Patents by Inventor Xiao-Fei Liu

Xiao-Fei Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250046492
    Abstract: A cable includes: a core wire; a sheath covering the core wire; a shielding layer covering the sheath; and an outer insulating layer covering the shielding layer; wherein the core wire includes a pair of inner core wires and an insulating layer covering the pair of inner core wires by extrusion molding, each of the pair of inner core wires includes an inner conductor and an inner insulating layer covering the inner conductor, and the sheath wraps the insulating layer in a spiral winding way.
    Type: Application
    Filed: August 1, 2024
    Publication date: February 6, 2025
    Inventors: WEI XING, A-NAN YANG, XIAO-FEI LIU, HAN-RUN XIE, LU-YU CHANG
  • Publication number: 20240221973
    Abstract: A cable includes: plural wire groups; a first insulating layer covering the plurality of wire groups; a first shielding layer covering the first insulating layer; a second shielding layer covering the first shielding layer; an outer insulating layer covering the second shielding layer; and an inner support member disposed inside the first insulating layer; wherein the inner support member includes a plurality of grooves with equal cross-sectional areas, one side of each wire group is disposed in the groove and in close contact with the inner support member, the other side of each wire group is in close contact with the first insulating layer to fix the position of each wire group, and the inner support member is made of silicone.
    Type: Application
    Filed: December 26, 2023
    Publication date: July 4, 2024
    Inventors: YU GONG, XIAO-FEI LIU, A-NAN YANG, HAN-RUN XIE, LU-YU CHANG
  • Patent number: 8208400
    Abstract: A method for testing a wireless connection of an electronic device includes the following steps. The electronic device is initialized to a stand-by state. A testing server connects the electronic device to form a wireless connection based on a wireless protocol. The testing server outputs a plurality of first data packages to the electronic device and receives a plurality of second data packages from the electronic device to test a rate of data throughput via the wireless connection by the testing server. A wake-up signal is sent to the electronic device via the wireless connection to the electronic device.
    Type: Grant
    Filed: September 1, 2009
    Date of Patent: June 26, 2012
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Wen-Yi Wu, Xiao-Fei Liu, Wen Deng
  • Publication number: 20100302972
    Abstract: A method for testing a wireless connection of an electronic device includes the following steps. The electronic device is initialized to a stand-by state. A testing server connects the electronic device to form a wireless connection based on a wireless protocol. The testing server outputs a plurality of first data packages to the electronic device and receives a plurality of second data packages from the electronic device to test a rate of data throughput via the wireless connection by the testing server. A wake-up signal is sent to the electronic device via the wireless connection to the electronic device.
    Type: Application
    Filed: September 1, 2009
    Publication date: December 2, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO. LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: WEN-YI WU, XIAO-FEI LIU, WEN DENG