Abstract: A method is provided of fabricating a composite incorporating fillers. The method includes the steps of depositing the fillers in a matrix material either in a rapid prototyping device or prior to inserting the matrix material into a mold. The mold is positioned at a desired location with respect to an electrical field such that at least a portion of the fillers in the matrix material align in a first direction in response thereto. For producing a heterogeneous composite through a rapid prototyping process, the electrodes are positioned at a desired orientation to align the fillers. Thereafter, at least a portion of the matrix material is cured with desirable filler orientation. The procedure is repeated with the desired filler orientation and distribution being introduced layer by layer within the composite.

Abstract: Systems and methods for sensing properties of a workpiece and embedding a photonic sensor in metal are disclosed herein. In some embodiments, systems for sensing properties of a workpiece include an optical input, a photonic device, an optical detector, and a digital processing device. The optical input provides an optical signal at an output of the optical input. The photonic device is coupled to the workpiece and to the output of the optical input. The photonic device generates an output signal in response to the optical signal, wherein at least one of an intensity of the output signal and a wavelength of the output signal depends on at least one of thermal characteristics and mechanical characteristics of the workpiece. The optical detector receives the output signal from the photonic device and is configured to generate a corresponding electronic signal.

Abstract: Systems and methods for sensing properties of a workpiece and embedding a photonic sensor in metal are disclosed herein. In some embodiments, systems for sensing properties of a workpiece include an optical input, a photonic device, an optical detector, and a digital processing device. The optical input provides an optical signal at an output of the optical input. The photonic device is coupled to the workpiece and to the output of the optical input. The photonic device generates an output signal in response to the optical signal, wherein at least one of an intensity of the output signal and a wavelength of the output signal depends on at least one of thermal characteristics and mechanical characteristics of the workpiece. The optical detector receives the output signal from the photonic device and is configured to generate a corresponding electronic signal.

Abstract: An embedded sensor or other desired device is provided within a completed structure through a solid-state bonding process (e.g., by diffusion bonding) and/or through a dynamic bonding process (e.g., by brazing). The embedded sensor or other desired device is provided on a substrate through any know or later-developed method (e.g., a photolithography or conductive ink printing process). A cover is then bonded to the substrate using a solid-state bonding process and/or a dynamic bonding process. The solid-state bonding process and/or dynamic bonding process may include providing heat and/or pressure to the substrate, the cover and/or a bonding agent (e.g., a filler metal or alloy) to bond the substrate and the cover together.

Abstract: A mechanism of initiating a redox reaction, such as hydrogen gas production by direct-water-splitting, is provided in which a piezoelectric material is mechanically stressed by actively applying a mechanical stress to the material. The mechanical stress applied to the piezoelectric material causes an electrical potential build up on the surface of the material due to the piezoelectric properties of the material. When the piezoelectric material stressed in this manner is placed in direct contact with the redox reaction reactant(s), the potential on the polarized surface can be used as chemical driving energy to initiate the reaction, such as to split water and generate hydrogen gas. In this manner the mechanical energy applied to the piezoelectric material, such as vibration energy from natural or man-made sources, can be converted directly into chemical energy to initiate the reaction.

Abstract: Fabricating a microelectronics grade metal substrate comprises forming the metal substrate on a sacrificial substrate. An adhesion layer can be deposited on or over the surface of the sacrificial substrate. A seed layer of the metal can be deposited on or over the adhesion layer. The metal material can be deposited on the seed layer by electroplating or other low-temperature, low-stress process to form a microelectronics-grade metal substrate. Thin film sensors and/or other microelectronic devices, followed by appropriate insulating layer(s), may be fabricated on or over the sacrificial substrate before forming the metal substrate. The sacrificial silicon substrate can then be etched away, leaving the microelectronics-grade metal substrate, and possibly the microelectronics device.

Abstract: Systems and methods for sensing properties of a workpiece and embedding a photonic sensor in metal are disclosed herein. In some embodiments, systems for sensing properties of a workpiece include an optical input, a photonic device, an optical detector, and a digital processing device. The optical input provides an optical signal at an output of the optical input. The photonic device is coupled to the workpiece and to the output of the optical input. The photonic device generates an output signal in response to the optical signal, wherein at least one of an intensity of the output signal and a wavelength of the output signal depends on at least one of thermal characteristics and mechanical characteristics of the workpiece. The optical detector receives the output signal from the photonic device and is configured to generate a corresponding electronic signal.

Abstract: Fabricating a microelectronics grade metal substrate comprises forming the metal substrate on a sacrificial substrate. An adhesion layer can be deposited on or over the surface of the sacrificial substrate. A seed layer of the metal can be deposited on or over the adhesion layer. The metal material can be deposited on the seed layer by electroplating or other low-temperature, low-stress process to form a microelectronics-grade metal substrate. Thin film sensors and/or other microelectronic devices, followed by appropriate insulating layer(s), may be fabricated on or over the sacrificial substrate before forming the metal substrate. The sacrificial silicon substrate can then be etched away, leaving the microelectronics-grade metal substrate, and possibly the microelectronics device.

Abstract: A metal matrix nanocomposite is formed by heating a metal above its liquidus temperature, adding nanoparticles, and then agitating the mixture with high-frequency (and preferably ultrasonic) vibration. The mixture can then be cooled below the liquidus of the metal to a semisolid state, and placed in a mold to form it into some desired shape. The formed mixture can then be quenched or otherwise allowed to cool to provide an article in finished (or nearly so) form.

Abstract: An apparatus and method of dispensing small-scale powders for a variety of applications, including, for example, fabricating a three-dimensional heterogeneous small-scale device, includes using a feed mechanism that causes motion of the powder particles and the steps of depositing fine heterogeneous materials (such as dry powders and biological materials) towards a substrate. The depositing step preferably includes providing a feed mechanism having an input to receive the material, an output, and a source of ultrasonic vibration to impart a torsional force on the material so as to precisely discharge the material from the output. To improve particle flowability, a cooling system is provided to cool the source, generally above a threshold input voltage.

Abstract: Fabricating a microelectronics grade metal substrate comprises forming the metal substrate on a sacrificial substrate. An adhesion layer can be deposited on or over the surface of the sacrificial substrate. A seed layer of the metal can be deposited on or over the adhesion layer. The metal material can be deposited on the seed layer by electroplating or other low-temperature, low-stress process to form a microelectronics-grade metal substrate. Thin film sensors and/or other microelectronic devices, followed by appropriate insulating layer(s), may be fabricated on or over the sacrificial substrate before forming the metal substrate. The sacrificial silicon substrate can then be etched away, leaving the microelectronics-grade metal substrate, and possibly the microelectronics device.

Abstract: An apparatus and method of dispensing small-scale powders for a variety of applications, including, for example, fabricating a three-dimensional heterogeneous small-scale device, includes using a feed mechanism that causes motion of the powder particles and the steps of depositing fine heterogeneous materials (such as dry powders and biological materials) towards a substrate. The depositing step preferably includes providing a feed mechanism having an input to receive the material, an output, and a source of ultrasonic vibration to impart a torsional force on the material so as to precisely discharge the material from the output. To improve particle flowability, a cooling system is provided to cool the source, generally above a threshold input voltage.

Abstract: A sensor embedded in a high temperature metal is incorporated into a sensing system for measuring temperature, strain, or other properties of a metal structure. An optical system transmits light to and receives output signals from the sensor for analysis. With rotating structures, an optical fiber lead transmits light between the sensor and external surface of the structure along its rotational axis, allowing the lead to remain fixed with respect to the optical system as the structure rotates at high speeds.

Abstract: A method for embedding fiber optic sensors in a high melting temperature metal structure produces embedded sensors that are uniformly and closely bonded with the metal and do not slip upon metal expansion and contraction. The structure is built in layers onto the sensor. On top of a first thin sputter-coated metallic layer, approximately 1-3 ?m thick, is electroplated a second thin layer, approximately 0.25-2 mm thick. Finally, a metal structure is built around the thin metallic layers by laser cladding, casting, welding, or other method.

Abstract: A sensor embedded in a high temperature metal is incorporated into a sensing system for measuring temperature, strain, or other properties of a metal structure. An optical system transmits light to and receives output signals from the sensor for analysis. With rotating structures, an optical fiber lead transmits light between the sensor and external surface of the structure along its rotational axis, allowing the lead to remain fixed with respect to the optical system as the structure rotates at high speeds.

Abstract: A method of processing a food product includes providing a source of pulse ultraviolet (UV) radiation. In operation, the method includes directing the UV radiation at the food product to photo-ablate the food product. A combination of parameters associated with the radiation may be selected, including at least one of a group of radiation focus spot size, radiation pulse repetition rate and source power to alter a performance characteristic of the technique, such as food processing speed.

Abstract: A method of fabricating a three-dimensional heterogeneous small-scale device includes the steps of depositing a fine heterogeneous materials (such as dry powders and biological materials) towards a substrate. In addition, the method includes sintering/cladding the material with a laser so as to produce a pattern. Then, the pattern is micro machined according to the particular design. The depositing step preferably includes providing a feed mechanism having an input to receive the material, an output, and a source of ultrasonic vibration to discharge the material from the output.