Patents by Inventor Xiaochuan Dai

Xiaochuan Dai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220299466
    Abstract: A sensor includes a bio-recognition module and a transducer module having a dock sized and shaped to receive the bio-recognition module. The bio-recognition modules comprise a hydrogel matrix having bio-recognition elements embedded therein. The bio-recognition elements cause a particular biochemical input to engage in an interaction that generates a perturbation in an electric field within the bio-recognition module. The transducer module transduces this perturbation into an electrical signal that is provided at an output of the transducer module. This electrical signal indicates occurrence of the interaction.
    Type: Application
    Filed: August 11, 2020
    Publication date: September 22, 2022
    Inventors: Xiaocheng JIANG, Xiaochuan DAI, Richard VO
  • Publication number: 20160027846
    Abstract: The present invention generally relates to nanoscale wires and three-dimensional networks or structures comprising nanoscale wires. For example, certain embodiments are directed to three-dimensional structures comprising nanoscale wires. The structures may be porous and define electrical networks wherein the nanoscale wires can be determined or controlled. Other materials, such as inorganic materials, polymers, fabrics, etc., may be disposed within the three-dimensional structure, and in some embodiments, such that the three-dimensional structure is embedded within the material. The nanoscale wires may thus be used, for example, as sensors within the material. Other embodiments of the invention are generally directed to the use of such articles, methods of forming such articles, kits involving such articles, or the like.
    Type: Application
    Filed: April 3, 2014
    Publication date: January 28, 2016
    Inventors: Charles M. Lieber, Jia Liu, Chong Xie, Xiaochuan Dai