee: Tyco Telecommunications (US) Inc.Inventors: Donald G. Duff, Howard D. Kidorf, Xiaobing Ma, Karsten Rottwitt
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Patent number: 6635577Abstract: A method of eliminating charging resulting from plasma processing a semiconductor wafer comprising the steps of plasma processing the semiconductor wafer in a manner that may result in topographically dependent charging and exposing, during at least a portion of a time in which the semiconductor wafer is being plasma processed, the semiconductor wafer to particles that remove charge from the semiconductor wafer and reduce topographically dependent charging.Type: GrantFiled: March 30, 1999Date of Patent: October 21, 2003Assignee: Applied Materials, IncInventors: John M. Yamartino, Peter K. Loewengardt, Kenlin Huang, Diana Xiaobing Ma
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Patent number: 6620289Abstract: A method and apparatus for processing a workpiece in a chamber by providing an asymmetric flow of process gas and processing the workpiece with the process gas. The asymmetric flow counteracts a non-uniform distribution of reactive species in the chamber. The asymmetric flow can be accomplished by introducing the process gas through a plurality of gas nozzles that communicate through a side wall of the chamber proximate a pump port while pumping gas with a pump coupled to the pump port. The inventive method can be used with a conventional processing chamber by only opening the gas nozzles closest to the pump and blocking any other gas nozzles. Alternatively, the method can be implemented in a processing chamber having gas nozzles located only proximate the pump port.Type: GrantFiled: April 27, 1999Date of Patent: September 16, 2003Assignee: Applied Materials, IncInventors: Chun Yan, Yan Ye, Diana Xiaobing Ma
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Publication number: 20030164354Abstract: An integrated in situ etch process performed in a multichamber substrate processing system having first and second etching chambers. In one embodiment the first chamber includes an interior surface that has been roughened to at least 100 Ra and the second chamber includes an interior surface that has a roughness of less than about 32 Ra. The process includes transferring a substrate having formed thereon in a downward direction a patterned photoresist mask, a dielectric layer, a barrier layer and a feature in the substrate to be contacted into the first chamber where the dielectric layer is etched in a process that encourages polymer formation over the roughened interior surface of the chamber. The substrate is then transferred from the first chamber to the second chamber under vacuum conditions and, in the second chamber, is exposed to a reactive plasma such as oxygen to strip away the photoresist mask deposited over the substrate.Type: ApplicationFiled: March 3, 2003Publication date: September 4, 2003Applicant: Applied Materials, Inc.Inventors: Chang-Lin Hsieh, Diana Xiaobing Ma, Brian Sy Yuan Shieh, Gerald Zheyao Yin, Jennifer Sun, Senh Thach, Lee Luo, Claes H. Bjorkman
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Patent number: 6569775Abstract: A method of improving plasma processing of a semiconductor wafer by exposing the wafer or the plasma to photons while the wafer is being processed. One embodiment of the method comprises the steps of etching an aluminum layer and, during the etching, exposing the semiconductor wafer containing the aluminum layer to photons that photodesorb copper chloride from the surface of the layer thus improving the etch process performance.Type: GrantFiled: February 17, 2000Date of Patent: May 27, 2003Assignee: Applied Materials, Inc.Inventors: Peter K. Loewenhardt, John M. Yamartino, Hui Chen, Diana Xiaobing Ma
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Patent number: RE46088Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The carrier includes a non-conductive carrier body on which the substrates are placed and conductive lines embedded within the carrier body. A plurality of conductive clip attachment parts are attached in a permanent manner to the conductive lines embedded within the carrier body. A plurality of contact clips are attached in a removable manner to the clip attachment parts. The contact clips hold the substrates in place and conductively connecting the substrates with the conductive lines. Other embodiments, aspects and features are also disclosed.Type: GrantFiled: May 5, 2015Date of Patent: August 2, 2016Assignee: SunPower CorporationInventors: Chen-An Chen, Emmanuel Chua Abas, Edmundo Anida Divino, Jake Randal G. Ermita, Jose Francisco S. Capulong, Arnold Villamor Castillo, Diana Xiaobing Ma