Patents by Inventor Xiaocui Yang

Xiaocui Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Display motherboard and manufacturing method thereof
    Patent number: 11609618
    Abstract: A display motherboard and a manufacturing method thereof are provided. The display motherboard includes a first substrate and a second substrate that are assembled, a plurality of mutually independent display devices located between the first substrate and the second substrate, a first seal, and a second seal. The first seal is provided in a peripheral area of the display motherboard, the second seal is provided in a cutting area of the display motherboard, the cutting area is located around each of the display devices, and the second seal surrounds at least one of the display devices.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: March 21, 2023
    Assignees: ORDOS YUANSHENG OPTOELECTRONICS CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Xueyong Zhang, Shixin Ruan, Wu Wang, Xiaocui Yang
  • Substrate fixing carrier, evaporation device and evaporation method
    Patent number: 11072854
    Abstract: A substrate fixing carrier includes a supporting frame and a cooling plate. The supporting frame defines a hollow region and a supporting portion at an inner wall of the supporting frame. The cooling plate and the supporting frame are movable towards each other until the cooling plate is in the hollow region with edges of the cooling plate aligning with the supporting portion. When a rectangular to-be-evaporated substrate is placed in the hollow region with edges of the rectangular to-be-evaporated substrate between the supporting portion and the cooling plate, a distance between each edge of the cooling plate corresponding to each long side of the to-be-evaporated substrate and the supporting portion is greater than or equal to a thickness of the to-be-evaporated substrate, and a distance between each edge of the cooling plate corresponding to each short side of the to-be-evaporated substrate and the supporting portion is less than the thickness of the to-be-evaporated substrate.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: July 27, 2021
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
    Inventors: Jindong Liu, Chaolong Fan, Le Liu, Xiaocui Yang
  • DISPLAY MOTHERBOARD AND MANUFACTURING METHOD THEREOF
    Publication number: 20210004062
    Abstract: A display motherboard and a manufacturing method thereof are provided. The display motherboard includes a first substrate and a second substrate that are assembled, a plurality of mutually independent display devices located between the first substrate and the second substrate, a first seal, and a second seal. The first seal is provided in a peripheral area of the display motherboard, the second seal is provided in a cutting area of the display motherboard, the cutting area is located around each of the display devices, and the second seal surrounds at least one of the display devices.
    Type: Application
    Filed: June 10, 2019
    Publication date: January 7, 2021
    Applicants: ORDOS YUANSHENG OPTOELECTRONICS CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Xueyong ZHANG, Shixin RUAN, Wu WANG, Xiaocui YANG
  • SUBSTRATE FIXING CARRIER, EVAPORATION DEVICE AND EVAPORATION METHOD
    Publication number: 20190226079
    Abstract: A substrate fixing carrier includes a supporting frame and a cooling plate. The supporting frame defines a hollow region and a supporting portion at an inner wall of the supporting frame. The cooling plate and the supporting frame are movable towards each other until the cooling plate is in the hollow region with edges of the cooling plate aligning with the supporting portion. When a rectangular to-be-evaporated substrate is placed in the hollow region with edges of the rectangular to-be-evaporated substrate between the supporting portion and the cooling plate, a distance between each edge of the cooling plate corresponding to each long side of the to-be-evaporated substrate and the supporting portion is greater than or equal to a thickness of the to-be-evaporated substrate, and a distance between each edge of the cooling plate corresponding to each short side of the to-be-evaporated substrate and the supporting portion is less than the thickness of the to-be-evaporated substrate.
    Type: Application
    Filed: December 7, 2018
    Publication date: July 25, 2019
    Applicants: BOE Technology Group Co., Ltd., Ordos Yuansheng Optoelectronics Co., Ltd.
    Inventors: Jindong Liu, Chaolong Fan, Le Liu, Xiaocui Yang