Patents by Inventor Xiaofang Suo

Xiaofang Suo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11486566
    Abstract: Disclosed is a modular housing for drivers used for LED lamps. The housing includes connectors for AC in from a power source, DC out to the lamps, and also has connectors allowing for control lines to be received from a control box. The housing includes an arrangement for creating two opposite stacks of drivers. The fronts of the drivers are cooled by circulating air through the space between the stacks, and heat is also dissipated through the side walls of the housing, which acts as a heat sink. The number and specifications of the drivers in the housing are configured such that every module is able to serve a number of LED lamps.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: November 1, 2022
    Assignee: Sunlite Science & Technology, Inc.
    Inventors: Jeff Chen, Xiaofang Suo
  • Publication number: 20200166200
    Abstract: Disclosed is a modular housing for drivers used for LED lamps. The housing includes connectors for AC in from a power source, DC out to the lamps, and also has connectors allowing for control lines to be received from a control box. The housing includes an arrangement for creating two opposite stacks of drivers. The fronts of the drivers are cooled by circulating air through the space between the stacks, and heat is also dissipated through the side walls of the housing, which acts as a heat sink. The number and specifications of the drivers in the housing are configured such that every module is able to serve a number of LED lamps.
    Type: Application
    Filed: November 25, 2019
    Publication date: May 28, 2020
    Inventors: Jeff Chen, Xiaofang Suo
  • Patent number: 10209005
    Abstract: Ultra violet light-emitting diode (hereafter UV LED) curing units containing one or X array or XY arrays of UV LED modules with integrated optical, mechanical, and heat dissipation systems, and one, or X array, or XY arrays of extrusions with integrated air or liquid cooling systems to receive and house the integrated UV LED. The UV LED modules may be any size or shape depending on the power requirements of a given curing application. The LED chips or the groups of LED chips used for the above UV LED modules may be in other wavelengths for other applications. The UV LED modules have excellent heat dissipation because the LED chips or groups of LED chips are directly mounted on metal extrusion. The LED modules also have a single optical lens system between the LED chips and the surrounding ambient air.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: February 19, 2019
    Assignee: Sunlite Science & Technology, Inc.
    Inventors: Jeff Chen, Xiaofang Suo
  • Patent number: 10097178
    Abstract: Embodiments of the present disclosure include a bidirectional analog switch having a pair of high-voltage transistors coupled together via a common source and gate. The switches are configured to effectively isolate an input terminal from an output terminal by passing leakage and feedthrough to a power supply. In certain embodiments, an off-state pinned switch pins the common source voltage to a power source voltage. A logic circuit receives an input logic signal and generates two non-overlapped output logic signals for controlling the pair of transistors and the off-state pinned switch. In other embodiments, a resistor pins the common source voltage to a power supply voltage for passing leakage and feedthrough to the power supply.
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: October 9, 2018
    Assignee: SUNLITE SCIENCE & TECHNOLOGY, INC.
    Inventors: Haijiang Ou, Xiaofang Suo
  • Publication number: 20170097150
    Abstract: Ultra violet light-emitting diode (hereafter UV LED) curing units containing one or X array or XY arrays of UV LED modules with integrated optical, mechanical, and heat dissipation systems, and one, or X array, or XY arrays of extrusions with integrated air or liquid cooling systems to receive and house the integrated UV LED. The UV LED modules may be any size or shape depending on the power requirements of a given curing application. The LED chips or the groups of LED chips used for the above UV LED modules may be in other wavelengths for other applications. The UV LED modules have excellent heat dissipation because the LED chips or groups of LED chips are directly mounted on metal extrusion. The LED modules also have a single optical lens system between the LED chips and the surrounding ambient air.
    Type: Application
    Filed: September 30, 2016
    Publication date: April 6, 2017
    Inventors: Jeff Chen, Xiaofang Suo
  • Publication number: 20070159420
    Abstract: Disclosed is a power LED light source that can be employed with different reflectors and other additional parts to form various power LED light units. Compared with the power LED light unit utilizing Luxeon LED packages and the like, the disclosed invention has the advantages of higher power, lower costs, better heat dissipation design and simpler optical design. The power LED light unit comprises of a base metal ring with multiple power LED dies mounted on it, one or more reflectors connected to the base metal ring, one or more extend metal rings connected to the base metal ring, a light unit base connected to the last extended metal ring, and a control circuit inside the metal rings. Such designed power LED light unit can emit light patterns such as parallel light pattern, non-parallel light pattern, and ring light pattern.
    Type: Application
    Filed: January 6, 2006
    Publication date: July 12, 2007
    Inventors: Jeff Chen, Xiaofang Suo