Abstract: A package structure and a method for manufacturing the same, and an electronic device are provided. The package structure includes a substrate, a chip stack, a heat dissipation layer, and a molding layer. The chip stack is disposed on the substrate, the heat dissipation layer is disposed on the chip stack, and the molding layer is disposed on the substrate and covers the chip stack. The molding layer is in contact with the heat dissipation layer, the molding layer and the heat dissipation layer are coplanar, and the thermal conductivity coefficient of the plastic encapsulating layer is less than the thermal conductivity coefficient of the heat dissipation layer.

Abstract: Provided are films made from polymer blends including post-consumer resin (PCR). The films are formed from a polymer blend that includes a PCR, a low density polyethylene and/or ethylene/carbon monoxide copolymer (ECO copolymer), and a modification agent. The films, which include a PCR, contribute to improved sustainability and in aspects maintain or minimize the reduction of desirable properties, such as elastic recovery.

Abstract: Embodiments of an extruder comprise an extruder housing having an internal wall and a single screw coaxially disposed within the extruder housing, the single screw comprising a shank, wherein the shank and/or a region of the internal wall proximate the shank comprises helical channels. The extruder further comprises a feed channel downstream of the shank, and a visco-seal comprising the helical channels and the annular gap between the shank and the internal wall, wherein the annular gap is variable across its length.

Abstract: A semiconductor package assembly and manufacturing method are provided. The assembly includes: a base plate having a first surface; a chip stacking structure located on the base plate, the chip stacking structure including multiple chips sequently stacked in a direction perpendicular to the base plate and being electrically connected to the first surface; an interposer located on the chip stacking structure and having a first interconnection surface, the first interconnection surface having first and second interconnection regions, and the first interconnection region being electrically connected to the base plate; and a molding compound sealing the chip stacking structure, interposer and first surface. The first interconnection region is not sealed by the molding compound and the second interconnection region is sealed by the compound. There is a preset height between a top surface of the molding compound on the second interconnection region and the first interconnection region.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes: a first package structure, including an intermediary layer and a molding compound, where a plurality of first connection pads are disposed on the intermediary layer, and the molding compound wraps the intermediary layer and is coplanar to the plurality of first connection pads; and a second package structure, disposed on the intermediary layer and electrically connected to the plurality of first connection pads. A gap is formed between the first package structure and the second package structure.

Abstract: Embodiments of a grafted polyethylene comprise a reaction product of a polyethylene having a melt index (at 190° C., 2.16 kg) of at least 0.75 g/10 min, from 0.5 wt. % to 10 wt. % of metal acrylate or metal methacrylate at least partially grafted on the polyethylene, and from 0.1 wt. % to 10 wt. % of one or more metal carboxylates, wherein the metal carboxylate does not have any terminal unsaturation.

Abstract: Implementations of the subject technology described herein provide for spatial modeling of enclosed environments for guiding charging beams wirelessly to portable electronic devices within the enclosed environment. For example, a mapping sensor, such as an ultra-wideband (UWB) sensor may be used to generate a spatial model of the enclosed space and/or to determine the location of one or more occupants within the enclosed space. The charging beams can be guided based on the spatial model to avoid objects and/or occupants within the enclosed space that would otherwise block the wireless charging beam.

Abstract: Implementations of the subject technology provide for spatial mapping of enclosed environments for control of acoustic components. For example, a mapping sensor, such as an ultra-wideband (UWB) sensor may be used to generate a spatial map of an enclosed space defined by an enclosure. The mapping sensor may also be used to determine a location of an occupant within the enclosed space. One or more acoustic components, such as a microphone and/or a speaker, may be operated based on the spatial map and the location of the occupant.

Abstract: A semiconductor package assembly and manufacturing method are provided. The assembly includes: a base plate having a first surface; a chip stacking structure located on the base plate, the chip stacking structure including multiple chips sequently stacked in a direction perpendicular to the base plate and being electrically connected to the first surface; an interposer located on the chip stacking structure and having a first interconnection surface, the first interconnection surface having first and second interconnection regions, and the first interconnection region being electrically connected to the base plate; and a molding compound sealing the chip stacking structure, interposer and first surface. The first interconnection region is not sealed by the molding compound and the second interconnection region is sealed by the compound. There is a preset height between a top surface of the molding compound on the second interconnection region and the first interconnection region.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes: a first package structure, including an intermediary layer and a molding compound, where a plurality of first connection pads are disposed on the intermediary layer, and the molding compound wraps the intermediary layer and is coplanar to the plurality of first connection pads; and a second package structure, disposed on the intermediary layer and electrically connected to the plurality of first connection pads. A gap is formed between the first package structure and the second package structure.

Abstract: A semiconductor package structure includes: a first base plate provided with a first surface; a first chip stack body located on the first base plate, where the first chip stack body includes a plurality of first semiconductor chips successively stacked onto one another in a direction perpendicular to the first base plate, and is electrically connected to the first surface of the first base plate; an interposer layer located on the chip stack body and provided with a first interconnection surface, where the first interconnection surface is provided with a first interconnection region electrically connected to the first base plate and a second interconnection region; and a molding layer configured to seal the first chip stack body, the interposer layer and the first surface of the first base plate. The first interconnection region is unsealed by the molding layer, and the second interconnection region is sealed by the molding layer.

Abstract: Provided are films made from polymer blends including post-consumer resin (PCR). The films are formed from a polymer blend that includes a PCR, a low density polyethylene and/or ethylene/carbon monoxide copolymer (ECO copolymer), and a modification agent. The films, which include a PCR, contribute to improved sustainability and in aspects maintain or minimize the reduction of desirable properties, such as elastic recovery.

Abstract: A semiconductor package assembly and a manufacturing method are provided. The semiconductor package assembly includes: a base plate having a first surface; a first chip structure located on the base plate and electrically connected to the first surface of the base plate; an intermediary layer having a first interconnection surface; and a molding compound. The first interconnection surface has a first and second interconnection regions. A first solder ball is formed on the first interconnection region. A first pad is formed on the second interconnection region. The intermediary layer is electrically connected to the first surface by means of the first pad. The molding compound seals the first chip structure, the intermediary layer and the first surface. The first solder ball has a surface exposed from the molding compound. There is a preset height between the exposed surface of the first solder ball and the first interconnection surface.

Abstract: A semiconductor package includes a first base plate, first semiconductor structure, second base plate and filling layer. The first base plate has a first surface including first and second signal transmission regions. The first semiconductor structure located on the first surface is electrically connected to the first signal transmission region. The second base plate located on the first base plate includes a base and a first interconnection surface. The first interconnection surface is away from the first surface. The first interconnection surface has first and second interconnection regions communicated with each other. The first interconnection region is electrically connected to the second signal transmission region. The filling layer seals the first semiconductor structure, second base plate and first surface. The first interconnection region is not sealed, and the second interconnection region is. There is a preset height between a top surface of the filling layer and the first interconnection region.

Abstract: A magnetic resonance imaging apparatus according to an embodiment includes a display, an input interface, and processing circuitry. The display displays at least a locator image and a reference image. The input interface sets a region of interest on the locator image displayed on the display. The processing circuitry scans a subject to obtain three dimensional data, generates a locator image from the three dimensional data and displaying the locator image on the display, generates a reference image corresponding to the location of the region of interest from the three dimensional data and displaying the reference image on the display, and makes, when a size or position of the region of interest on one of the locator image and the reference image is changed by the input interface, adjustments to correspondingly change the display magnification or position of the other one of the locator image and the reference image.

Abstract: Method for recycling scrap that contains one or more heat resistant fibers and from 25 to 60 wt. %, based on the total weight of the scrap, of an at least partially uncured to fully uncured two component thermosetting resin mixture of (i) one or more thermosetting resins, and (ii) a solid hardener, the methods comprising shredding the scrap to an average size of from 3 to 50 mm, mixing the shredded scrap, preferably after preheating the scrap, to provide a fluid material charge and then compression molding the fluid material charge to make a cured composite material.

Abstract: A magnetic resonance imaging apparatus according to an embodiment includes a display, an input interface, and processing circuitry. The display displays at least a locator image and a reference image. The input interface sets a region of interest on the locator image displayed on the display. The processing circuitry scans a subject to obtain three dimensional data, generates a locator image from the three dimensional data and displaying the locator image on the display, generates a reference image corresponding to the location of the region of interest and displaying the reference image on the display, and makes, when a size or position of the region of interest on one of the locator image and the reference image is changed by the input interface, adjustments to correspondingly change the display magnification or position of the other one of the locator image and the reference image.

Abstract: Method for recycling scrap that contains one or more heat resistant fibers and from 25 to 60 wt. %, based on the total weight of the scrap, of an at least partially uncured to fully uncured two component thermosetting resin mixture of (i) one or more thermosetting resins, and (ii) a solid hardener, the methods comprising shredding the scrap to an average size of from 3 to 50 mm, mixing the shredded scrap, preferably after preheating the scrap, to provide a fluid material charge and then compression molding the fluid material charge to make a cured composite material.

Abstract: The present disclosure provides a suction apparatus comprising: a vacuum pump; a suction pipe connected to the vacuum pump at one end; a pressure detecting device disposed on the suction pipe and configured to detect a pressure value within the suction pipe; a controller with a first threshold that receives the pressure value detected by the pressure detecting device and controls the vacuum pump according to a result obtained by comparing the pressure value with the first threshold; and a housing within which the vacuum pump, the controller and the pressure detecting device are located. The first threshold may be set up according to the size of the display panel so that the suction apparatus is adaptable for gravity Mura reliability detections of display panels having different sizes and types.

Abstract: A magnetic resonance imaging apparatus according to an embodiment includes a display, an input interface, and processing circuitry. The display displays at least a locator image and a reference image. The input interface sets a region of interest on the locator image displayed on the display. The processing circuitry scans a subject to obtain three dimensional data, generates a locator image from the three dimensional data and displaying the locator image on the display, generates a reference image corresponding to the location of the region of interest from the three dimensional data and displaying the reference image on the display, and makes, when a size or position of the region of interest on one of the locator image and the reference image is changed by the input interface, adjustments to correspondingly change the display magnification or position of the other one of the locator image and the reference image.