Abstract: In some embodiments, a computing method includes, for pairs of a first and second floating-point numbers, each having a respective mantissa and exponent, supplying to a respective one of multiply circuits the mantissas of a subset of the pairs of first and second floating-point number, the subset of the plurality of pairs of first and second floating-point numbers each having a respective sum of the exponents of the first and second floating-point numbers, respectively, meeting a predetermined criterion, such as the sum being smaller than a predetermined threshold value; generating, using each of the plurality of multiply circuits, a product of the mantissas of the respective pair of first and second floating-point numbers; accumulating the product mantissas to generate a product mantissa partial sum; combining the product mantissa partial sum and maximum product exponent to generate an output floating point number; and for each of the remaining pairs of first and second floating-point numbers: withholding th

Abstract: In some embodiments, a computing method includes, for a set of products, each of a respective pair of a first and a second floating-point operands, each having a respective mantissa and exponent, aligning the mantissas of the first operands based on a maximum exponent of the first operands to generate a shared exponent; modifying the mantissas of the first operands based on the shared exponent to generate respective adjusted mantissas of the first operands; generating mantissa products, each based on the mantissa of a respective one of the second operands and a respective one of the adjusted first mantissas retrieved from the memory device; summing the mantissas products to generate a mantissa product partial sum; and combining the shared exponent and the product mantissa partial sum. The adjusted mantissas of the first operands can be saved in, and retrieved from, a memory device for the mantissa product generation.

Abstract: An artificial intelligence (AI) accelerator device may include a plurality of on-chip mini buffers that are associated with a processing element (PE) array. Each mini buffer is associated with a subset of rows or a subset of columns of the PE array. Partitioning an on-chip buffer of the AI accelerator device into the mini buffers described herein may reduce the size and complexity of the on-chip buffer. The reduced size of the on-chip buffer may reduce the wire routing complexity of the on-chip buffer, which may reduce latency and may reduce access energy for the AI accelerator device. This may increase the operating efficiency and/or may increase the performance of the AI accelerator device. Moreover, the mini buffers may increase the overall bandwidth that is available for the mini buffers to transfer data to and from the PE array.

Abstract: A 3D memory device is provided. The 3D memory device includes a first logic base layer, a second layer, and a third layer. The first logic base layer comprises a first type DEMUX, a plurality of second type DEMUXs coupled to the first type DEMUX, a first type MUX, and a plurality of second type MUXs coupled to the first type MUX. The second layer comprises a first group of memory units. Each of the first group of memory units is respectively coupled to a corresponding DEMUX of the plurality of second type DEMUXs and a corresponding MUX of the plurality of second type MUXs. The third layer comprises a second group of memory units. Each of the second group of memory units is respectively coupled to a corresponding DEMUX of the plurality of second type DEMUXs and a corresponding MUX of the plurality of second type MUXs.

Abstract: A 3D memory device is provided. The 3D memory device includes a first logic base layer, a second layer, and a third layer. The first logic base layer comprises a first type DEMUX, a plurality of second type DEMUXs coupled to the first type DEMUX, a first type MUX, and a plurality of second type MUXs coupled to the first type MUX. The second layer comprises a first group of memory units. Each of the first group of memory units is respectively coupled to a corresponding DEMUX of the plurality of second type DEMUXs and a corresponding MUX of the plurality of second type MUXs. The third layer comprises a second group of memory units. Each of the second group of memory units is respectively coupled to a corresponding DEMUX of the plurality of second type DEMUXs and a corresponding MUX of the plurality of second type MUXs.

Abstract: The present disclosure provides an accelerator circuit, a semiconductor device, and a method for accelerating convolution in a convolutional neural network. The accelerator circuit includes a plurality of sub processing-element (PE) arrays, and each of the plurality of sub PE arrays includes a plurality of processing elements. The processing elements in each of the plurality of sub PE arrays implement a standard convolutional layer during a first configuration applied to the accelerator circuit, and implement a depth-wise convolutional layer during a second configuration applied to the accelerator circuit.

Abstract: A 3D memory device is provided. The 3D memory device includes a first logic base layer, a second layer, and a third layer. The first logic base layer comprises a first type DEMUX, a plurality of second type DEMUXs coupled to the first type DEMUX, a first type MUX, and a plurality of second type MUXs coupled to the first type MUX. The second layer comprises a first group of memory units. Each of the first group of memory units is respectively coupled to a corresponding DEMUX of the plurality of second type DEMUXs and a corresponding MUX of the plurality of second type MUXs. The third layer comprises a second group of memory units. Each of the second group of memory units is respectively coupled to a corresponding DEMUX of the plurality of second type DEMUXs and a corresponding MUX of the plurality of second type MUXs.

Abstract: An artificial intelligence (AI) accelerator device may include a plurality of on-chip mini buffers that are associated with a processing element (PE) array. Each mini buffer is associated with a subset of rows or a subset of columns of the PE array. Partitioning an on-chip buffer of the AI accelerator device into the mini buffers described herein may reduce the size and complexity of the on-chip buffer. The reduced size of the on-chip buffer may reduce the wire routing complexity of the on-chip buffer, which may reduce latency and may reduce access energy for the AI accelerator device. This may increase the operating efficiency and/or may increase the performance of the AI accelerator device. Moreover, the mini buffers may increase the overall bandwidth that is available for the mini buffers to transfer data to and from the PE array.